Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same
    92.
    发明授权
    Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same 有权
    III族氮化物晶体衬底,含有外延层的III族氮化物晶体衬底,半导体器件及其制造方法

    公开(公告)号:US08771552B2

    公开(公告)日:2014-07-08

    申请号:US12837872

    申请日:2010-07-16

    IPC分类号: H01B1/00

    摘要: A group III nitride crystal substrate is provided in which a uniform distortion at a surface layer of the crystal substrate represented by a value of |d1 −d2 |/d2 obtained from a plane spacing d1 at the X-ray penetration depth of 0.3 μm and a plane spacing d2 at the X-ray penetration depth of 5 μm is equal to or lower than 1.9 ×10−3, and the main surface has a plane orientation inclined in the direction at an angle equal to or greater than 10° and equal to or smaller than 80° with respect to one of (0001) and (000-1) planes of the crystal substrate. A group III nitride crystal substrate suitable for manufacturing a light emitting device with a blue shift of an emission suppressed, an epilayer-containing group III nitride crystal substrate, a semiconductor device and a method of manufacturing the same can thereby be provided.

    摘要翻译: 提供了一种III族氮化物晶体基板,其中在由X射线穿透深度为0.3μm的平面间距d1获得的| d1 -d2 | / d2的值表示的晶体基板的表面层处的均匀的变形,以及 在5μm的X射线穿透深度处的平面间距d2等于或小于1.9×10 -3,并且主表面具有以等于或大于等于或等于10°的角度在<10-10>方向上倾斜的平面取向 相对于晶体基板的(0001)和(000-1)面之一,比10°等于或小于80°。 因此,可以提供适合于制造抑制发射蓝移的发光器件的III族氮化物晶体衬底,含有外延层的III族氮化物晶体衬底,半导体器件及其制造方法。

    Semiconductor device and method of its manufacture
    95.
    发明申请
    Semiconductor device and method of its manufacture 有权
    半导体装置及其制造方法

    公开(公告)号:US20080128706A1

    公开(公告)日:2008-06-05

    申请号:US11947752

    申请日:2007-11-29

    IPC分类号: H01L29/20 H01L21/205

    摘要: Method of high-yield manufacturing superior semiconductor devices includes: a step of preparing a GaN substrate having a ratio St/S—of collective area (St cm2) of inversion domains in, to total area (S cm2) of the principal face of, the GaN substrate—of no more than 0.5, with the density along the (0001) Ga face, being the substrate principal face, of inversion domains whose surface area where the polarity in the [0001] direction is inverted with respect to the principal domain (matrix) is 1 μm2 or more being D cm−2; and a step of growing on the GaN substrate principal face an at least single-lamina semiconductor layer to form semiconductor devices in which the product Sc×D of the area Sc of the device principal faces, and the density D of the inversion domains is made less than 2.3.

    摘要翻译: 高产量制造方法优异的半导体器件包括:制备具有集体面积的比率S / T / S的GaN衬底的步骤, (0001)的浓度,在GaN基板的主面的总面积(S cm 2以上)不大于0.5的情况下, 在[0001]方向上的极性相对于主域(矩阵)反转的表面积为反向畴的Ga面作为衬底主面为1μm以上为D cm 2; 并且在GaN衬底主体上生长至少单层半导体层以形成半导体器件的步骤,其中产品S区域S D的区域S < 器件主面,反型域的密度D小于2.3。

    GROUP III NITRIDE CRYSTAL SUBSTRATE, EPILAYER-CONTAINING GROUP III NITRIDE CRYSTAL SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    98.
    发明申请
    GROUP III NITRIDE CRYSTAL SUBSTRATE, EPILAYER-CONTAINING GROUP III NITRIDE CRYSTAL SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    III族氮化物晶体基板,含有III族氮化钛晶体的衬底,半导体器件及其制造方法

    公开(公告)号:US20110012233A1

    公开(公告)日:2011-01-20

    申请号:US12837872

    申请日:2010-07-16

    IPC分类号: H01L29/20 C30B19/12 C30B23/02

    摘要: A group III nitride crystal substrate is provided in which, in connection with plane spacing of arbitrary specific parallel crystal lattice planes of the group III nitride crystal substrate obtained from X-ray diffraction measurement performed with variation of X-ray penetration depth from a main surface of the crystal substrate while X-ray diffraction conditions of the specific parallel crystal lattice planes of the crystal substrate are satisfied, a uniform distortion at a surface layer of the crystal substrate represented by a value of |d1−d2|/d2 obtained from a plane spacing d1 at the X-ray penetration depth of 0.3 μm and a plane spacing d2 at the X-ray penetration depth of 5 μm is equal to or lower than 1.9×10−3, and the main surface has a plane orientation inclined in the direction at an angle equal to or greater than 10° and equal to or smaller than 80° with respect to one of (0001) and (000-1) planes of the crystal substrate. A group III nitride crystal substrate suitable for manufacturing a light emitting device with a blue shift of an emission suppressed, an epilayer-containing group III nitride crystal substrate, a semiconductor device and a method of manufacturing the same can thereby be provided.

    摘要翻译: 提供了一种III族氮化物晶体基板,其中,与通过从主表面的X射线穿透深度的变化进行的X射线衍射测量获得的III族氮化物晶体基板的任意特定平行晶格面的平面间隔 的晶体基板的特定平行晶格面的X射线衍射条件得到满足的结晶基板的表面层的均匀失真,由从 在X射线穿透深度为0.3μm的平面间隔d1和在5μm的X射线穿透深度处的平面间距d2等于或小于1.9×10 -3,并且主表面具有倾斜的平面取向 相对于晶体基板的(0001)和(000-1)面之一等于或大于10°且等于或小于80°的角度的<10-10>方向。 因此,可以提供适合于制造抑制发射蓝移的发光器件的III族氮化物晶体衬底,含有外延层的III族氮化物晶体衬底,半导体器件及其制造方法。

    Semiconductor device and method of its manufacture
    99.
    发明授权
    Semiconductor device and method of its manufacture 有权
    半导体装置及其制造方法

    公开(公告)号:US08476086B2

    公开(公告)日:2013-07-02

    申请号:US11947752

    申请日:2007-11-29

    IPC分类号: H01L33/00

    摘要: Method of high-yield manufacturing superior semiconductor devices includes: a step of preparing a GaN substrate having a ratio St/S—of collective area (St cm2) of inversion domains in, to total area (S cm2) of the principal face of, the GaN substrate—of no more than 0.5, with the density along the (0001) Ga face, being the substrate principal face, of inversion domains whose surface area where the polarity in the [0001] direction is inverted with respect to the principal domain (matrix) is 1 μm2 or more being D cm−2; and a step of growing on the GaN substrate principal face an at least single-lamina semiconductor layer to form semiconductor devices in which the product Sc×D of the area Sc of the device principal faces, and the density D of the inversion domains is made less than 2.3.

    摘要翻译: 高产率制造方法优异的半导体器件包括:制备具有反向畴的总面积(St cm2)的St / S-与主面的总面积(S cm2)的GaN衬底的步骤, 所述GaN衬底的不大于0.5,其中沿[0001]方向的极性的表面积相对于所述主结构域反转的反转畴的(0001)Ga面的密度(作为衬底主面) (矩阵)为1mum2以上为Dcm-2; 并且在GaN衬底主体上生长至少单层半导体层以形成半导体器件的步骤,其中器件主要面积Sc的乘积Sc×D面向反射区域的密度D 小于2.3。