摘要:
The invention provides a method for processing register request, network element, and a communication system. The method for processing a register request of a terminal in a communication system that comprises a first network element (GSN) for providing IP networking service to said terminal, a second network element (P-CSCF) for providing SIP proxy service to said terminal, a third network element (S-CSCF) for providing SIP subscriber service to said terminal, and a fourth network element (HSS) for storing information about said terminal including said terminal's address; wherein the communication system further comprises a fifth network element (NAPT) for translating said terminal's address in between said first network element and said second network element; said method comprise: determining whether a message issued by said terminal for said register request has undergone Network Address Port Translation; indicating an address for address verification in said message based on the determination whether said message has undergone Network Address Port Translation; and verifying the address for address verification in said message against the information stored in said fourth network element.
摘要:
A compound having Formula I or II (Formula I) or (Formula II), or a pharmaceutically acceptable salt thereof, wherein X, Z, R1, R2, R11 and R12 are as defined in the specification; pharmaceutical compositions thereof; and methods of use thereof.
摘要:
A preparation process of wafer level chip scale packaging that prevents damaging a wafer in molding process is disclosed. In this process, a grinding grove is formed at a top side and around the edge of a wafer before molding is performed. The grinding groove effectively prevents the molding material from overflowing to the edge of the wafer, which avoids the damage of the wafer.
摘要:
Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.
摘要:
Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
摘要:
A semiconductor packaging process with improved die attach method for ultrathin chips package comprises the steps of providing a semiconductor wafer having a wafer frontside and a wafer backside with a plurality of integrated circuit chips (IC chips) formed on the wafer frontside; adhering a supporting substrate onto the wafer frontside through a bonding layer to form a wafer combo; grinding the wafer backside with the supporting substrate and the wafer bonded together; dicing the wafer combo into a plurality of die combos each comprising a substrate piece stacked on top of an IC chip bonded by a bonding layer piece; attaching a die combo onto a die pad of a lead frame with a bottom of the IC chip connected to the lead frame thereof; and removing the substrate piece with the bonding layer piece from the top surface of the IC chip.
摘要:
A compound having Formula I: or a pharmaceutically acceptable salt thereof, wherein X, R, R and R are as defined in the specification; pharmaceutical compositions thereof; and methods of use thereof. The compounds of Formula I are inhibitors of Casein kinase II (CK2) pathways.
摘要:
A compound according to formula I: or a pharmaceutically acceptable salt thereof; wherein R1, R2, R3a, R3b, R3c and R3d are as defined in the specification, pharmaceutical compositions thereof, and methods of use thereof.
摘要:
A compound according to Formula A: or a pharmaceutically acceptable salt thereof, wherein R11, G1 and G2 are as defined in the specification, pharmaceutical compositions thereof, and methods of use thereof.
摘要:
A humidifier includes a water storage tank, and an air passage and a filtering device in the water storage tank; the filtering device has a hollow holding portion therein, and magnetic members held in the hollow holding portion, which will make metallic substances adhere to the hollow holding portion when water is flowing through the filtering device; the filtering device has an annular wall between the hollow holding portion and an outer wall thereof; the filtering device has a flow passage, which exists next to inner and outer sides of the annular wall, and which is stuffed with ion exchange resin for filtering out minerals; the filtering device having a water inlet on an outward edge of a lower end thereof, and a water outlet on an inward edge of the lower end; therefore, unfiltered water is prevented from flowing to the heater through the air passage.