公开(公告)号：US07081042B2

公开(公告)日：2006-07-25

申请号：US11004223

申请日：2004-12-02

申请人： Hung Chih Chen ,  Steven M. Zuniga ,  Tsz-Sin Siu

发明人： Hung Chih Chen ,  Steven M. Zuniga ,  Tsz-Sin Siu

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B24B37/30

摘要： Techniques for removing a substrate from a polishing pad are described. A substrate is pulled away from the polishing pad such that the edges of the substrate are pulled away from the polishing pad before the center of the substrate is pulled from the polishing pad.

公开(公告)号：US07044832B2

公开(公告)日：2006-05-16

申请号：US10988647

申请日：2004-11-15

申请人： Alpay Yilmaz ,  Simon Yavelberg ,  Toshikazu Tomita ,  Hui Chen ,  Noel Manto ,  David J. Lischka ,  Hung Chih Chen

发明人： Alpay Yilmaz ,  Simon Yavelberg ,  Toshikazu Tomita ,  Hui Chen ,  Noel Manto ,  David J. Lischka ,  Hung Chih Chen

IPC分类号： B24B49/00

CPC分类号： B24B37/345

摘要： Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a substrate during transfer of the substrate from the polishing head to the substrate support.

摘要翻译： 提供了用于转移衬底的负载杯的实施例。 负载杯包括具有基板支撑件和去夹紧喷嘴的基座组件。 在将基板从抛光头转移到基板支撑件的过程中，去夹紧喷嘴定位成使流体在基板的抛光头和背面之间流动。

公开(公告)号：US07001260B2

公开(公告)日：2006-02-21

申请号：US10187143

申请日：2002-06-28

申请人： Hung Chih Chen ,  Steven M. Zuniga

发明人： Hung Chih Chen ,  Steven M. Zuniga

IPC分类号： B24B5/00

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A compressible film that is detachably securable to a surface of a rigid structure in the carrier head. The compressible film has a plurality of apertures positioned to create a non-uniform pressure distribution on a substrate during polishing so as to improve polishing uniformity. The apertures may be spaced and positioned to provide a pressure distribution on the substrate that is locally uniform but globally non-uniform.

公开(公告)号：US07001257B2

公开(公告)日：2006-02-21

申请号：US11054128

申请日：2005-02-08

申请人： Hung Chih Chen ,  Steven M. Zuniga

发明人： Hung Chih Chen ,  Steven M. Zuniga

IPC分类号： B24B29/00

CPC分类号： B24B37/30 ,  B24B41/061 ,  B24B49/16

摘要： A carrier head that has a base assembly and a flexible membrane. The flexible membrane has a generally circular main portion with a lower surface that provides a substrate-mounting surface and a plurality of concentric annular portions extending from the main portion and secured to the base assembly. The volume between the base assembly and the flexible membrane forming a plurality of pressurizable chambers.

摘要翻译： 具有基座组件和柔性膜的承载头。 柔性膜具有大致圆形的主要部分，具有下表面，其提供基板安装表面和从主要部分延伸并固定到基座组件的多个同心环形部分。 基座组件和柔性膜之间的体积形成多个可加压室。

公开(公告)号：US06776694B2

公开(公告)日：2004-08-17

申请号：US10188259

申请日：2002-07-01

申请人： Steven M. Zuniga ,  Hung Chih Chen ,  Ming Kuie Tseng

发明人： Steven M. Zuniga ,  Hung Chih Chen ,  Ming Kuie Tseng

IPC分类号： B24B100

CPC分类号： B24B37/30 ,  F16J3/02

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate. A central portion of the flexible membrane is formed of a first material with a different rigidity than a second material that forms the annular portion of the flexible membrane.

摘要翻译： 用于化学机械抛光装置的载体头包括向基底施加载荷的柔性膜。 柔性膜的中心部分由与形成柔性膜的环形部分的第二材料刚度不同的第一材料形成。

公开(公告)号：US06494774B1

公开(公告)日：2002-12-17

申请号：US09610559

申请日：2000-07-05

申请人： Steven M. Zuniga ,  Hung Chih Chen

发明人： Steven M. Zuniga ,  Hung Chih Chen

IPC分类号： B24B500

CPC分类号： B24B37/30

摘要： A carrier head with a housing, a lower flexible membrane that defines a first chamber, an upper flexible membrane that defines a second chamber, and a pressure distribution assembly positioned between the upper flexible membrane and the lower flexible membrane. A lower surface of the lower flexible membrane provides a substrate mounting surface, and a portion of the upper flexible membrane can be biasable into contact with an upper surface of the lower flexible membrane. The pressure distribution assembly can include an upper surface in contact with the upper flexible membrane and a lower surface in contact with the lower flexible membrane. The pressure distribution assembly can be configured to transfer pressure from a portion of the upper flexible membrane to a more concentrated region of the substrate.

摘要翻译： 具有壳体的承载头，限定第一室的下柔性膜，限定第二室的上柔性膜，以及定位在上柔性膜和下柔性膜之间的压力分布组件。 下柔性膜的下表面提供了基板安装表面，并且上柔性膜的一部分可以偏压成与下柔性膜的上表面接触。 压力分配组件可以包括与上柔性膜接触的上表面和与下柔性膜接触的下表面。 压力分布组件可以被配置成将压力从上柔性膜的一部分转移到衬底的更集中的区域。

公开(公告)号：US06436828B1

公开(公告)日：2002-08-20

申请号：US09565200

申请日：2000-05-04

申请人： Hung Chih Chen ,  Steven M. Zuniga

发明人： Hung Chih Chen ,  Steven M. Zuniga

IPC分类号： H01L21461

CPC分类号： B24B1/005 ,  B24B37/042

摘要： A chemical mechanical polishing apparatus includes a carrier head, a platen positioned on an opposing side of the carrier head, and a polishing pad positioned on the platen to contact and polish the substrate received on the substrate receiving surface. The carrier head includes a housing, a flexible membrane attached to the housing and having a substrate receiving surface to receive a substrate. The flexible membrane has magnetically sensitive particles distributed therein. One or more coils are positioned above the flexible membrane to generate magnetic fields to exert magnetic forces on the particles.

摘要翻译： 化学机械抛光装置包括载体头，位于载体头的相对侧上的压板和位于压板上的抛光垫，用于接触并抛光容纳在基板接收表面上的基板。 承载头包括壳体，附接到壳体的柔性膜，并具有用于接收衬底的衬底接收表面。 柔性膜具有分布在其中的磁敏颗粒。 一个或多个线圈位于柔性膜上方以产生磁场以对颗粒施加磁力。

公开(公告)号：US06368191B1

公开(公告)日：2002-04-09

申请号：US09665838

申请日：2000-09-20

申请人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

发明人： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

IPC分类号： B24B100

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

摘要翻译： 用于化学机械抛光装置的载体头包括柔性膜，其下表面提供基板接收表面。 承载头可以包括与柔性膜的上表面接触的突起，以将增加的负载施加到基底的潜在的被抛光的区域。 流体射流可以用于相同的目的。

公开(公告)号：US20160016281A1

公开(公告)日：2016-01-21

申请号：US14801630

申请日：2015-07-16

申请人： Hung Chih Chen

发明人： Hung Chih Chen

IPC分类号： B24B37/10 ,  B24B37/26 ,  H01L21/67

CPC分类号： B24B37/10 ,  B24B37/11 ,  B24B37/26 ,  B24B37/30 ,  H01L21/30625 ,  H01L21/31051 ,  H01L21/32115 ,  H01L21/3212 ,  H01L21/7684

摘要： Chemical mechanical polishing can be used for “touch-up polishing” in which polishing is performed on a limited area of the front surface of the substrate. The contact area between the polishing pad and the substrate can be substantially smaller than the radius surface of the substrate. During polishing, the polishing pad can undergo an orbital motion. The polishing pad can be maintained in a fixed angular orientation during the orbital motion. The contact area can be arc-shaped. The contact area can be provided by one or more lower portions projecting downward from an upper portion of the polishing pad. A perimeter portion of the polishing pad can be vertically fixed to an annular member and a remainder of the polishing pad within the perimeter portion can be vertically free.

摘要翻译： 化学机械抛光可用于在基板前表面的有限区域上进行抛光的“研磨抛光”。 抛光垫和基板之间的接触面积可以基本上小于基板的半径表面。 在抛光期间，抛光垫可以进行轨道运动。 在轨道运动期间，抛光垫可以保持在固定的角度定向。 接触区域可以是弧形的。 接触区域可以由从抛光垫的上部向下突出的一个或多个下部提供。 抛光垫的周边部分可以垂直地固定到环形构件，并且周边部分内的抛光垫的其余部分可以是垂直自由的。

公开(公告)号：US20140120803A1

公开(公告)日：2014-05-01

申请号：US13661603

申请日：2012-10-26

申请人： Hung Chih Chen ,  Samuel Chu-Chiang Hsu ,  Gautam Shashank Dandavate

发明人： Hung Chih Chen ,  Samuel Chu-Chiang Hsu ,  Gautam Shashank Dandavate

IPC分类号： B24B37/32 ,  B24B7/00

CPC分类号： B24B37/32 ,  B24B7/00 ,  B24B7/228

摘要： A retaining ring for holding a substrate below a carrier head during chemical mechanical polishing includes an annular lower portion and an annular upper portion secured to the lower portion. The annular lower portion has a main body with a bottom surface for contacting a polishing pad during polishing, and is a first material. A top surface of the upper portion is configured to be secured to the carrier head. The upper portion is a second material that is more rigid than the first material. A thickness and stiffness of the lower portion is selected for a particular polishing environment to improve polishing uniformity near an edge of the substrate.

摘要翻译： 在化学机械抛光期间用于将基板保持在载体头下方的保持环包括环形下部和固定到下部的环形上部。 环形下部具有主体，其具有用于在抛光期间接触抛光垫的底表面，并且是第一材料。 上部的上表面构造成固定到承载头。 上部是比第一材料更刚性的第二材料。 选择下部的厚度和刚度用于特定的抛光环境以改善靠近基底边缘的抛光均匀性。