公开(公告)号：US08481368B2

公开(公告)日：2013-07-09

申请号：US13092059

申请日：2011-04-21

申请人： Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu

发明人： Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu

IPC分类号： H01L21/44

CPC分类号： H01L24/49 ,  H01L23/3107 ,  H01L23/492 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/13099 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/32506 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73153 ,  H01L2224/73255 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/83801 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/84 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： The invention relates to a semiconductor package of a flip chip and a method for making the semiconductor package. The semiconductor chip comprises a metal-oxide-semiconductor field effect transistor. On a die paddle including a first base, a second base and a third base, half-etching or punching is performed on the top surfaces of the first base and the second base to obtain plurality of grooves that divide the top surface of the first base into a plurality of areas comprising multiple first connecting areas, and divide the top surface of the second base into a plurality of areas comprising at least a second connecting area. The semiconductor chip is connected to the die paddle at the first connecting areas and the second connecting area.

摘要翻译： 本发明涉及倒装芯片的半导体封装以及制造半导体封装的方法。 半导体芯片包括金属氧化物半导体场效应晶体管。 在包括第一基底，第二基底和第三基底的裸片上，在第一基底和第二基底的顶表面上进行半蚀刻或冲孔，以获得多个凹槽，该凹槽将第一基底 进入包括多个第一连接区域的多个区域，并且将第二基座的顶表面分成包括至少第二连接区域的多个区域。 半导体芯片在第一连接区域和第二连接区域处连接到管芯焊盘。

公开(公告)号：US20130006927A1

公开(公告)日：2013-01-03

申请号：US13615138

申请日：2012-09-13

申请人： Brian Brockway ,  Parag Gokhale ,  Jun Lu

发明人： Brian Brockway ,  Parag Gokhale ,  Jun Lu

IPC分类号： G06F17/30

CPC分类号： G06F17/30309 ,  G06F7/00 ,  G06F11/14 ,  G06F11/1448 ,  G11C2029/0409 ,  Y10S707/99955

摘要： A system and method are provided for verifying data copies and reverifying the copies over the life span of media according to a verification policy. Characteristics of media and use of media are tracked to provide metrics which may be used to dynamically reevaluate and reassign verification policies to optimize media usage. Copies that fail verification operations may be repaired by repeating a storage operation for recent copies or by substituting a close temporal copy of the failed copy.

摘要翻译： 提供了一种系统和方法，用于根据验证策略验证数据副本并在媒体的使用寿命内重新验证副本。 跟踪媒体的特点和媒体的使用情况，提供可用于动态重新评估和重新分配验证策略以优化媒体使用情况的指标。 可以通过对最近的副本重复存储操作或通过替换失败副本的紧密暂时副本来修复失败验证操作的副本。

公开(公告)号：US20120255409A1

公开(公告)日：2012-10-11

申请号：US13518023

申请日：2010-12-23

申请人： Aimin Deng ,  Hui Ding ,  Jun Lu ,  Jianrong Xie

发明人： Aimin Deng ,  Hui Ding ,  Jun Lu ,  Jianrong Xie

IPC分类号： C25C7/08

CPC分类号： C25C7/08 ,  Y10T83/2185 ,  Y10T83/2187 ,  Y10T83/219

摘要： An apparatus for stripping metal sheets from a cathode blank comprises: a frame; a stripping assembly disposed on the frame; and a receiving mechanism comprising at least one receiving platform which is disposed on the frame for receiving the deposited metal sheets. The stripping assembly comprises: at least one clipping mechanism for clipping a conductive member on an upper end of the cathode blank; first and second stripping mechanisms for stripping the deposited metal sheets from two surfaces of the cathode blank; a bottom positioning mechanism for positioning a lower end of the cathode blank; and first and second loosening mechanisms each comprising a push rod which is movably disposed on the frame in the transversal direction for pushing the cathode blank.

摘要翻译： 用于从阴极坯料剥离金属片的设备包括：框架; 设置在框架上的剥离组件; 以及接收机构，其包括至少一个接收平台，所述接收平台设置在所述框架上用于接收沉积的金属片。 剥离组件包括：至少一个夹持机构，用于夹住阴极坯料的上端上的导电构件; 用于从阴极坯料的两个表面剥离沉积的金属片的第一和第二剥离机构; 用于定位阴极毛坯的下端的底部定位机构; 以及第一和第二松动机构，每个包括推杆，该推杆在横向上可移动地设置在框架上以推动阴极坯料。

公开(公告)号：US08217503B2

公开(公告)日：2012-07-10

申请号：US12881372

申请日：2010-09-14

申请人： Yueh-Se Ho ,  Yan Xun Xue ,  Jun Lu

发明人： Yueh-Se Ho ,  Yan Xun Xue ,  Jun Lu

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L24/49 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/4103 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/84

摘要： A package structure for DC-DC converter disclosed herein can reduce the number of encapsulated elements as a low-side MOSFET chip can be stacked above the high-side MOSFET chip of a first die pad, through die pads of different thicknesses or interposers with joint parts of different thicknesses; moreover, it further reduces the size of the entire semiconductor package as a number of bond wires are contained in the space between the controller and the low-side MOSFET chip. Moreover, electrical connection between the top source electrode pin and the bottom source electrode pin of the low-side MOSFET chip is realized with a metal joint plate, such that when the DC-DC converter is sealed with plastic, the metal joint plate can be exposed outside to improve the thermal performance and effectively reduce the thickness of the semiconductor package.

摘要翻译： 本文公开的用于DC-DC转换器的封装结构可以减少封装元件的数量，因为低侧MOSFET芯片可以堆叠在第一裸片焊盘的高侧MOSFET芯片上方，通过具有不同厚度的芯片焊盘或具有接头的插入件 不同厚度的零件; 而且，由于控制器和低侧MOSFET芯片之间的空间中包含多个接合线，因此进一步减小了整个半导体封装的尺寸。 此外，利用金属接合板实现了顶部源极电极引脚和低端MOSFET芯片的底部源极电极引脚之间的电连接，使得当DC-DC转换器用塑料密封时，金属接合板可以 暴露在外面以改善热性能并有效地减小半导体封装的厚度。

公开(公告)号：US20120161304A1

公开(公告)日：2012-06-28

申请号：US13411990

申请日：2012-03-05

申请人： Kai Liu ,  Lei Shi ,  Jun Lu ,  Anup Bhalla

发明人： Kai Liu ,  Lei Shi ,  Jun Lu ,  Anup Bhalla

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49589 ,  H01L24/29 ,  H01L24/32 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/24247 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/92246 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A dual-leadframe multi-chip package comprises a first leadframe with a first die pad, and a second leadframe with a second die pad; a first chip mounted on the first die pad functioning as a high-side MOSFET and second chip mounted on the second die pad functioning as a low-side MOSFET. The package may further comprises a bypass capacity configured as a third chip mounted on the first die pad or integrated with the first chip. The package may further comprise a three-dimensional connecting plate formed as an integrated structure as the second die pad for electrically connecting a top contact area of the first chip to a bottom contact area of the second chip. A top connecting plate connects a top contact area of the second chip and a top contact area of the third chip to an outer pin of the first leadframe.

摘要翻译： 双引线框多芯片封装包括具有第一管芯焊盘的第一引线框架和具有第二管芯焊盘的第二引线框架; 安装在用作高边MOSFET的第一芯片焊盘上的第一芯片和安装在用作低端MOSFET的第二芯片焊盘上的第二芯片。 封装还可以包括配置为安装在第一裸片焊盘上或与第一芯片集成的第三芯片的旁路容量。 封装还可以包括形成为一体结构的三维连接板作为第二芯片焊盘，用于将第一芯片的顶部接触区域电连接到第二芯片的底部接触区域。 顶部连接板将第二芯片的顶部接触区域和第三芯片的顶部接触区域连接到第一引线框架的外部引脚。

公开(公告)号：US20120131052A1

公开(公告)日：2012-05-24

申请号：US13343034

申请日：2012-01-04

申请人： Rajiv Kottomtharayil ,  Parag Gokhale ,  Jun Lu

发明人： Rajiv Kottomtharayil ,  Parag Gokhale ,  Jun Lu

IPC分类号： G06F17/30

CPC分类号： G06F17/30094 ,  G06F11/1448 ,  G06F11/1453 ,  Y10S707/99934 ,  Y10S707/99955

摘要： A method in a computer system for retrieving data from one of multiple copies of the data is provided, referred to as the data management system. The data management system receives a request identifying data object to be accessed. Then, the data management system queries a metabase to locate data copies that contain the identified data object, wherein the data copies are created from similar source data, and wherein for each data copy the metabase contains an indication of the availability of the copy relative to other copies. Next, the data management system determines one of the located data copies to use to access the identified data object, wherein the determination is made based on the indicated availability contained in the metabase for each of the located data copies. Then, the data management system accesses the identified data object using the determined one of the located data copies.

摘要翻译： 提供了一种用于从数据的多个副本之一检索数据的计算机系统中的方法，称为数据管理系统。 数据管理系统接收要访问的数据对象的请求。 然后，数据管理系统查询元数据库以定位包含所识别的数据对象的数据副本，其中从相似的源数据创建数据副本，并且其中对于每个数据拷贝，元数据库包含相对于 其他副本。 接下来，数据管理系统确定用于访问所识别的数据对象的所定位的数据副本之一，其中基于针对每个所定位的数据副本的元数据库中包含的指示的可用性进行确定。 然后，数据管理系统使用所确定的一个定位的数据副本来访问所识别的数据对象。

公开(公告)号：US20120061813A1

公开(公告)日：2012-03-15

申请号：US12881372

申请日：2010-09-14

申请人： Yueh-Se Ho ,  Yan Xun Xue ,  Jun Lu

发明人： Yueh-Se Ho ,  Yan Xun Xue ,  Jun Lu

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/49 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/4103 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/84

摘要： A package structure for DC-DC converter disclosed herein can reduce the number of encapsulated elements as a low-side MOSFET chip can be stacked above the high-side MOSFET chip of a first die pad, through die pads of different thicknesses or interposers with joint parts of different thicknesses; moreover, it further reduces the size of the entire semiconductor package as a number of bond wires are contained in the space between the controller and the low-side MOSFET chip. Moreover, electrical connection between the top source electrode pin and the bottom source electrode pin of the low-side MOSFET chip is realized with a metal joint plate, such that when the DC-DC converter is sealed with plastic, the metal joint plate can be exposed outside to improve the thermal performance and effectively reduce the thickness of the semiconductor package.

摘要翻译： 本文公开的用于DC-DC转换器的封装结构可以减少封装元件的数量，因为低侧MOSFET芯片可以堆叠在第一裸片焊盘的高侧MOSFET芯片上方，通过具有不同厚度的芯片焊盘或具有接头的插入件 不同厚度的零件; 而且，由于控制器和低侧MOSFET芯片之间的空间中包含多个接合线，因此进一步减小了整个半导体封装的尺寸。 此外，利用金属接合板实现了顶部源极电极引脚和低端MOSFET芯片的底部源极电极引脚之间的电连接，使得当DC-DC转换器用塑料密封时，金属接合板可以 暴露在外面以改善热性能并有效地减小半导体封装的厚度。

公开(公告)号：US08099428B2

公开(公告)日：2012-01-17

申请号：US13074157

申请日：2011-03-29

申请人： Rajiv Kottomtharayil ,  Parag Gokhale ,  Jun Lu

发明人： Rajiv Kottomtharayil ,  Parag Gokhale ,  Jun Lu

IPC分类号： G06F17/30

CPC分类号： G06F17/30094 ,  G06F11/1448 ,  G06F11/1453 ,  Y10S707/99934 ,  Y10S707/99955

摘要： A method in a computer system for retrieving data from one of multiple copies of the data is provided, referred to as the data management system. The data management system receives a request identifying at least one data object to be accessed. Then, the data management system queries a metabase to locate data copies that contain the identified at least one data object, wherein the data copies are created from similar source data, and wherein for each data copy the metabase contains an indication of the availability of the copy relative to other copies. Next, the data management system determines one of the located data copies to use to access the identified at least one data object, wherein the determination is made based on the indicated availability contained in the metabase for each of the located data copies. Then, the data management system accesses the identified at least one data object using the determined one of the located data copies.

摘要翻译： 提供了一种用于从数据的多个副本之一检索数据的计算机系统中的方法，称为数据管理系统。 数据管理系统接收标识至少一个待访问的数据对象的请求。 然后，数据管理系统查询元数据库以定位包含所识别的至少一个数据对象的数据副本，其中数据副本是从类似的源数据创建的，并且其中对于每个数据拷贝，元数据库包含有关 复制相对于其他副本。 接下来，数据管理系统确定要用于访问所识别的至少一个数据对象的位置数据副本之一，其中基于针对每个位置数据副本的元数据库中包含的指示的可用性进行确定。 然后，数据管理系统使用所确定的一个定位的数据副本来访问所识别的至少一个数据对象。

公开(公告)号：US08058961B2

公开(公告)日：2011-11-15

申请号：US13021347

申请日：2011-02-04

申请人： François Hébert ,  Tao Feng ,  Xiaotian Zhang ,  Jun Lu

发明人： François Hébert ,  Tao Feng ,  Xiaotian Zhang ,  Jun Lu

IPC分类号： H01F5/00

CPC分类号： H01F17/062

摘要： A lead frame-based discrete power inductor is disclosed. The power inductor includes top and bottom lead frames, the leads of which form a coil around a single closed-loop magnetic core. The coil includes interconnections between inner and outer contact sections of the top and bottom lead frames, the magnetic core being sandwiched between the top and bottom lead frames. Ones of the leads of the top and bottom lead frames have a generally non-linear, stepped configuration such that the leads of the top lead frame couple adjacent leads of the bottom lead frame about the magnetic core to form the coil.

摘要翻译： 公开了一种基于引线框架的分立功率电感器。 功率电感器包括顶部和底部引线框架，其引线围绕单个闭环磁芯形成线圈。 线圈包括顶部和底部引线框架的内部和外部接触部分之间的互连，磁芯夹在顶部和底部引线框架之间。 顶部引线框架和底部引线框架的引线的一部分具有大致非线性的阶梯状构造，使得顶部引线框架的引线将底部引线框架的相邻引线围绕磁芯耦合以形成线圈。

公开(公告)号：US20110257854A1

公开(公告)日：2011-10-20

申请号：US12763532

申请日：2010-04-20

申请人： Christopher E. Whitney ,  Robert C. Simon, JR. ,  William L. Aldrich, III ,  Jun Lu ,  Birendra P. Bhattarai ,  Adam J. Heisel ,  Ning Jin

发明人： Christopher E. Whitney ,  Robert C. Simon, JR. ,  William L. Aldrich, III ,  Jun Lu ,  Birendra P. Bhattarai ,  Adam J. Heisel ,  Ning Jin

IPC分类号： G06F19/00

CPC分类号： F02D29/02 ,  B60K6/48 ,  B60W30/1884 ,  B60W50/0097 ,  B60W50/087 ,  B60W2050/0091 ,  B60W2510/0233 ,  B60W2510/0638 ,  B60W2540/10 ,  B60W2710/0622 ,  F02D41/1497 ,  Y02T10/6221

摘要： A minimum torque module selectively determines a first minimum propulsion torque based on second and third minimum propulsion torques when a torque converter clutch is in unlocked and locked states, respectively. A zero pedal torque module selectively sets a zero pedal torque equal to the first minimum propulsion torque. A pedal request module determines a pedal torque request based on an accelerator pedal position, a vehicle speed, and the zero pedal torque. A driver request module determines a driver axle torque request based on the pedal torque request. A shaping module selectively shapes the driver axle torque request into a shaped driver axle torque request. A conversion module converts the first minimum propulsion torque into a minimum axle torque. A final driver request module sets a final driver axle torque request equal to a greater of the shaped driver axle torque request and the minimum axle torque.

摘要翻译： 当变矩器离合器分别处于解锁和锁定状态时，最小扭矩模块基于第二和第三最小推进力矩选择性地确定第一最小推进力矩。 零踏板扭矩模块选择性地设定等于第一最小推进力矩的零踏板扭矩。 踏板请求模块基于加速器踏板位置，车速和零踏板扭矩确定踏板扭矩请求。 驱动器请求模块基于踏板扭矩请求确定驱动器轴转矩请求。 成形模块将驱动器轴扭矩请求选择性地变形成成形的驱动器轴扭矩请求。 转换模块将第一最小推进转矩转换成最小轴转矩。 最终驾驶员请求模块设置最终驾驶员轴扭矩请求等于成形驱动器轴扭矩请求和最小轴转矩的较大值。