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公开(公告)号:US20240081153A1
公开(公告)日:2024-03-07
申请号:US18460890
申请日:2023-09-05
发明人: Masashi SAWAI
CPC分类号: H10N30/883 , A61B5/021 , A61B5/024 , A61B5/14542 , A61B5/681 , A61B5/7405 , H10N30/2047
摘要: A module includes a circuit board that is loaded with a biological information obtainer, a piezoelectric sounder that overlaps the circuit board and includes a piezoelectric body; and a cushion that is provided between the circuit board and the piezoelectric sounder. The piezoelectric sounder is arranged such that a center position of a surface of the piezoelectric body is offset from a center position of a surface of the circuit board.
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公开(公告)号:US20240080630A1
公开(公告)日:2024-03-07
申请号:US18499470
申请日:2023-11-01
发明人: Jinchi HAN , Jeffrey H. LANG , Vladimir BULOVIC
CPC分类号: H04R17/025 , H04R1/403 , H04R1/406 , H04R3/005 , H04R7/127 , H10N30/084 , H10N30/883 , H04R2400/01
摘要: An active acoustic system includes a thin-film sheet having an array of piezoelectric microstructures embossed in the film. Each piezoelectric microstructure may act as a speaker and/or a microphone. A control circuit is configured to individually address the piezoelectric microstructures to provide a separate voltage signal to, or receive a separate voltage signal from, each piezoelectric microstructure.
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公开(公告)号:US20240065334A1
公开(公告)日:2024-02-29
申请号:US18500821
申请日:2023-11-02
发明人: Vahid Hejazi
CPC分类号: A24F40/51 , A61M15/06 , H10N30/302 , H10N30/874 , H10N30/88 , A61M2205/0294
摘要: An aerosol delivery device includes a power source and an aerosol production component that is powerable to produce an aerosol from an aerosol precursor composition. The aerosol delivery device also includes processing circuitry configured to switchably connect the power source to a load that includes the aerosol production component and thereby power the aerosol production component. A piezo sensor is operatively coupled with the power source and the processing circuitry. The piezo sensor is configured to generate an electrical response to a deformation of the power source, and the electrical response is indicative of a characteristic of the deformation. The processing circuitry is configured to control the aerosol delivery device based at least in part on the characteristic of the deformation indicated by the electrical response.
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公开(公告)号:US11910720B2
公开(公告)日:2024-02-20
申请号:US17135257
申请日:2020-12-28
发明人: Eiji Osawa , Hikaru Iwai
IPC分类号: H01L41/04 , H01L41/053 , H10N30/87 , B41J2/14 , H10N30/02 , H10N30/88 , H10N30/80 , H10N30/20
CPC分类号: H10N30/875 , B41J2/14201 , H10N30/02 , H10N30/2047 , H10N30/802 , H10N30/88
摘要: Provided is a piezoelectric device and an MEMS device whose size can be reduced. The piezoelectric device includes: a first substrate that includes a first surface on which a piezoelectric element and a first electrode coupled to the piezoelectric element are disposed; a second substrate that includes a second surface on which a second electrode configured to be coupled to a control circuit is disposed; and a third substrate that is disposed between the first substrate and the second substrate, and includes a third surface bonded to the first surface and a fourth surface facing the second surface, in which the third substrate has a through hole passing through from the third surface to the fourth surface, and a third electrode provided in the through hole and coupled to the first electrode, and the second electrode is coupled to the third electrode and is electrically coupled to the first electrode via the third electrode.
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公开(公告)号:US20240049602A1
公开(公告)日:2024-02-08
申请号:US18381104
申请日:2023-10-17
申请人: InvenSense, Inc.
IPC分类号: H10N30/50 , H04R17/00 , H10N30/057 , H10N30/87 , H10N30/88
CPC分类号: H10N30/50 , H04R17/00 , H10N30/057 , H10N30/871 , H10N30/883
摘要: A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form in a central portion proximate a center of the open cavity and three or more rib portions projecting radially outward from the central portion.
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公开(公告)号:US20240009999A1
公开(公告)日:2024-01-11
申请号:US18253310
申请日:2021-10-21
申请人: ROHM CO., LTD.
发明人: Yoshikazu FUJIMORI
CPC分类号: B41J2/14274 , H10N30/10516 , H10N30/875 , H10N30/883 , H10N30/2023
摘要: An inkjet print head includes an actuator substrate that has an ink flow passage including a pressure chamber, a movable film formation layer that includes a movable film disposed on the pressure chamber and demarcating a top surface portion of the pressure chamber, a piezoelectric element that includes a lower electrode disposed on the movable film, a piezoelectric film formed on the lower electrode, and an upper electrode formed on the piezoelectric film, a hydrogen barrier film that covers at least entire side surfaces of the upper electrode and the piezoelectric film among surfaces of the piezoelectric element, an interlayer insulating film that is formed on the movable film formation layer such as to cover the hydrogen barrier film, and a wiring that is formed on the interlayer insulating film and is connected to the piezoelectric element and a fuse is inserted in an intermediate portion of the wiring.
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公开(公告)号:US20240009703A1
公开(公告)日:2024-01-11
申请号:US18471368
申请日:2023-09-21
发明人: Yi-Hsiang Chiu , Hung-Ping Lee
IPC分类号: B06B1/06 , G06V40/13 , H10N30/02 , H10N30/06 , H10N30/072 , H10N30/082 , H10N30/87 , H10N30/88 , H10N30/00 , H10N30/20
CPC分类号: B06B1/0622 , B06B1/0611 , G06V40/1329 , G06V40/1306 , H10N30/02 , H10N30/06 , H10N30/072 , H10N30/082 , H10N30/875 , H10N30/883 , H10N30/1071 , H10N30/2047
摘要: A wafer level ultrasonic device includes a composite layer, a first conductive layer, a second conductive layer, a base, a first electrical connection region, and a second electrical connection region. The composite layer includes an ultrasonic element and a protective layer. The ultrasonic element includes a first electrode and a second electrode. The protective layer has a first connecting channel and a second connecting channel respectively corresponding to the first electrode and the second electrode. The first conductive layer and the second conductive layer are respectively in the first connecting channel and the second connecting channel to connect the first electrode and the second electrode. The base includes an opening forming a closed cavity with the protective layer. The first electrical connection region and the second electrical connection region are respectively filled with metal materials to electrically connect the first conductive layer and the second conductive layer.
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公开(公告)号:US20240009702A1
公开(公告)日:2024-01-11
申请号:US18471004
申请日:2023-09-20
发明人: Yi-Hsiang Chiu , Hung-Ping Lee
IPC分类号: B06B1/06 , G06V40/13 , H10N30/02 , H10N30/06 , H10N30/072 , H10N30/082 , H10N30/87 , H10N30/88 , H10N30/00 , H10N30/20
CPC分类号: B06B1/0622 , B06B1/0611 , G06V40/1329 , G06V40/1306 , H10N30/02 , H10N30/06 , H10N30/072 , H10N30/082 , H10N30/875 , H10N30/883 , H10N30/1071 , H10N30/2047
摘要: A manufacturing method of a wafer level ultrasonic device includes: forming a first piezoelectric material layer, a first electrode material layer, a second piezoelectric material layer, and a second electrode material layer in sequence on a substrate; removing parts of those layers to form an ultrasonic element including a first electrode and a second electrode; forming a first protective layer on the ultrasonic element, and forming a first through hole and a second through hole exposing a part of the first electrode and a part of the second electrode; forming a first conductive layer and a second conductive layer on the first protective layer and connecting to the first electrode and the second electrode; forming a second protective layer; and connecting a base with an opening and the second protective layer in a vacuum environment to form a closed cavity.
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公开(公告)号:US20240000429A1
公开(公告)日:2024-01-04
申请号:US18369832
申请日:2023-09-18
申请人: Exo Imaging, Inc.
发明人: Yusuf HAQUE , Sandeep AKKARAJU , Janusz BRYZEK , Brian BIRCUMSHAW
IPC分类号: A61B8/00 , B06B1/06 , G01S7/52 , H10N30/88 , H10N30/00 , H10N30/20 , A61B8/08 , A61B8/14 , B06B1/02 , G01S7/521 , G01S15/89
CPC分类号: A61B8/4494 , B06B1/0692 , G01S7/52079 , H10N30/88 , H10N30/1051 , H10N30/2047 , H10N30/2048 , A61B8/0883 , A61B8/145 , A61B8/4488 , A61B8/461 , A61B8/5207 , B06B1/0238 , B06B1/0629 , G01S7/52046 , A61B8/546 , B06B1/0662 , G01S7/521 , G01S15/8925 , A61B8/4483 , A61B8/488 , B06B1/0215 , A61B8/4427 , A61B8/4472 , B06B2201/76
摘要: An imaging device includes a two dimensional array of piezoelectric elements. Each piezoelectric element includes: a piezoelectric layer; a bottom electrode disposed on a bottom side of the piezoelectric layer and configured to receive a transmit signal during a transmit mode and develop an electrical charge during a receive mode; and a first top electrode disposed on a top side of the piezoelectric layer; and a first conductor, wherein the first top electrodes of a portion of the piezoelectric elements in a first column of the two dimensional array are electrically coupled to the first conductor.
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公开(公告)号:US11856861B2
公开(公告)日:2023-12-26
申请号:US16767106
申请日:2018-11-23
发明人: Jonathan Chavanne , Yoan Civet , Yves Perriard
IPC分类号: H10N30/88 , A61M60/289 , A61M60/161 , A61M60/486 , A61M60/839 , A61M39/22 , A61M60/117 , H10N30/50 , H10N30/857
CPC分类号: H10N30/886 , A61M39/22 , A61M60/117 , A61M60/161 , A61M60/289 , A61M60/486 , A61M60/839 , H10N30/50 , F16F2228/063 , H10N30/857
摘要: A spring (3, 3′) comprising a plurality of elements (30), each element (3) comprising a rigid portion (31) and a flexible beam (32), the extremities (320, 321) of the flexible beam being supported by the rigid portion (31), the flexible beam (32) having a single stable position, so that the flexible beam can be deformed when a pressure is exerted between said extremities in the direction of the rigid portion (31), and returns to said single stable position when the pressure is released, and wherein the rigid portion (31) of at least one element (30) is in contact with the flexible beam (32) of the next element between said extremities (320, 321) of the flexible beam (32), so that the spring has a negative stiffness over an operating range. The arrangement ensures a pure radial compression/expansion of the spring.
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