摘要:
A printhead comprising a plurality of unit cells, at least one of the plurality of unit cells comprising a substrate including an ink inlet passage. A chamber is defined by chamber sidewalls and at least part of a nozzle plate defining an aperture for ejection of ink from the chamber, the chamber being in fluid communication with the inlet passage. A nozzle enclosure comprising enclosure sidewalls and a roof defining an opening for ejection of ink, the nozzle enclosure surrounding the aperture. Ink ejected from the aperture is directed to the opening of the nozzle enclosure, thereby isolating the aperture from an adjacent aperture of an adjacent unit cell.
摘要:
An inkjet printer comprising: a printhead having a plurality of nozzles assemblies, each nozzle assembly comprising: a nozzle chamber for containing ink, the chamber having a nozzle opening and an ink inlet; and a bend actuator for ejecting ink droplets from the nozzle opening by generating a positive pressure pulse in the ink during bending of the actuator; and an ink supply system for supplying ink to the printhead; and means for varying a hydrostatic pressure of ink supplied to the printhead, wherein increasing the hydrostatic ink pressure increases a volume of the ejected ink droplets, and decreasing the hydrostatic ink pressure decreases a volume of the ejected ink droplets.
摘要:
A nozzle arrangement for an inkjet printer comprises a nozzle chamber; an ink supply channel for supplying ink to the nozzle chamber; a cover for covering the nozzle chamber, the cover defining an ink ejection port through which ink is ejected; a plurality of thermal bend actuators radially arranged around the ink ejection port; and a plurality of heater elements each corresponding to one of the plurality of thermal bend actuators. Each heater element is provided at an end of a corresponding thermal bend actuator opposite the ink ejection port.
摘要:
A printhead having a hydrophobic ink ejection face is provided. At least part of the ink ejection face is coated with a hydrophobic polymeric material selected from the group comprising: polymerized siloxanes and fluorinated polyolefins.
摘要:
A thermoelastic device comprising an expansive element is disclosed. The expansive element is formed from a material, which is preselected on the basis that it has one or more of the following properties: a resistivity between 0.1 μΩm and 10.0 μΩm; chemically inert in air; chemically inert in the chosen ink; and depositable by CVD, sputtering or other thin film deposition technique.
摘要:
A nozzle arrangement for an inkjet printhead includes a substrate with a layer of drive circuitry, the substrate defining an ink chamber with an ink supply channel etched through the substrate; and a roof structure having a roof layer over the chamber. The roof structure comprises a nozzle rim positioned around an ejection port defined in the roof layer above the chamber; a plurality of actuators radially spaced about, and displaceable with respect to, the nozzle rim, each actuator having an internal copper core for receiving therethrough a current, each actuator configured to thermally expand into the chamber upon receiving the current; and a series of struts interspersed between the actuators to support the nozzle rim with respect to the roof layer.
摘要:
A microfluidic system. The system comprises: (A) a microfluidics platform comprising: a compliant body having a microfluidic channel defined therein; a valve sleeve defined by a section of the microfluidic channel, the valve sleeve having a membrane wall defining part of an outer surface of the body; and a compression member for pinching the membrane wall against an opposed wall of the valve sleeve; and (B) a MEMS integrated circuit bonded to the outer surface of the body, the MEMS integrated circuit comprising: a moveable finger engaged with the compression member, the finger being configured to urge the compression member between a closed position in which the membrane wall is sealingly pinched against the opposed wall, and an open position in which the membrane wall is disengaged from the opposed wall; a thermal bend actuator associated with the finger, the actuator configured for controlling movement of the finger; and control circuitry for controlling actuation of the actuator so as to control opening and closing of the valve sleeve.
摘要:
A microfluidic system comprising a MEMS integrated circuit. The MEMS integrated circuit comprises: a silicon substrate having one or more microfluidic channels defined therein; at least one layer of control circuitry for controlling one or more microfluidic devices; a MEMS layer comprising the microfluidic devices; and a polymeric layer covering the MEMS layer. Part of the polymeric layer provides a seal for the microfluidic devices.
摘要:
A MEMS integrated circuit comprising one or more microfluidic diaphragm valves and control circuitry for the valves. Each valve comprises: an inlet port; an outlet port; a weir positioned between the inlet and outlet ports, the weir having a sealing surface; a diaphragm membrane for sealing engagement with the sealing surface; and a thermal bend actuator for moving the diaphragm membrane between a closed position in which the membrane is sealingly engaged with the sealing surface and an open position in which the membrane is disengaged from the sealing surface. The control circuitry is configured to control actuation of the actuator so as to control opening and closing of the valve.
摘要:
A thermal bend actuator comprising: (a) a pair of electrical contacts positioned at one end of the actuator; (b) an active beam connected to the electrical contacts and extending longitudinally away from the contacts, the active beam defining a bent current flow path between the contacts; and (c) a passive beam fused to the active beam. When a current is passed through the active beam, the active beam heats and expands relative to the passive beam, resulting in bending of the actuator. The active beam comprises a resistive heating bar having a relatively smaller cross-sectional area than any other part of the current flow path. Heating of the active beam is concentrated in the heating bar.