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    Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
    94.
    发明申请
    Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof 有权
    具有有源器件的同轴波导微结构及其形成方法

    公开(公告)号：US20140266515A1

    公开(公告)日：2014-09-18

    申请号：US14293696

    申请日：2014-06-02

    Applicant: Nuvotronics, LLC

    Inventor： David W. Sherrer ,  John J. Fisher

    IPC: H01P3/06 ,  H01P11/00

    CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

    Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。

    Resonance filter having low loss
    95.
    发明授权
    Resonance filter having low loss 有权
    共振滤波器具有低损耗

    公开(公告)号：US08736403B2

    公开(公告)日：2014-05-27

    申请号：US12937049

    申请日：2009-04-07

    Applicant: Bernhard Schönlinner ,  William Gautier

    Inventor： Bernhard Schönlinner ,  William Gautier

    IPC: H01P1/208 ,  H01P7/06

    CPC classification number: H01P1/2088 ,  H01P7/065 ,  H01P11/002 ,  H01P11/008

    Abstract: The present disclosure provides example resonance filters and methods for making the same. The resonance filter includes a first layer having n adjacent resonance cavities, n being at least 2 and said cavities each being separated from one another by a partition wall. The resonance filter also includes a second layer having at least n−1 coupling cavities. The cavities in the first layer are formed as resonance cavities and those in the second layer are formed as (a) coupling cavity/cavities and are open on one side. The second layer is arranged on the first layer in such a way that the resonance cavities in the first layer are interconnected by the coupling cavity/cavities in the second layer. Further, the resonance filter is configured as a monolithic component.

    Abstract translation: 本公开提供了示例性谐振滤波器及其制造方法。 谐振滤波器包括具有n个相邻谐振腔的第一层，n至少为2，并且所述空腔各自通过分隔壁彼此分离。 谐振滤波器还包括具有至少n-1个耦合腔的第二层。 第一层中的空腔形成为共振腔，第二层中的空腔形成为（a）耦合腔/空腔，并且在一侧开放。 第二层被布置在第一层上，使得第一层中的谐振腔通过第二层中的耦合空腔/空腔相互连接。 此外，谐振滤波器被配置为单片元件。

    Guiding devices for electromagnetic waves and process for manufacturing these guiding devices
    96.
    发明授权
    Guiding devices for electromagnetic waves and process for manufacturing these guiding devices 有权
    用于电磁波的引导装置和用于制造这些引导装置的过程

    公开(公告)号：US07986201B2

    公开(公告)日：2011-07-26

    申请号：US11744842

    申请日：2007-05-05

    Applicant: Jean-François Jarno ,  Christian Brylinski

    Inventor： Jean-François Jarno ,  Christian Brylinski

    IPC: H01P3/12

    CPC classification number: H01P11/002 ,  H01P3/12

    Abstract: The invention relates to electromagnetic wave guiding devices or waveguides (f

    Abstract translation: 本发明涉及电磁波导引装置或波导（f <10THz）以及用于制造这些波导的方法，其包括至少一个支撑至少一个活动壁（40）的主体（30）。 波导体（30）由选自以下的一定体积的陶瓷制成：碳化硅，氮化铝，氮化硼，尤其是3C型和2H型六方晶氮化硼，金刚石，氧化铍或所述 材料 应用：射频波和微波的波导，滤波器腔，反射器和天线，原子钟和粒子加速器。

    Low-Loss Millimeter-Wave Interface Comprising a Bare-Die
    97.
    发明申请
    Low-Loss Millimeter-Wave Interface Comprising a Bare-Die 有权
    低损耗毫米波接口包括裸芯片

    公开(公告)号：US20110140799A1

    公开(公告)日：2011-06-16

    申请号：US13031291

    申请日：2011-02-21

    Applicant: Yonatan Biran ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel ,  Yigal Leiba

    Inventor： Yonatan Biran ,  Elad Dayan ,  Baruch Schwarz ,  Amir Shmuel ,  Yigal Leiba

    IPC: H03H7/38 ,  H03H7/42

    CPC classification number: H01P5/107 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H01P3/121 ,  H01P5/08 ,  H01P11/002 ,  H01L2924/00014

    Abstract: A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.

    Abstract translation: 用于匹配裸片集成电路和接合线的阻抗的系统。 裸片集成电路被配置为以三个导电触点的Z3的阻抗输出或输入毫米波信号。 印刷在印刷电路板（PCB）的层叠之一上的三个导电焊盘分别通过三个接合线连接到三个导电触点，接合线具有Z1的特性阻抗，其中Z1> Z3。 导电焊盘中的一个延伸以形成长度为L的传输线信号迹线，传输线信号迹线具有导致Z2的特性阻抗的第一宽度，其中Z2> Z3。 在长度L之后，传输线信号迹线变宽到高于第一宽度的第二宽度，在传输线信号迹线的特征阻抗在长度L和之后降低到基本上Z3。

    Micromachined radio frequency circuit structures
    98.
    发明申请
    Micromachined radio frequency circuit structures 有权
    微加工射频电路结构

    公开(公告)号：US20110074528A1

    公开(公告)日：2011-03-31

    申请号：US12586962

    申请日：2009-09-30

    Applicant: Flavio Pardo ,  Robert F. Fullowan

    Inventor： Flavio Pardo ,  Robert F. Fullowan

    IPC: H01P3/12 ,  G03F7/20

    CPC classification number: H01P11/002 ,  H01P3/121 ,  H01P3/123 ,  H01P7/065

    Abstract: A radio frequency circuit structure for transmitting radio signals includes a lower guide portion having a plurality of photocurable layers deposited on a substrate and an upper guide portion interfacing with the lower guide portion to define a guiding geometry. The upper guide portion may also include a plurality of photocurable layers deposited on a second substrate. A method for fabricating the radio frequency circuit structure includes depositing the plurality of photocurable layers on the substrate. A portion of each photocurable layer of the plurality of photocurable layers is exposed to ultraviolet light to form a latent image. The plurality of photocurable layers is developed to remove the portions not exposed to ultraviolet light to form a guide portion. The guide portion may be metalized and closed to form a guiding geometry. A lower guide portion may be closed by an upper guide portion formed in substantially the same manner as the lower guide portion.

    Abstract translation: 用于发送无线电信号的射频电路结构包括具有沉积在基板上的多个可光固化层的下引导部分和与下引导部分接合以限定引导几何形状的上引导部分。 上引导部分还可以包括沉积在第二基底上的多个光固化层。 一种用于制造射频电路结构的方法包括将多个光固化层沉积在基底上。 多个光固化层的每个光固化层的一部分暴露于紫外光以形成潜像。 多个光固化层被显影以除去未暴露于紫外光的部分以形成引导部分。 引导部分可以被金属化和封闭以形成引导几何形状。 下引导部分可以由与下引导部分基本相同的方式形成的上引导部分封闭。

    Substrate Integrated Waveguide
    99.
    发明申请
    Substrate Integrated Waveguide 失效
    基板集成波导

    公开(公告)号：US20110018657A1

    公开(公告)日：2011-01-27

    申请号：US12922588

    申请日：2009-03-17

    Applicant: Shi Cheng ,  Karl Henrik Kratz ,  Hanna Ali Yousef

    Inventor： Shi Cheng ,  Karl Henrik Kratz ,  Hanna Ali Yousef

    IPC: H01P3/12 ,  H01P11/00

    CPC classification number: H01P3/121 ,  H01P11/002 ,  H05K1/024 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/4076 ,  H05K3/42 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2203/092 ,  H05K2203/1572 ,  Y10T29/49016

    Abstract: A substrate integrated waveguide (10) comprises a top conductive layer (14) and a bottom conductive layer (15) provided on either sides a substrate (11). At least one wall (12, 13) of conductive material is provided in the substrate (11) to define, together with the top and bottom layers (14, 15), the waveguide. The at least one wall (12, 13) comprise a multitude of thin conductive wires densely arranged close to each other in the substrate (11) and having respective short ends connected to the top and bottom layers (14, 15). The high number of wires per surface unit in the wall (12, 13) effectively prevent significant amount of power leakage through the wall (12, 13) during operation of the substrate integrated waveguide (10).

    Abstract translation: 衬底集成波导（10）包括设置在衬底（11）的两侧的顶部导电层（14）和底部导电层（15）。 导电材料的至少一个壁（12,13）设置在衬底（11）中以与顶层和底层（14,15）一起限定波导。 所述至少一个壁（12,13）包括在所述基板（11）中彼此靠近彼此密集布置并且具有连接到所述顶层和底层（14,15）的相应短端的多根细导线。 在基板集成波导（10）的操作期间，每个表面单元在壁（12,13）中的大量电线有效地防止了通过壁（12,13）的大量的电力泄漏。

    WAVEGUIDE TRANSITION ARRANGEMENT
    100.
    发明申请
    WAVEGUIDE TRANSITION ARRANGEMENT 有权
    波导过渡安排

    公开(公告)号：US20100289602A1

    公开(公告)日：2010-11-18

    申请号：US12810053

    申请日：2008-03-27

    Applicant: Per Ligander ,  Marcus Karl Hasselblad

    Inventor： Per Ligander ,  Marcus Karl Hasselblad

    IPC: H01P1/04

    CPC classification number: H01P1/042 ,  H01P3/121 ,  H01P11/002

    Abstract: The present invention relates to a transition arrangement comprising a first surface-mountable waveguide part (4), a second surface-mountable waveguide part (5) and a dielectric carrier material (1) with a metalization (M) provided on a first main side (2). Each waveguide part (4, 5) comprises a first wall (7, 10), a second wall (8, 11) and a third wall (9, 12), which second and third walls (8, 9; 11, 12) are arranged to contact a part of the metalization (M), where the surface-mountable waveguide parts (4, 5) are arranged to be mounted on the dielectric carrier material (1) in such a way that the surface-mountable waveguide parts (4, 5) comprise ends (4a, 5a) which are positioned to face each other. The transition arrangement further comprises an electrically conducting sealing frame (17) that is arranged to be mounted over the ends (4a, 5a), covering them, where the frame (17) has a first wall (18), a second wall (19) and a third wall (20), where the second and third walls (19, 20) are arranged to contact a part of the metalization (M).

    Abstract translation: 本发明涉及一种过渡装置，其包括第一表面安装的波导部分（4），第二可表面安装的波导部分（5）和介电载体材料（1），金属化（M）设置在第一主侧 （2）。 每个波导部分（4,5）包括第一壁（7,10），第二壁（8,11）和第三壁（9,12），所述第二壁和第三壁（8,9; 11,12） 被布置成接触金属化（M）的一部分，其中表面安装的波导部件（4,5）被布置成安装在电介质载体材料（1）上，使得表面安装的波导部件 4,5）包括位于彼此面对的端部（4a，5a）。 转换装置还包括导电密封框架（17），其布置成安装在端部（4a，5a）上方，覆盖它们，框架（17）具有第一壁（18），第二壁（19） ）和第三壁（20），其中所述第二和第三壁（19,20）布置成接触所述金属化（M）的一部分。

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