公开(公告)号：US09409179B2

公开(公告)日：2016-08-09

申请号：US13579309

申请日：2011-02-21

申请人： Shigehisa Ueda ,  Kazuo Noda

发明人： Shigehisa Ueda ,  Kazuo Noda

IPC分类号： B02C4/02 ,  B02C4/32 ,  B02C4/44 ,  B29B13/10

CPC分类号： B02C4/02 ,  B02C4/32 ,  B02C4/44 ,  B29B13/10

摘要： A pulverizing apparatus for pulverizing a hard resin composition has a pulverizing mechanism having a pair of rollers arranged parallel to one another, these rollers pulverizing the hard resin composition by pressuring the hard resin composition between the rollers and a cooling device for cooling the hard resin composition during the hard resin composition being pulverized. Each of the rollers has a cylindrical shape with a hollow portion and the cooling device is configured to supply a coolant into the hollow portion of each of the rollers. The coolant flows in the hollow portion of each of the rollers in a longitudinal direction of each of the rollers. The cooling device has facilitating members respectively inserted into the hollow portions of the rollers.

摘要翻译： 用于粉碎硬质树脂组合物的粉碎装置具有一个具有彼此平行布置的一对辊的粉碎机构，这些辊通过将辊之间的硬树脂组合物加压和用于冷却硬树脂组合物的冷却装置来粉碎硬树脂组合物 在硬质树脂组合物被粉碎的过程中。 每个辊具有中空部分的圆柱形形状，并且冷却装置构造成将冷却剂供应到每个辊的中空部分中。 冷却剂沿每个辊的纵向在每个辊的中空部分中流动。 冷却装置具有分别插入辊的中空部分中的便利构件。

公开(公告)号：US20150369311A1

公开(公告)日：2015-12-24

申请号：US14765058

申请日：2014-01-28

申请人： SUMITOMO BAKELITE COMPANY LIMITED

发明人： Hideaki Inokuchi ,  Hidemi Yazawa

IPC分类号： F16D65/092 ,  F16D69/04 ,  F16D69/02

CPC分类号： F16D65/092 ,  F16D69/026 ,  F16D69/0408 ,  F16D2069/0441 ,  F16D2069/0466

摘要： A brake pad 10 can control rotating of a disc 200. The brake pad 10 includes a friction material 12 provided on a side of the disc and a back plate 11 bonded to the friction material on an opposite side of the disc 200. The back plate has a plurality of ridges 111 and/or a plurality of grooves 112 each formed on an entirety of a surface of the back plate on the side of the friction material so that longitudinal directions of the ridges and/or the grooves are inclined all together with respect to a rotational direction of the disc at a predetermined angle. The friction material is bonded to the back plate so as to make close contact with a surface defining each ridge and/or each groove and the surface of the back plate on the side of the friction material.

摘要翻译： 制动片10可以控制盘200的旋转。制动衬块10包括设置在盘的一侧的摩擦材料12和在盘200的相对侧上结合到摩擦材料的后板11.背板 具有多个脊111和/或多个凹槽112，每个脊形成在摩擦材料侧的背板的整个表面上，使得脊和/或凹槽的纵向方向全部与 相对于盘的旋转方向以预定角度。 所述摩擦材料与所述背板接合，以与所述摩擦材料侧面上限定每个脊和/或每个凹槽和所述背板的表面紧密接触。

公开(公告)号：US20150099332A1

公开(公告)日：2015-04-09

申请号：US14506040

申请日：2014-10-03

申请人： AKRON POLYMER SYSTEMS INC. ,  SUMITOMO BAKELITE COMPANY LIMITED

发明人： Limin SUN ,  Dong ZHANG ,  Jiaokai JING ,  Frank W. HARRIS ,  Hideo UMEDA ,  Toshihiko KATAYAMA ,  Jun OKADA ,  Mizuho INOUE ,  Manabu NAITO

IPC分类号： C08L77/06 ,  H01L51/52 ,  H01L51/44 ,  H01L51/56

CPC分类号： C08L77/06 ,  C08G69/32 ,  C09D177/10 ,  H01L51/448 ,  H01L51/5253 ,  H01L51/56 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/264 ,  Y10T428/31725

摘要： Provided are a resin composition and a substrate that are capable of being used for producing an electronic device including thin-film transistors having an excellent switching property. The resin composition contains an aromatic polyamide and a solvent dissolving the aromatic polyamide. The resin composition is used to form a layer, and a total light transmittance of the layer in a wavelength of 355 nm is 10% or less. Further, a method of manufacturing the electronic device using such a substrate is also provided.

摘要翻译： 提供能够用于制造具有优异的开关性能的薄膜晶体管的电子器件的树脂组合物和基板。 树脂组合物含有芳香族聚酰胺和溶解芳香族聚酰胺的溶剂。 树脂组合物用于形成层，并且在355nm的波长下的层的总透光率为10％以下。 此外，还提供了使用这种基板的电子器件的制造方法。

公开(公告)号：US08957532B2

公开(公告)日：2015-02-17

申请号：US13814968

申请日：2011-08-30

申请人： Yoshiyuki Takahashi ,  Hiroshi Utsugi

发明人： Yoshiyuki Takahashi ,  Hiroshi Utsugi

IPC分类号： H01L23/29 ,  B29C43/02 ,  C08G59/40 ,  C08G59/68 ,  B29B7/00

CPC分类号： B29C43/02 ,  B29B7/002 ,  C08G59/40 ,  C08G59/68 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention is related to a method for producing a resin compact containing an epoxy resin, a curing agent, a curing accelerator and an inorganic filler. The method includes a kneading and crushing process for preparing a first powder material obtained by mixing, heat-melting, kneading and crushing a first component containing the epoxy resin and the curing agent and the inorganic filler, but not containing the curing accelerator; a pulverizing process for preparing a second powder material obtained by pulverizing a second component containing the curing accelerator; a mixing process for preparing a resin composition by dispersing and mixing the first powder material and the second powder material; and a molding process for obtaining the resin compact by compression-molding the resin composition. This makes it possible to obtain a resin compact (particularly, a resin compact for encapsulation) having superior long term storage stability at room temperature, good curable property and fluidity.

摘要翻译： 本发明涉及一种含有环氧树脂，固化剂，固化促进剂和无机填料的树脂成形体的制造方法。 该方法包括捏合和粉碎工艺，用于制备通过混合，加热熔融，捏合和粉碎含有环氧树脂和固化剂的第一组分和无机填料而不含固化促进剂获得的第一粉末材料; 制备通过粉碎含有固化促进剂的第二成分获得的第二粉末材料的粉碎方法; 通过分散和混合第一粉末材料和第二粉末材料来制备树脂组合物的混合方法; 以及通过压缩树脂组合物来获得树脂压块的成型工艺。 这使得可以获得在室温下具有优异的长期储存稳定性，良好的可固化性和流动性的树脂成形体（特别是用于封装的树脂成形体）。

公开(公告)号：US20150014729A1

公开(公告)日：2015-01-15

申请号：US14376032

申请日：2013-03-14

申请人： SUMITOMO BAKELITE COMPANY LIMITED

发明人： Masaharu Ito ,  Keiichi Tsukurimichi

IPC分类号： H01L33/60 ,  C08L63/00

CPC分类号： H01L33/60 ,  C08G59/32 ,  C08G59/3218 ,  C08G59/3236 ,  C08G59/38 ,  C08K3/36 ,  C08L63/00 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/025 ,  C08L2205/03 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0033 ,  C08L63/06 ,  H01L2924/00014

摘要： A resin composition for reflecting light of the present invention includes an epoxy resin B having a unit structure X of alicyclic acid anhydride and a unit structure Y of hydrogenated bisphenol, and a colorant. The epoxy resin B preferably further has a unit structure Z of bisphenol-type epoxy. In addition, the resin composition for reflecting light of the present invention preferably further includes an epoxy resin A having a structure represented by the following formula (1). Then, when a content of the epoxy resin A is M [% by mass], and a content of the epoxy resin B is N [% by mass], it is preferable to satisfy a relationship of 0.1≦M/N≦10. (In the formula (1), R represents a monovalent organic group having 2 to 10 carbon atoms, and n represents an integer of 3 to 50.)

摘要翻译： 本发明的反射光用树脂组合物包括具有脂环酸酐的单元结构X和氢化双酚的单元结构Y的环氧树脂B和着色剂。 环氧树脂B优选还具有双酚型环氧树脂的单元结构Z。 此外，本发明的用于反射光的树脂组合物优选还包括具有由下式（1）表示的结构的环氧树脂A. 然后，当环氧树脂A的含量为M [质量％]，并且环氧树脂B的含量为N [质量％]时，优选满足0.1≤n1E; M /N≤NlE; 10 。 （式（1）中，R表示碳原子数2〜10的一价有机基团，n表示3〜50的整数。）

公开(公告)号：US08906147B2

公开(公告)日：2014-12-09

申请号：US13574841

申请日：2011-02-01

申请人： Kazuo Noda ,  Shigehisa Ueda

发明人： Kazuo Noda ,  Shigehisa Ueda

IPC分类号： B01D19/00 ,  B29B7/84 ,  B29C47/76 ,  B29C47/60 ,  B29C47/38 ,  B29C47/00

CPC分类号： B29B7/847 ,  B01D19/0036 ,  B29C47/0009 ,  B29C47/38 ,  B29C47/6056 ,  B29C47/765

摘要： A degassing apparatus 1 includes a housing 2 having a degassing chamber 22, a rotor 3 rotatably provided in the housing 2 and a decompressing mechanism 4 for decompressing the degassing chamber 22 of the housing 2. The housing 2 further includes a conduit line 21 and a cylindrical portion 23. The degassing chamber 22 is provided in a middle part of the conduit line 21. An upper end of the conduit line 21 constitutes an inlet port 24 and a lower end of the conduit line 21 constitutes an outlet port 25. The rotor 3 is rotatably provided inside the cylindrical portion 23 so that a passage between the outlet portion 25 and the degassing chamber 22 can be hermetically separated by the rotor 3. The rotor 3 has four partitioning plates 31 which partition the inside of the cylindrical portion into four spaces 231-234.

摘要翻译： 脱气装置1包括具有脱气室22的壳体2，可旋转地设置在壳体2中的转子3和用于使壳体2的脱气室22减压的减压机构4.壳体2还包括导管21和 脱气室22设置在导管21的中间部分。导管21的上端构成入口24，导管21的下端构成出口25.转子 3可旋转地设置在圆筒部23的内部，使得出口部分25和脱气室22之间的通道可以被转子3气密地分开。转子3具有四个分隔板31，其将圆筒部分的内部分成四个 空格231-234。

公开(公告)号：US08888477B2

公开(公告)日：2014-11-18

申请号：US13393092

申请日：2010-07-09

申请人： Daisuke Hirokane ,  Akiharu Satoh ,  Masami Yamazaki

发明人： Daisuke Hirokane ,  Akiharu Satoh ,  Masami Yamazaki

IPC分类号： B29C43/08 ,  B29C33/60 ,  B29C33/64 ,  B29C33/62 ,  B29C43/36 ,  B29C33/58

CPC分类号： B29C33/58 ,  B29C33/62 ,  B29C33/64 ,  B29C43/36 ,  B29C2043/3618 ,  B30B15/0011

摘要： A molded product production device that includes a molding die having an inner circumferential surface defining a cavity with upper and lower openings, the cavity into which the molding material is to be filled, a lower punch provided so as to be inserted into the cavity from the lower opening thereof and vertically move, the lower punch having a lower punch surface and a lower punch release agent holding portion which is provided at a lower side of the lower punch surface and capable of holding a release agent, an upper punch provided so as to be inserted into the cavity from the upper opening thereof and vertically move, the upper punch having an upper punch surface, and a lower punch release agent supply means which supplies the release agent to the lower punch release agent holding portion when being exposed outside the cavity.

摘要翻译： 一种模制产品生产装置，其包括具有限定具有上开口和下开口的空腔的内周表面的成型模具，所述模制材料将被填充到其中的空腔，设置成从所述腔体中插入所述腔体的下冲头 其下开口和垂直移动，下冲头具有下冲头表面和下冲头脱模剂保持部分，其设置在下冲头表面的下侧并且能够保持脱模剂，上冲头设置成 从其上开口插入空腔中，上冲头具有上冲头表面，并且下冲头脱模剂供给装置在暴露在腔体外部时将脱模剂供给下冲头脱模剂保持部分 。

公开(公告)号：US20140273686A1

公开(公告)日：2014-09-18

申请号：US14359505

申请日：2012-11-06

申请人： SUMITOMO BAKELITE COMPANY LIMITED

发明人： Toshimasa Eguchi ,  Hideo Umeda ,  Manabu Naito ,  Hiroyuki Otsuka

IPC分类号： C03C25/28

CPC分类号： C03C25/285 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  G02F1/133305 ,  Y10T442/2041 ,  Y10T442/2992

摘要： A transparent composite substrate according to the present invention includes a composite layer containing a glass cloth formed of an assembly of glass fibers and a resin material impregnated in the glass cloth. The resin material has an Abbe number of equal to or larger than 45. The assembly of the glass fibers itself has a variation in a refractive index and a difference between a maximum value and a minimum value of the refractive index is equal to or less than 0.01. This makes it possible to provide a transparent composite substrate having superior optical characteristics and a high-reliable display element substrate using the transparent composite substrate. Further, the resin material preferably contains an alicyclic epoxy resin or an alicyclic acrylic resin as a major component thereof.

摘要翻译： 根据本发明的透明复合基材包括含有由玻璃纤维组合物和浸渍在玻璃布中的树脂材料组成的玻璃布的复合层。 树脂材料具有等于或大于45的阿贝数。玻璃纤维本身的组装具有折射率的变化，折射率的最大值和最小值之间的差等于或小于 0.01。 这使得可以提供具有优异光学特性的透明复合基板和使用透明复合基板的高可靠性显示元件基板。 此外，树脂材料优选含有脂环族环氧树脂或脂环族丙烯酸树脂作为其主要成分。

公开(公告)号：US20140046003A1

公开(公告)日：2014-02-13

申请号：US14036539

申请日：2013-09-25

申请人： Sumitomo Bakelite Company Limited

发明人： Hideyuki SHIMAOKA ,  Shinichiro NISHIMURA ,  Yasuro SHINOHARA ,  Yoshiaki MIURA ,  Jun-ichi FURUKAWA

IPC分类号： C08F122/38

CPC分类号： C08J3/24 ,  C07C233/20 ,  C07C271/08 ,  C07C281/02 ,  C08F8/30 ,  C08F122/38 ,  C08F2222/1013 ,  G01N33/5308 ,  G01N2030/027 ,  G01N2030/8813 ,  G01N2030/8836 ,  Y02P20/55 ,  Y10T428/2982 ,  C08F220/60

摘要： The present invention provides a method for preparing a sample characterized by binding a substance A containing a hydrazide group to a sugar chain and/or a sugar derivative via hydrazone formation between the hydrazide group of the substance A and the reducing end of the sugar chain and/or the sugar derivative thereby to enable the separation and purification of the sugar chain and/or the sugar derivative for an analytical sample from a biological sample containing the sugar chain and/or the sugar derivative by a simple operation.

公开(公告)号：US20110006419A1

公开(公告)日：2011-01-13

申请号：US12866108

申请日：2009-02-06

申请人： Takashi Hirano

发明人： Takashi Hirano

IPC分类号： H01L23/498 ,  H01L21/50 ,  C09J7/02 ,  B32B5/16 ,  C08K5/1535

CPC分类号： H01L23/295 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  H01L21/6836 ,  H01L24/16 ,  H01L24/29 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/27436 ,  H01L2224/29111 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A film for use in manufacturing a semiconductor device having at least one semiconductor element of the present invention is characterized by comprising: a base sheet having one surface; and a bonding layer provided on the one surface of the base sheet, the bonding layer being adapted to be bonded to the semiconductor element in the semiconductor device, the bonding layer being formed of a resin composition comprising a crosslinkable resin and a compound having flux activity. Further, it is preferred that in the film of the present invention, the semiconductor element is of a flip-chip type and has a functional surface, and the bonding layer is adapted to be bonded to the functional surface of the semiconductor element.

摘要翻译： 用于制造具有本发明的至少一个半导体元件的半导体器件的薄膜的特征在于包括：具有一个表面的基片; 以及设置在所述基片的一个表面上的接合层，所述接合层适于与所述半导体器件中的所述半导体元件接合，所述接合层由包含可交联树脂和具有助焊剂活性的化合物的树脂组合物形成 。 此外，优选在本发明的膜中，半导体元件为倒装型，具有功能面，并且接合层适于与半导体元件的功能面接合。