摘要:
A power transistor includes a semiconductor layer an electrode layer. The semiconductor layer having a source zone, a drain zone spaced apart from the source zone in a lateral direction, a drift zone adjacent to the drain zone, and a body zone. The body zone is interposed between the drift zone and the source zone. The electrode layer is dielectrically insulated from the semiconductor layer, and includes a gate electrode divided into at least two sections and a field plate. The field plate is arranged at a first height level relative to the semiconductor layer. A first gate electrode section is arranged at least partially at a second height level, which is lower than the first height level relative to the semiconductor layer. A second gate electrode section, which is laterally displaced from the first gate electrode section, is disposed at a first intermediate level arranged between the first and second height levels.
摘要:
One aspect of the invention relates to an edge structure for a semiconductor component having two electrodes arranged opposite one another on opposite sides of a semiconductor body having a doped zone of the first charge carrier type. The semiconductor body has at least one doped zone of the second charge carrier type extending from a surface into the depth of the semiconductor body and serving for forming a pn junction located in a central region surrounded by an edge region between the two electrodes. The edge region has at least one rectilinear edge section and at least one curved edge section and is formed in such a way that a breakdown voltage in the at least one rectilinear edge section is less than a breakdown voltage in the at least one curved edge section.
摘要:
A trench power semiconductor component, in particular an IGBT, has an electrode (4) in a trench (3) that is laterally divided into a section (10) that serves as a gate and a section (11) that is connected to the source metallization (6). A method for making the trench power semiconductor component is also included.
摘要:
A bipolar high-voltage power component, in particular an IGBT, includes a semiconductor body on which at least two mutually spaced apart electrodes are provided, between which a drift path is formed in a semiconductor region of a first conduction type. Floating zones of a second conduction type, opposite the first conduction type, are provided in the semiconductor region. When the power component is switched on or switched off, the floating zones respectively emit charge carriers of the second conduction type into the semiconductor region or take up the charge carriers from the semiconductor region. The floating zones are connected, through a respective MOS transistor with a channel of the second conduction type or a bipolar transistor with a base of the first conduction type, to active regions of the power component which are connected to the two electrodes.
摘要:
A semiconductor power component has a MOS structure in which the source region is formed of a material whose band gap is smaller than the band gap of the material of the channel region. This measure reduces the gain of a parasitic bipolar transistor.
摘要:
A compensation component includes a drift path formed of p-conducting and n-conducting layers which are led around or along a trench. A process for producing the compensation component is also provided.
摘要:
An edge termination for a semiconductor component containing a semiconductor body formed of silicon carbide. The edge termination has at least one diode chain that is insulated from the semiconductor body and provided with a plurality of semiconductor layers having alternating conductivity types.
摘要:
Thyristor with defined lateral resistor and method for the manufacturing thereof. The thyristor has a resistor area (5) for the generation of a lateral resistor, for example between an emitter field (8) and an auxiliary emitter field (7), whereby the resistor are (5) has a defined lower doping concentration than the layer (2) surrounding it. The defined lower doping concentration is generated by recesses (3) in an occupation layer and can be adjusted by the ratio of the widths alternately arranged recesses (3) and ribs (4). The recess (3) and the ribs (4) are generated either by diffusion and subsequent etching or by implantation with an implantation mask, before the deposition layer is driven into the semiconductor body of the thyristor by heat supply from a surface.
摘要:
The semiconductor substrate includes a high-ohmic semiconductor material with a conduction band edge and a valence band edge, separated by a bandgap, wherein the semiconductor material includes acceptor or donor impurity atoms or crystal defects, whose energy levels are located at least 120 meV from the conduction band edge, as well as from the valence band edge in the bandgap; and wherein the concentration of the impurity atoms or crystal defects is larger than 1×1012 cm−3.
摘要翻译:半导体衬底包括具有导带边缘和价带边缘的高电阻半导体材料,带隙由带隙分开,其中半导体材料包括受体或施主杂质原子或晶体缺陷,其能级位于至少120meV 导带边缘,以及带隙中的价带边缘; 并且其中杂质原子或晶体缺陷的浓度大于1×10 12 cm -3。
摘要:
A high-voltage-resistant semiconductor component (1) has vertically conductive semiconductor areas (17) and a trench structure (5). These vertically conductive semiconductor areas are formed from semiconductor body areas (10) of a first conductivity type and are surrounded by a trench structure (5) on the upper face (6) of the semiconductor component. For this purpose the trench structure has a base (7) and a wall area (8) and is filled with a material (9) with a relatively high dielectric constant (εr). The base area (7) of the trench structure (5) is provided with a heavily doped semiconductor material (11) of the same conductivity type as the lightly doped semiconductor body areas (17), and/or having a metallically conductive material (12).