公开(公告)号：USD506732S1

公开(公告)日：2005-06-28

申请号：US29207970

申请日：2004-06-23

申请人： Bily Wang ,  Jonnie Chuang ,  Hui Yen Huang

设计人： Bily Wang ,  Jonnie Chuang ,  Hui Yen Huang

公开(公告)号：US20050093010A1

公开(公告)日：2005-05-05

申请号：US10697610

申请日：2003-10-31

申请人： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

发明人： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L29/22 ,  H01L33/00

CPC分类号： H01L24/97 ,  H01L23/49562 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Stacked metal sections serve as two leads of an IC package. In one embodiment, an IC chip is mounted on one section serving as the terminal for the bottom electrode of the chip, and the top electrode of the chip is wire-bonded to the other section serving as another terminal for the chip. The thin sheet metal permits narrower etched separation between the two metal sections. Stacking of two pre-etched thin sheet metals strengthens the substrate. The package is covered with glue to hold the two sections together. The stacked pre-etched metal sheets can serve as a common substrate for a matrix of IC packages, which can later be cut in two orthogonal directions to yield individual packages.

摘要翻译： 堆叠金属部分作为IC封装的两个引线。 在一个实施例中，将IC芯片安装在用作芯片的底部电极的端子的一个部分上，并且芯片的顶部电极引线接合到用作芯片的另一个端子的另一个部分。 薄金属板允许两个金属部分之间的较窄的蚀刻间隔。 两个预蚀刻的薄金属板的堆叠加强了基板。 包装用胶水覆盖，将两个部分保持在一起。 堆叠的预蚀刻金属片可以用作IC封装的矩阵的公共衬底，其可以随后在两个正交方向上被切割以产生单独的封装。

公开(公告)号：US06784458B1

公开(公告)日：2004-08-31

申请号：US10412764

申请日：2003-04-14

申请人： Bily Wang ,  Jonnie Chuang

发明人： Bily Wang ,  Jonnie Chuang

IPC分类号： H01L2715

CPC分类号： G09F9/33 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/0289 ,  H01L2924/00

摘要： An array of light emitting diodes (LED) are laid out as a dot matrix array as a display panel. Each LED is accessed by two dimensional addressing from a first set of parallel horizontal interconnections and a second set of orthogonal interconnections. The two sets of orthogonal interconnections are printed on two sides of a substrate. One of the two electrodes of an LED, which mounted on the top of the substrate, is fed through the substrate with a via hole and connected to the orthogonal interconnection at the bottom of the substrate. The size of the display panel is configurable by removing certain rows and/or columns. More than one partitioned blocks can be pieced together by aligning and coupling the corresponding orthogonal interconnections through a motherboard.

摘要翻译： 一组发光二极管（LED）作为点阵阵列布置为显示面板。 每个LED通过来自第一组并行水平互连和第二组正交互连的二维寻址来访问。 两组正交互连印刷在基板的两侧。 安装在基板顶部的LED的两个电极中的一个通过基板通过基板通孔并连接到基板底部的正交互连。 通过删除某些行和/或列可以配置显示面板的大小。 通过对准和耦合相应的正交互连通过母板，可以将多于一个的分区块拼接在一起。

公开(公告)号：US08873920B2

公开(公告)日：2014-10-28

申请号：US13425829

申请日：2012-03-21

申请人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Cheng-Chin Chiu

发明人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Cheng-Chin Chiu

IPC分类号： G02B6/00

CPC分类号： G02B6/4298 ,  G01J2001/4252 ,  G01R31/2635 ,  G02B6/3616 ,  G02B6/3644

摘要： A light-guiding cover structure includes a top cover unit and a light-guiding unit. The top cover unit has a plurality of receiving spaces formed therein. The light-guiding unit includes a plurality of light-guiding groups, wherein each light-guiding group includes a plurality of optical fiber cables received in the corresponding receiving space, and each optical fiber cable has two opposite ends exposed from the bottom surface of the top cover unit and respectively facing at least one light-emitting device and at least one light-sensing device that have been disposed under the top cover unit. Therefore, the optical fiber cables received in the corresponding receiving space, thus when the light-guiding cover structure is applied to the LED package chip classification system, the aspect of the LED package chip classification system can be enhanced.

摘要翻译： 导光罩结构包括顶盖单元和导光单元。 顶盖单元具有形成在其中的多个接收空间。 导光单元包括多个导光组，其中每个导光组包括容纳在相应接收空间中的多根光纤电缆，并且每根光纤电缆具有两个相对端从第 并且分别面向至少一个发光装置和已经设置在顶盖单元下的至少一个光感测装置。 因此，光纤电缆在相应的接收空间中被接收，因此当导光盖结构被应用于LED封装芯片分类系统时，可以提高LED封装芯片分类系统的方面。

公开(公告)号：US08686310B2

公开(公告)日：2014-04-01

申请号：US13170705

申请日：2011-06-28

申请人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen

发明人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen

IPC分类号： B07C5/344

CPC分类号： B07C5/00 ,  B07C5/344 ,  G01R31/01 ,  G01R31/2893

摘要： A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.

摘要翻译： 封装芯片检测和分类装置包括用于传输多个封装芯片的转动单元，封装芯片检测单元和封装芯片分类单元。 旋转单元包括旋转转盘，形成在旋转转盘上的多个接收部分和分别形成在接收部分中的多个抽吸排气口。 每个接收部分用于选择性地接收至少一个封装的芯片。 封装芯片检测单元包括与用于检测每个封装芯片的旋转单元相邻的封装芯片检测模块。 封装芯片分类单元包括与旋转单元相邻的封装芯片分类模块，用于对封装芯片进行分类。 因此，封装芯片检测和分类装置可以通过匹配旋转单元，封装芯片检测单元和封装芯片分类单元来检测和分类无铅封装芯片。

公开(公告)号：US08421884B2

公开(公告)日：2013-04-16

申请号：US12554924

申请日：2009-09-07

申请人： Bily Wang ,  Yuan-Hsiu Yang

发明人： Bily Wang ,  Yuan-Hsiu Yang

IPC分类号： H04N5/225 ,  H04N5/76

CPC分类号： H04N5/772 ,  G01S19/13 ,  H04N9/8205

摘要： A GPS device with a display function includes a GPS recorder and a display screen. The GPS recorder has a GPS casing that encloses one part of the display screen and only a display area of the display screen is exposed. The display screen is electrically disposed on the GPS recorder, and the display screen displays pattern in order to show time information and the position information that have been captured by the GPS recorder. In addition, the GPS recorder has a memory disposed therein for storing the time information and the position information.

摘要翻译： 具有显示功能的GPS装置包括GPS记录器和显示屏。 GPS记录器具有GPS壳体，其包围显示屏幕的一部分，并且仅显示屏幕的显示区域被暴露。 显示屏电气地设置在GPS记录器上，并且显示屏幕显示图案以便显示由GPS记录器捕获的时间信息和位置信息。 此外，GPS记录器具有设置在其中的存储时间信息和位置信息的存储器。

公开(公告)号：US08162514B2

公开(公告)日：2012-04-24

申请号：US12243215

申请日：2008-10-01

申请人： Bily Wang

发明人： Bily Wang

IPC分类号： F21V5/00 ,  F21V9/12

CPC分类号： F21V33/0064 ,  A62C31/00 ,  A62C35/02 ,  F21S9/022 ,  F21V23/0442 ,  F21Y2115/10 ,  G02B6/0081

摘要： An illumination device with a fire-fighting function includes a transparent hollow casing, fire-fighting water, a light-emitting unit, and a light-guiding unit. The transparent hollow casing has a receiving space. The fire-fighting water is filled into the receiving space of the transparent hollow casing. The light-emitting unit has a plurality of light-emitting elements disposed beside one or more lateral sides of the transparent hollow casing. The light-guiding unit is disposed over the transparent hollow casing. Hence, when fire accident happens, the transparent hollow casing will melt and crack due to the developed over-heat, and the fire-fighting water is sprayed out from the receiving spaces in order to extinguish one part of flames. Therefore, the present invention can be used as a lighting device or can be used as a fire-fighting device when fire accident happens.

摘要翻译： 具有消防功能的照明装置包括透明中空壳体，消防水，发光单元和导光单元。 透明中空壳体具有容纳空间。 消防水被填充到透明中空壳体的接收空间中。 发光单元具有设置在透明中空壳体的一个或多个侧面旁边的多个发光元件。 导光单元设置在透明中空壳体的上方。 因此，当发生火灾事故时，透明中空套管由于发热过热而熔化和裂开，消防水从接收空间喷出以熄灭一部分火焰。 因此，本发明可以用作照明装置，也可以在火灾事故发生时用作消防装置。

公开(公告)号：US08107720B2

公开(公告)日：2012-01-31

申请号：US12453636

申请日：2009-05-18

申请人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Ming-Hao Chou ,  Ren-Chun Ni

发明人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Ming-Hao Chou ,  Ren-Chun Ni

IPC分类号： G06K9/00

CPC分类号： G06T7/0006 ,  G06T2207/30164

摘要： A detection system for detecting appearances of many electronic elements includes a rotary module, a feeding module and a detection module. The rotary module has a base structure and a hollow transparent rotary structure disposed on the base structure. The feeding module is disposed beside one side of the hollow transparent rotary structure in order to sequentially guide the electronic elements to the top surface of the hollow transparent rotary structure. The detection module has a plurality of detection units sequentially disposed around the hollow transparent rotary structure. Each detection unit is composed of an image-sensing element for sensing the electronic elements, an image-capturing element for capturing surface images of the electronic elements and a classifying element for classifying the electronic elements.

摘要翻译： 用于检测许多电子元件的外观的检测系统包括旋转模块，馈送模块和检测模块。 旋转模块具有底座结构和设置在基座结构上的中空透明旋转结构。 馈送模块设置在中空透明旋转结构的一侧旁边，以便顺序地将电子元件引导到中空透明旋转结构的顶表面。 检测模块具有多个依次设置在中空透明旋转结构周围的检测单元。 每个检测单元由用于感测电子元件的图像感测元件，用于捕获电子元件的表面图像的图像捕获元件和用于分类电子元件的分类元件组成。

公开(公告)号：US08053885B2

公开(公告)日：2011-11-08

申请号：US12318876

申请日：2009-01-12

申请人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

发明人： Bily Wang ,  Sung-Yi Hsiao ,  Jack Chen

IPC分类号： H01L23/485

CPC分类号： H01L29/0657 ,  H01L21/6836 ,  H01L23/31 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/96 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05 ,  H01L2224/12105 ,  H01L2224/13099 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/0107 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wafer level vertical diode package structure includes a first semiconductor layer, a second semiconductor layer, an insulative unit, a first conductive structure, and a second conductive structure. The second semiconductor layer is connected with one surface of the first semiconductor layer. The insulative unit is disposed around a lateral side of the first semiconductor layer and a lateral side of the second semiconductor layer. The first conductive structure is formed on a top surface of the first semiconductor layer and on one lateral side of the insulative layer. The second conductive structure is formed on a top surface of the second semiconductor layer and on another opposite lateral side of the insulative layer.

摘要翻译： 晶圆级垂直二极管封装结构包括第一半导体层，第二半导体层，绝缘单元，第一导电结构和第二导电结构。 第二半导体层与第一半导体层的一个表面连接。 绝缘单元围绕第一半导体层的侧面和第二半导体层的横向侧设置。 第一导电结构形成在第一半导体层的顶表面和绝缘层的一个侧面上。 第二导电结构形成在第二半导体层的顶表面上，在绝缘层的另一个相对的侧面上。

公开(公告)号：US20110156060A1

公开(公告)日：2011-06-30

申请号：US12845719

申请日：2010-07-28

申请人： Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

发明人： Bily Wang ,  Feng-Hui Chuang ,  Wen-Kuei Wu

IPC分类号： H01L33/48

CPC分类号： H01L25/0753 ,  H01L33/54 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.