Metal smart card with dual interface capability

    公开(公告)号:US10534990B2

    公开(公告)日:2020-01-14

    申请号:US16367595

    申请日:2019-03-28

    Abstract: A dual interface smart card, and methods for the manufacture thereof, having a metal layer, an IC module, with contacts and RF capability, and a plug formed of non RF impeding material, disposed in the metal layer. The plug provides support for the IC module and a degree of electrical insulation and isolation from the metal layer. Embodiments of the card include at least one additional layer.

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