Abstract:
The present invention relates to a semiconductor device and a method of manufacture thereof, particularly, to a semiconductor device including a vertical type gate and a method of forming the same. According to the present invention, a semiconductor device includes a vertical pillar which is protruded from a semiconductor substrate, has a vertical channel, and has a first width; an insulating layer which has a second width smaller than the first width, provided in both sides of the vertical pillar which is adjacent in a first direction; and a nitride film provided in a side wall of the insulating layer.
Abstract:
Disclosed is a color conversion method, the method including the steps of (a) converting a color using an approximation technique, and (b) correcting an error of the color using a preset error correction table containing information regarding a difference between a color channel based on an original conversion formula and a color channel based on the approximation technique.
Abstract:
A method and a terminal for providing a route in a navigation system using a satellite image are provided. The terminal includes a route calculation unit for calculating a route from a current location to a destination when a user inputs the destination, a satellite image requesting unit for requesting a satellite image server for satellite images corresponding to locations on the route and for downloading the requested satellite images, a satellite image storage unit for storing the downloaded satellite images, and a controller for retrieving a satellite image corresponding to the current location from the satellite image storage unit and for displaying the retrieved satellite image simultaneously while downloading the satellite images corresponding to the locations on the route.
Abstract:
Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post.
Abstract:
A mobile communications terminal and a method for preventing an input error of a key input unit are provided. The mobile communications terminal includes a touch sensor unit for sensing a key that is input by touching a keypad region in order to output a key input signal corresponding to the key and a controller adapted to determine a key input according to either a priority between multiple keys from which key signals are received or whether a received key signal was generated inadvertently.
Abstract:
A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing prevention portion is formed on the top surface of the head portion and prevents a solder paste from flowing toward the coupling pin on the top surface of the head portion when the head portion is mounted on the package substrate.
Abstract:
Provided are a substrate with built-in electronic component and a method for manufacturing the same. The method for manufacturing a substrate with built-in electronic component includes: forming conductive temporary bumps which penetrate and protrude through a prepreg sheet; mounting and attaching an electronic component on the protruding temporary bumps; forming an embedded substrate by laminating other prepreg sheet on the attached electronic component layer, laminating a metal sheet on a bottom of a laminate or on a bottom and top of the laminate, and pressing the prepreg sheets and the metal sheet; forming contact grooves by removing partial regions of the metal sheet and by removing the temporary bumps exposed by the removal of the metal sheet regions; and filling the contact grooves with a conductive metal and forming a circuit pattern.
Abstract:
One or more mobile devices make measurements while moving along a path. Each measurement may comprise a specific group of identifiers of wireless transmitters, and strengths of corresponding wireless signals. A set of measurements are made in a sequence along a path, and the subsets of the measurements are identified for satisfying a test on a value of a measure of similarity of measurements included in the subset. A new place of relevance is identified, by comparing the just-described subsets of the measurements with similar subsets of additional measurements (e.g. by clustering). Alternatively, a known place of relevance (e.g. having a label) is identified, by comparing the just-described subsets of the measurements with pre-computed model of measurements. Also, the just-described subsets of the measurements may be compared with corresponding subsets of measurements of another path, e.g. to identify common portions therein.
Abstract:
A vision assistance device includes a lens based on a transparent material, a conductive transparent thin film contacting the lens and containing carbon nanotubes, electrodes electrically connected to the conductive transparent thin film, and a portable power supply electrically connected to the electrodes. The vision assistance device prevents fogging and retains heat.
Abstract:
Provided is a parallelism control apparatus of a movable platen of an electric injection molding machine, to which a new arrangement type using a wedge to control the parallelism of a movable platen is applied to reduce the size of the parallelism control apparatus, ensure an installation space, and solve a difficulty during installation, which ensures rigidity of the movable platen in directions of forward and rearward movements, and enables parallelism adjustment and firm position fixing by controlling a vertical amount, a horizontal amount, and a combination of vertical and horizontal amounts even in a narrow space, thereby further enhancing precision and quality reliability of molded products.