摘要:
A buried-channel field-effect transistor includes a semiconductor layer formed on a substrate. The semiconductor layer includes doped source and drain regions and an undoped channel region. the transistor further includes a gate dielectric formed over the channel region and partially overlapping the source and drain regions; a gate formed over the gate dielectric; and a doped shielding layer between the gate dielectric and the semiconductor layer.
摘要:
An electrical circuit, planar diode, and method of forming a diode and one or more CMOS devices on the same chip. The method includes electrically isolating a portion of a substrate in a diode region from other substrate regions. The method also includes recessing the substrate in the diode region. The method further includes epitaxially forming in the diode region a first doped layer above the substrate and epitaxially forming in the diode region a second doped layer above the first doped layer.
摘要:
A field effect transistor structure that uses thin semiconductor on insulator channel to control the electrostatic integrity of the device. Embedded stressors are epitaxially grown in the source/drain area from a template in the silicon substrate through an opening made in the buried oxide in the source/drain region. In addition, a dielectric layer is formed between the embedded stressor and the semiconductor region under the buried oxide layer, which is located directly beneath the channel to suppress junction capacitance and leakage.
摘要:
Transistor devices including stressors are disclosed. One such transistor device includes a channel region, a dielectric layer and a semiconductor substrate. The channel region is configured to provide a conductive channel between a source region and a drain region. In addition, the dielectric layer is below the channel region and is configured to electrically insulate the channel region. Further, the semiconductor substrate, which is below the channel region and below the dielectric layer, includes dislocation defects at a top surface of the semiconductor substrate, where the dislocation defects are collectively oriented to impose a compressive strain on the channel region such that charge carrier mobility is enhanced in the channel region.
摘要:
A transistor is provided that includes a buried oxide layer above a substrate. A silicon layer is above the buried oxide layer. A gate stack is on the silicon layer, the gate stack including a high-k oxide layer on the silicon layer and a metal gate on the high-k oxide layer. A nitride liner is adjacent to the gate stack. An oxide liner is adjacent to the nitride liner. A set of faceted raised source/drain regions having a part including a portion of the silicon layer. The set of faceted raised source/drain regions also include a first faceted side portion and a second faceted side portion.
摘要:
A method includes forming isolation regions in a semiconductor substrate to define a first field effect transistor (FET) region, a second FET region, and a diode region, forming a first gate stack in the first FET region and a second gate stack in the second FET region, forming a layer of spacer material over the second FET region and the second gate stack, forming a first source region and a first drain region in the first FET region and a first diode layer in the diode region using a first epitaxial growth process, forming a hardmask layer over the first source region, the first drain region, the first gate stack and a portion of the first diode layer, and forming a second source region and a second drain region in the first FET region and a second diode layer on the first diode layer using a second epitaxial growth process.
摘要:
MOSFETs and methods for making MOSFETs with a recessed channel and abrupt junctions are disclosed. The method includes creating source and drain extensions while a dummy gate is in place. The source/drain extensions create a diffuse junction with the silicon substrate. The method continues by removing the dummy gate and etching a recess in the silicon substrate. The recess intersects at least a portion of the source and drain junction. Then a channel is formed by growing a silicon film to at least partially fill the recess. The channel has sharp junctions with the source and drains, while the unetched silicon remaining below the channel has diffuse junctions with the source and drain. Thus, a MOSFET with two junction regions, sharp and diffuse, in the same transistor can be created.
摘要:
A method of forming a transistor device includes forming a patterned gate structure over a semiconductor substrate, forming a raised source region over the semiconductor substrate adjacent a source side of the gate structure, and forming silicide contacts on the raised source region, on the patterned gate structure, and on the semiconductor substrate adjacent a drain side of the gate structure. Thereby, a hybrid field effect transistor (FET) structure having a drain side Schottky contact and a raised source side ohmic contact is defined.
摘要:
Transistor devices including stressors are disclosed. One such transistor device includes a channel region, a dielectric layer and a semiconductor substrate. The channel region is configured to provide a conductive channel between a source region and a drain region. In addition, the dielectric layer is below the channel region and is configured to electrically insulate the channel region. Further, the semiconductor substrate, which is below the channel region and below the dielectric layer, includes dislocation defects at a top surface of the semiconductor substrate, where the dislocation defects are collectively oriented to impose a compressive strain on the channel region such that charge carrier mobility is enhanced in the channel region.
摘要:
A semiconductor device includes an epitaxy layer formed on semiconductor substrate, a device layer formed on the epitaxy layer, a trench formed within the semiconductor substrate and including a dielectric layer forming a liner within the trench and a conductive core forming a through-silicon via conductor, and a deep trench isolation structure formed within the substrate and surrounding the through-silicon via conductor. A region of the epitaxy layer formed between the through-silicon via conductor and the deep trench isolation structure is electrically isolated from any signals applied to the semiconductor device, thereby decreasing parasitic capacitance.