摘要:
In a method of measuring front to backside alignment error according to one embodiment, a transparent substrate has a plurality of marks on both the front and backside. The relative location of the marks on the front and backside of the substrate is determined to calculate the front to backside alignment error for the whole substrate. In a further embodiment, the substrate is rotated by 180° within the plane of the substrate and the front relative location of the marks is again determined.
摘要:
Substrate processing apparatus includes a lithographic apparatus which comprises an illumination system for supplying a projection beam of radiation, an array of individually controllable elements serving to impart the projection beam with a pattern in its cross-section, and a projection system for projecting the patterned beam onto a target portion of a substrate. The processing apparatus also includes a substrate supply arranged to output at least one unbroken length of substrate, and a substrate conveying system arranged to convey each outputted unbroken length of substrate from the substrate supply and past the projection system such that the projection system is able to project the patterned beam onto a series of target portions along each unbroken length of substrate. In certain embodiments, long lengths of substrate are supplied from a roll, but alternatively a series of separate sheets can be supplied.
摘要:
A lithographic apparatus comprises an illumination system, an array of individually controllable elements, a projection system, a substrate table, and a sensor system. The illumination system supplies a beam of radiation. The array of individually controllable elements patterns the beam. The projection system projects the patterned beam onto a target plane, the patterned beam comprising an array of radiation spots. The substrate table supports a substrate, such that a target surface of the substrate is substantially coincident with the target plane. The sensor system comprises an array of detector elements arranged to receive at least one of the spots. The sensor system measures an energy of the or each received spot and provides an output signal indicative of the energy of the or each received spot.
摘要:
Improved gray scaling imaging methods and systems include a group of elements within an array of individually controllable elements that project a part of a radiation beam onto a lens in an array of microlenses, and are individually controllable so that any number of the individually controllable elements may be switched on or off to generate a gray scale.
摘要:
In a method of measuring front to backside alignment error according to one embodiment, a transparent substrate has a plurality of marks on both the front and backside. The relative location of the marks on the front and backside of the substrate is determined to calculate the front to backside alignment error for the whole substrate. In a further embodiment, the substrate is rotated by 180° within the plane of the substrate and the front relative location of the marks is again determined.
摘要:
A lithographic projection apparatus is disclosed. The apparatus includes an illumination system configured to condition a beam of radiation, and a support structure configured to support a patterning device. The patterning device serves to impart the beam of radiation with a pattern in its cross-section. The apparatus also includes a substrate table configured to hold a substrate, a projection system configured to project the patterned beam onto a target portion of the substrate, and a fluid supply system configured to provide a fluid to a volume. The volume includes at least a portion of the projection system and/or at least a portion of the illumination system. The apparatus further includes a coupling device configured to couple the fluid supply system to the substrate table, substrate, support structure, patterning device, or any combination thereof.
摘要:
A calibration method comprising generating a pattern with an array of individually controllable elements, providing a substrate table with a radiation sensor, using radiation to generate an image of the pattern at the substrate table, moving at least one of the generated pattern and the substrate table relative to each other in order to move the image relative to the sensor, detecting radiation intensity with the sensor, and calculating a calibration establishing a relationship between coordinates of the coordinate system of the array of individually controllable elements and coordinates of the coordinate system of the substrate table, based on the detected intensity and the positions of the array of individually controllable elements and the substrate table.
摘要:
The invention relates to a Method of protecting a direct electron detector (151) in a TEM. The invention involves predicting the current density on the detector before setting new beam parameters, such as changes to the excitation of condenser lenses (104), projector lenses (106) and/or beam energy. The prediction is made using an optical model or a Look-Up-Table. When the predicted exposure of the detector is less than a predetermined value, the desired changes are made, otherwise a warning message is generated and changes to the settings are postponed.
摘要:
The invention relates to a Method of protecting a direct electron detector (151) in a TEM. The invention involves predicting the current density on the detector before setting new beam parameters, such as changes to the excitation of condenser lenses (104), projector lenses (106) and/or beam energy. The prediction is made using an optical model or a Look-Up-Table. When the predicted exposure of the detector is less than a predetermined value, the desired changes are made, otherwise a warning message is generated and changes to the settings are postponed.
摘要:
The invention relates to a device manufacturing method comprising identifying a substrate to be processed, performing a manufacturing step of a patterned layer on the substrate, and storing a substrate process history for the substrate. The history may comprise a correction map comprising position errors caused by the manufacturing step. Identifying the substrate may be done by reading an identification sign present on the substrate or by reading an identification code of a lot comprising the substrate and determining a sequence number of the substrate in the lot. Alignment of the substrate with respect to a patterning device of a lithographic apparatus may be corrected using information of the substrate process history. Alternatively or additionally, measured overlay errors may be corrected per substrate using information of the substrate process history.