利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

1790 条记录 (耗时 0.027 秒)

    Integrated lamellae extraction station
    92.
    发明授权
    Integrated lamellae extraction station 有权

    公开(公告)号：US09821486B2

    公开(公告)日：2017-11-21

    申请号：US14066782

    申请日：2013-10-30

    申请人： FEI Company

    发明人： Kelly Bruland

    IPC分类号： B23K26/00 ,  G01N1/32 ,  B26D7/18 ,  G01N1/28

    CPC分类号： B26D7/18 ,  G01N1/286 ,  G01N1/32 ,  H01J2237/204 ,  H01J2237/208 ,  H01J2237/31745 ,  Y10T83/0467 ,  Y10T83/2074

    摘要： An integrated station for extracting specimens suitable for viewing by a transmission electron microscope from a patterned semiconductor wafer, including a wafer cassette holder; a wafer transfer device; a nanomachining device, including a scanning electron microscope and a focused ion beam, a vacuum load lock and an operator control device, and wherein the operator control device notes locations of created lamellae; a plucker device; a control computer, adapted to control the wafer transfer device and the plucker device, commanding the plucker device to remover lamellae at the locations noted by the operator control device; and a user monitor and data input device, communicatively coupled to the computer. The wafer transfer device can transfer wafers from the wafer cassette holder to the vacuum load lock; from the vacuum load lock to the plucker device and from the plucker device to the wafer cassette holder.

    POWER OPERATED ROTARY KNIFE WITH VACUUM ATTACHMENT ASSEMBLY
    96.
    发明申请
    POWER OPERATED ROTARY KNIFE WITH VACUUM ATTACHMENT ASSEMBLY 有权

    公开(公告)号：US20170210024A1

    公开(公告)日：2017-07-27

    申请号：US15424808

    申请日：2017-02-04

    申请人： Bettcher Industries, Inc.

    发明人： NICHOLAS A. MASCARI

    IPC分类号： B26D7/18 ,  A22C17/00 ,  A22B5/00 ,  B26B25/00

    CPC分类号： B26D7/1863 ,  A22B5/0017 ,  A22C17/0006 ,  B26B25/002 ,  B26D1/143 ,  B26D7/18

    摘要： A power operated rotary knife including: a handle assembly, a head assembly and a vacuum attachment assembly. The handle assembly includes an elongated cylindrical handle housing defining a handle assembly longitudinal axis extending through a throughbore of the handle housing. The head assembly including a rotary knife blade having an intermediate driven gear, a blade housing supporting the knife blade for rotation and a frame having a lower section and an upper section. A lower section of the blade housing extending laterally from the lower section of the frame and an upper section of the blade housing extending laterally from the upper section of the frame and encircling an axially extending portion of the rotary knife blade adjacent the driven gear. The blade housing including a bearing assembly including a first bearing member disposed in the lower section and a second bearing member disposed in the upper section.

    Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus
    98.
    发明授权
    Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus 有权

    公开(公告)号：US09685354B2

    公开(公告)日：2017-06-20

    申请号：US14676478

    申请日：2015-04-01

    申请人： XINTEC INC.

    发明人： Yen-Shih Ho ,  Tsang-Yu Liu ,  Chia-Sheng Lin ,  Yi-Ming Chang

    IPC分类号： B26D1/09 ,  H01L21/67 ,  H01L21/683 ,  B26D7/18

    CPC分类号： H01L21/67092 ,  B26D1/095 ,  B26D7/1863 ,  H01L21/6838 ,  Y10T83/0267 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/364

    摘要： An embodiment of this invention provides a separation apparatus for separating a stacked article, such as a semiconductor chip package with sensing functions, comprising a substrate and a cap layer formed on the substrate. The separation apparatus comprises a vacuum nozzle head including a suction pad having a top surface and a bottom surface, a through hole penetrating the top surface and the bottom surface of the suction pad, and a hollow vacuum pipe connecting the through hole to a vacuum pump; a stage positing under the vacuum nozzle head and substantially aligning with the suction pad; a control means coupling to the vacuum nozzle head to lift upward or lower down the vacuum nozzle head; and a first cutter comprising a first cutting body and a first knife connecting to the first cutting body. The cap layer is pressed against by the bottom surface of the suction pad and sucked by the suction pad of the vacuum nozzle head after the vacuum pump begins to vacuum the air within the hollow vacuum pipe and the through hole. Then, the first cutter cuts into the interface between the substrate and the cap layer, and the cap lay is separated from the substrate by the suction force of the vacuum nozzle head and the lift force generated by the upward movement of the vacuum nozzle head.