公开(公告)号：US08405283B2

公开(公告)日：2013-03-26

申请号：US13534623

申请日：2012-06-27

申请人： Makoto Furuhata ,  Takashi Yamazaki ,  Yuji Hamayama

发明人： Makoto Furuhata ,  Takashi Yamazaki ,  Yuji Hamayama

IPC分类号： H01L41/04

CPC分类号： H03H9/215 ,  H03H9/02102 ,  H03H9/02133

摘要： A flexural vibration piece includes a flexural vibrator that has a first region on which a compressive stress or a tensile stress acts due to vibration and a second region having a relationship in which a tensile stress acts thereon when a compressive stress acts on the first region and a compressive stress acts thereon when a tensile stress acts on the first region, and performs flexural vibration in a first plane. The flexural vibration piece also includes a heat conduction path, in the vicinity of the first region and the second region, that is formed of a material having a thermal conductivity higher than that of the flexural vibrator and thermally connects between the first region and the second region.

摘要翻译： 弯曲振动片包括弯曲振动器，其具有由于振动而产生压缩应力或拉伸应力的第一区域和当压缩应力作用在第一区域上时拉伸应力作用于其上的第二区域， 当拉伸应力作用在第一区域上时，施加压缩应力，并且在第一平面中进行弯曲振动。 弯曲振动片还包括在第一区域和第二区域附近的导热路径，该热传导路径由导热率高于弯曲振动器的导热率的材料形成，并且在第一区域和第二区域之间热连接 地区。

公开(公告)号：US20130043386A1

公开(公告)日：2013-02-21

申请号：US13537940

申请日：2012-06-29

申请人： Takashi YAMAZAKI

发明人： Takashi YAMAZAKI

IPC分类号： H01J37/28

CPC分类号： H01J37/28 ,  G01N23/04 ,  H01J2237/221 ,  H01J2237/2802

摘要： The method disclosed in this specification includes: acquiring a dark-field image produced by capturing an image of a sample with a scanning transmission electron microscope by detecting electrons scattered at angles between a first angle to the optical axis of the scanning transmission electron microscope and a second angle which is larger than the first angle; acquiring a bright-field image captured simultaneously with the dark-field image by detecting electrons scattered within a third angle which is smaller than the first angle; generating a reverse image by reversing lightness and darkness of the dark-field image; and generating a difference image each of whose pixels has a brightness value equal to the difference between the brightness of the corresponding pixel in the reverse image and the brightness of the corresponding pixel in the bright-field image.

摘要翻译： 本说明书中公开的方法包括：通过检测以与扫描透射电子显微镜的光轴成一定角度的角度散射的电子，以扫描透射型电子显微镜和 大于第一角度的第二角度; 通过检测在小于第一角度的第三角度内散射的电子来获取与暗场图像同时捕获的亮场图像; 通过反转暗场图像的亮度和黑暗来产生反转图像; 并且生成每个像素具有与反向图像中的相应像素的亮度和亮视场图像中的相应像素的亮度之间的差值相等的亮度值的差分图像。

公开(公告)号：US08288926B2

公开(公告)日：2012-10-16

申请号：US13331602

申请日：2011-12-20

申请人： Makoto Furuhata ,  Takashi Yamazaki

发明人： Makoto Furuhata ,  Takashi Yamazaki

IPC分类号： H03H9/19

CPC分类号： H03H9/215 ,  H03H9/0547 ,  H03H9/1021

摘要： A resonator having a base part; and a resonating arm that performs flexing vibration, the resonating arm part has two principal surfaces, a first groove provided on the one principal surface, a second groove provided in juxtaposition with the first groove on the other principal surface, a third groove provided in juxtaposition with the first groove and provided nearer the base part side than the first groove on the other principal surface, and a fourth groove provided in juxtaposition with the second groove and provided nearer the base part side than the second groove on the principal surface. The sum of a depth of the first and second groove part and a sum of a depth of the third and fourth groove part are larger than a distance between the one principal surface and the other principal surface.

摘要翻译： 具有基部的谐振器; 和谐振臂，其进行弯曲振动，所述谐振臂部分具有两个主表面，设置在所述一个主表面上的第一凹槽，设置成在所述另一个主表面上与所述第一凹槽并置设置的第二凹槽，并置设置的第三凹槽 与第一槽相比设置在比另一主表面上的第一槽更靠近基部侧的第四槽和与第二槽并列设置的第四槽，并且设置在基体部分侧比主表面上的第二槽更靠近基部侧。 第一槽部分和第二槽部分的深度之和和第三和第四槽部分的深度之和大于一个主表面和另一个主表面之间的距离。

公开(公告)号：US20120212109A1

公开(公告)日：2012-08-23

申请号：US13460277

申请日：2012-04-30

申请人： Takashi YAMAZAKI ,  Tsukasa Funasaka ,  Takeo Funakawa ,  Makoto Furuhata

发明人： Takashi YAMAZAKI ,  Tsukasa Funasaka ,  Takeo Funakawa ,  Makoto Furuhata

IPC分类号： H01L41/04

CPC分类号： H03H9/1021 ,  H03H3/04 ,  H03H9/21 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49155 ,  Y10T29/49574

摘要： A vibrating piece manufacturing method includes: (a) preparing a supporting body having first and second surfaces, the first and second surfaces defining a thickness while being directed toward opposite directions, the supporting body including a base and a plurality of arms, the arms extending side-by-side in a direction orthogonal to a direction of the thickness from the base, a lower electrode film being disposed on the first surface of each of the arms, a piezoelectric film being disposed on the lower electrode films, at least one upper electrode film being disposed on the piezoelectric film, at least a part of the second surface of each of the arms being an exposed area; and (b) etching the exposed area of the second surface so as to reduce the thickness to reduce flexural rigidity of the arms with respect to the thickness direction.

摘要翻译： 振动片制造方法包括：（a）制备具有第一和第二表面的支撑体，所述第一和第二表面在朝向相反方向限定厚度的同时，所述支撑体包括基部和多个臂，所述臂延伸 在与基板的厚度方向正交的方向上并排配置，下电极膜设置在各臂的第一面上，压电膜设置在下电极膜上，至少一个上 电极膜设置在压电膜上，每个臂的第二表面的至少一部分是暴露区域; 和（b）蚀刻第二表面的暴露区域以便减小厚度以降低臂相对于厚度方向的抗弯刚度。

公开(公告)号：US20120104267A1

公开(公告)日：2012-05-03

申请号：US13279144

申请日：2011-10-21

申请人： Kazumasa Matsumoto ,  Kanako Dowaki ,  Yuichi Naito ,  Hidehiko Saito ,  Hiroaki Niwa ,  Takashi Yamazaki ,  Shigeo Kobayashi

发明人： Kazumasa Matsumoto ,  Kanako Dowaki ,  Yuichi Naito ,  Hidehiko Saito ,  Hiroaki Niwa ,  Takashi Yamazaki ,  Shigeo Kobayashi

IPC分类号： G01T1/24

CPC分类号： H04N5/33 ,  H04N5/3559 ,  H04N5/363

摘要： An imaging apparatus including: a plurality of pixels including a photoelectric conversion element and a sample hold circuit; a plurality of signal lines configured to read from the plurality of pixels an electric signal held in the sample hold circuit therein; a imaging control unit configured to perform a first control for applying the held electric signal to the plurality of signal lines, and a second control for sequentially applying to the signal lines the electric signal obtained corresponding to light received by each of the plurality of pixels and reading the electric signal, after the first control has been performed; and a generation unit configured not to create image data based on the electric signal applied to the signal line by the first control but to create the image data based on the electric signal read via the signal line by the second control.

摘要翻译： 一种成像装置，包括：多个像素，包括光电转换元件和采样保持电路; 多个信号线，被配置为从所述多个像素读取保持在所述采样保持电路中的电信号; 成像控制单元，被配置为执行用于将所保持的电信号施加到所述多条信号线的第一控制;以及第二控制，用于顺序地向所述信号线施加与所述多个像素中的每一个所接收的光相对应地获得的电信号;以及 在执行第一次控制之后读取电信号; 以及生成单元，被配置为不基于通过第一控制施加到信号线的电信号来创建图像数据，而是基于通过第二控制经由信号线读取的电信号来创建图像数据。

公开(公告)号：US20120075507A1

公开(公告)日：2012-03-29

申请号：US13237362

申请日：2011-09-20

申请人： Takashi Yamazaki ,  Kazumasa Matsumoto ,  Hidehiko Saito ,  Kanako Dowaki

发明人： Takashi Yamazaki ,  Kazumasa Matsumoto ,  Hidehiko Saito ,  Kanako Dowaki

IPC分类号： H04N5/217

CPC分类号： H04N5/32 ,  H04N5/365 ,  H04N5/37457

摘要： A radiation imaging apparatus includes an imaging unit and an imaging control unit. The imaging control unit causes a switch unit, a accumulation unit, a removal unit, a holding unit, and an addition unit, which constitute a pixel circuit of the imaging unit, to operate at a timing before imaging operation by the imaging unit so as to fix unstable voltages of the accumulation unit, the removal unit, the holding unit, and the addition unit to a predetermined voltage of a power supply connected via a switch unit.

摘要翻译： 放射线摄像装置包括成像单元和成像控制单元。 成像控制单元使构成摄像单元的像素电路的开关单元，累积单元，去除单元，保持单元和加法单元在成像单元的成像操作之前的定时进行操作，以便 将积存单元，去除单元，保持单元和加法单元的不稳定电压固定为经由开关单元连接的电源的预定电压。

公开(公告)号：US20120034052A1

公开(公告)日：2012-02-09

申请号：US13275619

申请日：2011-10-18

申请人： Takashi YAMAZAKI ,  Hiroaki FUJIMORI ,  Naohisa MAEDA ,  Daisuke KIRIHARA ,  Satoshi NAKAMURA ,  Masami MAEDA

发明人： Takashi YAMAZAKI ,  Hiroaki FUJIMORI ,  Naohisa MAEDA ,  Daisuke KIRIHARA ,  Satoshi NAKAMURA ,  Masami MAEDA

IPC分类号： B25J9/00

CPC分类号： G01R31/2893 ,  G05B2219/37216 ,  G05B2219/40564 ,  G05B2219/45026

摘要： An apparatus includes: a retainer moving between a shuttle and a socket; a presser holding a component; an adjuster moving the presser; a socket mark near the socket; a hand mark near the socket mark when the retainer is at a component mounting position; a first camera photographing a first image including the component and hand mark; a second camera photographing a second image including the socket mark and socket, and a third image including the socket mark and hand mark; a first calculator obtaining a first relative position between the socket mark and socket from the second image; a second calculator obtaining a second relative position between the socket mark and hand mark from the third image; and a third calculator obtaining a third relative position between the hand mark and component from the first image. The adjuster corrects the component's position based on the relative positions.

摘要翻译： 一种装置包括：保持件在梭子和插座之间移动; 持有组件的压脚; 调节器移动压脚; 插座附近的插座标记; 当保持器处于部件安装位置时，在插座标记附近的手标记; 拍摄包括所述部件和手标记的第一图像的第一相机; 拍摄包括插座标记和插座的第二图像的第二相机以及包括插座标记和手标的第三图像; 第一计算器，从所述第二图像获得所述插座标记和所述插座之间的第一相对位置; 第二计算器，从所述第三图像获得所述插座标记与手标记之间的第二相对位置; 以及第三计算器，从所述第一图像获得所述手标和分量之间的第三相对位置。 调整器根据相对位置校正组件的位置。

公开(公告)号：US08102103B2

公开(公告)日：2012-01-24

申请号：US13083945

申请日：2011-04-11

申请人： Makoto Furuhata ,  Takashi Yamazaki

发明人： Makoto Furuhata ,  Takashi Yamazaki

IPC分类号： H03H9/19

CPC分类号： H03H9/215 ,  H03H9/0547 ,  H03H9/1021

摘要： A resonator having a base part; and a resonating arm that performs flexing vibration, the resonating arm part has two principal surfaces, a first groove provided on the one principal surface, a second groove provided in juxtaposition with the first groove on the other principal surface, a third groove provided in juxtaposition with the first groove and provided nearer the base part side than the first groove on the other principal surface, and a fourth groove provided in juxtaposition with the second groove and provided nearer the base part side than the second groove on the principal surface. The sum of a depth of the first and second groove part and a sum of a depth of the third and fourth groove part are larger than a distance between the one principal surface and the other principal surface.

摘要翻译： 具有基部的谐振器; 和谐振臂，其进行弯曲振动，所述谐振臂部分具有两个主表面，设置在所述一个主表面上的第一凹槽，设置成在所述另一个主表面上与所述第一凹槽并置设置的第二凹槽，并置设置的第三凹槽 与第一槽相比设置在比另一个主表面上的第一槽更靠近基部侧的第四槽以及与第二槽并列设置的第四槽，并且设置在与主表面上的第二槽相比更靠近基部侧。 第一槽部分和第二槽部分的深度之和和第三和第四槽部分的深度之和大于一个主表面和另一个主表面之间的距离。

公开(公告)号：US20110198969A1

公开(公告)日：2011-08-18

申请号：US13125000

申请日：2009-10-22

申请人： Makoto Furuhata ,  Takeo Funakawa ,  Takashi Yamazaki

发明人： Makoto Furuhata ,  Takeo Funakawa ,  Takashi Yamazaki

IPC分类号： H01L41/04 ,  H01L41/107

CPC分类号： H03H9/21 ,  H03H9/0547 ,  H03H9/1021 ,  H03H9/19 ,  H03H9/215

摘要： Deterioration of the Q value caused by the thermoelastic effect is suppressed. Since a first depth of a first groove and a second depth of a second groove are smaller than a distance between a surface including a third surface and a surface including a fourth surface, the first and second grooves do not penetrate between the surface including the third surface and the surface including the fourth surface. In addition, the sum of the first depth of the first groove and the second depth of the second groove is greater than the distance between the third and fourth surfaces, a heat transfer path between a first expandable portion (the first surface) and a second expandable portion (the second surface) cannot be formed as a straight line. As such, the heat transfer path between the first expandable portion (the first surface) and a second expandable portion (the second surface) is made to detour to the first and second grooves and and thus be lengthened.

摘要翻译： 抑制由热弹性效应引起的Q值的劣化。 由于第一凹槽的第一深度和第二凹槽的第二深度小于包括第三表面的表面和包括第四表面的表面之间的距离，所以第一和第二凹槽不会穿过包括第三凹槽 表面和包括第四表面的表面。 此外，第一凹槽的第一深度和第二凹槽的第二深度之和大于第三和第四表面之间的距离，第一可膨胀部分（第一表面）和第二凹槽之间的传热路径 可膨胀部分（第二表面）不能形成为直线。 因此，使第一可膨胀部分（第一表面）和第二可膨胀部分（第二表面）之间的传热路径绕第一和第二槽弯曲并因此被延长。

公开(公告)号：US20070242535A1

公开(公告)日：2007-10-18

申请号：US11714867

申请日：2007-03-07

申请人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

发明人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

IPC分类号： G11C7/10

CPC分类号： H01L24/06 ,  G11C5/025 ,  G11C5/04 ,  G11C5/063 ,  G11C11/406 ,  G11C29/06 ,  G11C29/12005 ,  G11C29/12015 ,  G11C29/24 ,  G11C29/34 ,  G11C29/50 ,  G11C29/50012 ,  G11C29/70 ,  G11C29/80 ,  G11C29/804 ,  G11C29/832 ,  G11C29/844 ,  G11C2029/2602 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/10897 ,  H01L27/11898 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01054 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor memory device formed on a semiconductor chip includes first memory arrays, a plurality of second memory arrays, a first voltage generator, and first bonding pads. The semiconductor chip is divided into first, second and third rectangle regions and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The first memory arrays are formed in the first rectangle region. The second memory arrays are formed in the second rectangle region. The voltage generator and first bonding pads are arranged in the third rectangle region. The first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the second memory arrays.

摘要翻译： 形成在半导体芯片上的半导体存储器件包括第一存储器阵列，多个第二存储器阵列，第一电压发生器和第一焊盘。 半导体芯片被分为第一，第二和第三矩形区域，第三矩形区域布置在第一矩形区域和第二矩形区域之间。 第一存储器阵列形成在第一矩形区域中。 第二存储器阵列形成在第二矩形区域中。 电压发生器和第一接合焊盘布置在第三矩形区域中。 第一接合焊盘布置在第一矩形区域和电压发生器之间，并且在电压发生器和第二存储器阵列之间没有布置接合焊盘。