Process for preparing purified active monomer of bone-derived factor
    95.
    发明申请
    Process for preparing purified active monomer of bone-derived factor 失效
    骨源性因子纯化活性单体的制备方法

    公开(公告)号:US20050026247A1

    公开(公告)日:2005-02-03

    申请号:US10734583

    申请日:2003-12-15

    摘要: A process for preparing a purified refolded monomer or dimer of a bone-derived factor, which comprises subjecting an inclusion body of a bone-derived factor produced by genetic engineering to the following steps a) to c) in sequence: a) introducing a polynucleotide encoding a bone morphogenetic factor into a bacterium, expressing said bone morphogenetic factor in the form of an inclusion body, recovering said inclusion body and treating it with a denaturing agent to obtain a solubilized monomer, b) treating the solubilized monomer without purification directly with a refolding solution to obtain a refolded monomeric bone morphogenetic factor, c) subjecting the refolded monomeric bone morphogenetic factor to purification.

    摘要翻译: 一种制备骨源性因子的纯化的重折叠单体或二聚体的方法,其包括使基因工程产生的骨衍生因子的内含体按顺序步骤a)至c):a)将多核苷酸 将骨形态发生因子编码成细菌,以包涵体的形式表达所述骨形态发生因子,回收所述包涵体并用变性剂处理以获得溶解的单体,b)直接用 重折叠溶液以获得重折叠的单体骨形态发生因子,c)使重折叠的单体骨形态发生因子进行纯化。

    Lead frame, circuit board with lead frame, and method for producing the lead frame
    96.
    发明授权
    Lead frame, circuit board with lead frame, and method for producing the lead frame 有权
    引线框架,带引线框架的电路板,以及引线框架的制造方法

    公开(公告)号:US06798045B2

    公开(公告)日:2004-09-28

    申请号:US09771912

    申请日:2001-01-29

    IPC分类号: H01L23495

    摘要: A lead frame is described which has at least one integrated electronic circuit. The integrated electronic circuit is situated in a region of a main area of the lead frame. The lead frame has at least one signal line, at least one electrically insulating plate, and an electrically conductive, grounded plate are situated. The electrically insulating plate, and the electrically conductive, grounded plate are situated, at least in sections, between the integrated electronic circuit and the signal line. A method for producing the lead frame is also described.

    摘要翻译: 描述了具有至少一个集成电子电路的引线框架。 集成电子电路位于引线框架的主区域的区域中。 引线框架具有至少一个信号线,至少一个电绝缘板和导电接地板。 电绝缘板和导电接地板至少部分地位于集成电子电路和信号线之间。 还描述了用于制造引线框架的方法。

    Use of MP52 or MP121 for treating and preventing diseases of the nervous system
    97.
    发明授权
    Use of MP52 or MP121 for treating and preventing diseases of the nervous system 失效
    使用MP52或MP121治疗和预防神经系统疾病

    公开(公告)号:US06531450B2

    公开(公告)日:2003-03-11

    申请号:US08981490

    申请日:1998-05-18

    IPC分类号: A61R3818

    摘要: The present invention concerns the use of biologically active MP52 or/and MP121 for the treatment and prevention of diseases of the nervous system or/and for the treatment of neuropathological situations which are caused by ageing of the nervous system. A pharmaceutical agent according to the invention for the treatment and prevention of diseases of the nervous system or/and for treating neuropathological situations which are caused by ageing of the nervous system therefore contains biologically active MP52 or/and MP121 as the active substance.

    摘要翻译: 本发明涉及生物活性MP52或/和MP121用于治疗和预防神经系统疾病和/或用于治疗由神经系统衰老引起的神经病理学情况的用途。 因此,根据本发明的用于治疗和预防由神经系统衰老引起的神经系统疾病和/或用于治疗神经病理学情况的本发明的药剂包含生物活性MP52或/和MP121作为活性物质。

    On-chip RF shields with through substrate conductors
    100.
    发明授权
    On-chip RF shields with through substrate conductors 有权
    片上RF屏蔽通过基板导体

    公开(公告)号:US08169059B2

    公开(公告)日:2012-05-01

    申请号:US12242521

    申请日:2008-09-30

    IPC分类号: H01L23/552

    摘要: Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, the system on a chip includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary. The system on chip further includes through substrate conductors disposed in the substrate, the through substrate conductors coupled to a ground potential node, the through substrate conductors disposed around the RF component forming a fence around the RF circuit.

    摘要翻译: 公开了一种片上系统的结构以及片上系统的形成方法。 在一个实施例中,芯片上的系统包括设置在基板的第一部分上的RF部件,设置在基板的第二部分上的半导体部件,共享公共边界的半导体部件和RF部件。 芯片上的系统还包括通过设置在基板中的基板导体,连接到地电位节点的贯穿基板导体,围绕RF元件设置的贯穿基板导体,围绕RF电路形成围栏。