公开(公告)号：US4848642A

公开(公告)日：1989-07-18

申请号：US133087

申请日：1987-12-15

Applicant: Kenshi Kondo

Inventor： Kenshi Kondo

IPC: B23K3/06

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: An apparatus for soldering printed circuit boards moving along a predetermined path of travel, comprises an upwardly extending nozzle member having an opening at its top end from which molten solder is caused to overflow to form an overflowing molten solder with which the underside surface of the printed circuit board is contacted, and an adjustable outlet member rotatably disposed in the opening to define an outlet extending in the direction transverse to the path of travel, so that by adjusting the angular position of the outlet member the orientation of the outlet may be varied for adjustment of the direction and height of the overflowing solder.

公开(公告)号：US4824010A

公开(公告)日：1989-04-25

申请号：US920142

申请日：1986-10-17

Applicant: Takao Inoue ,  Keiji Saeki ,  Chuichi Matsuda ,  Schuichi Murakami

Inventor： Takao Inoue ,  Keiji Saeki ,  Chuichi Matsuda ,  Schuichi Murakami

IPC: B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0653 ,  B23K1/08 ,  B23K2201/42 ,  H05K3/34 ,  H05K3/3442 ,  H05K3/3468

Abstract: At least one chip type component is soldered to a printed circuit board by independent first and second nozzles which spout molten solder so as to form respective first and second solder waves, with the printed circuit board sequentially passed through the first and second nozzles. The first and second solder waves define therebetween a space and flow at least in a direction of movement of the printed circuit board and in a direction counter to the direction of movement of the printed circuit board, respectively. The second nozzle is disposed at a level higher than the first nozzle such that the printed circuit board is moved obliquely upwardly.

Abstract translation: 通过独立的第一和第二喷嘴将至少一个芯片型部件焊接到印刷电路板，所述第一和第二喷嘴喷射熔融焊料，以便形成相应的第一和第二焊波，印刷电路板顺序地通过第一和第二喷嘴。 第一和第二焊波分别在印刷电路板的移动方向和与印刷电路板的移动方向相反的方向上分别形成空间和流动。 第二喷嘴设置在高于第一喷嘴的水平面上，使得印刷电路板向上倾斜移动。

公开(公告)号：US4802617A

公开(公告)日：1989-02-07

申请号：US158308

申请日：1988-02-19

Applicant: Carlos A. Deambrosio

Inventor： Carlos A. Deambrosio

IPC: B23K3/06

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: An improved method and apparatus restricts or limits dross formation in a soldering apparatus where liquid solder overflows such as wave soldering and the like. The improvement comprises a solder receiving tray positioned beneath at least a portion of liquid solder falling from an overflow or solder wave to a reservoir and a level control means limits the maximum solder level in the tray above a dynamic solder level in the reservoir, the solder level in the tray being a predetermined distance below the overflow to limit dross formation thus restricting dross recirculation.

Abstract translation: 一种改进的方法和装置限制或限制了液体焊料如波峰焊等溢出的焊接装置中的浮渣形成。 该改进包括位于至少一部分从溢流或焊波下降到储存器的液态焊料下方的焊料接收托盘，并且液位控制装置将托盘中的最大焊料水平限制在储存器中的动态焊料水平面上方，焊料 托盘中的水平面是在溢流以下的预定距离以限制浮渣形成，从而限制浮渣再循环。

公开(公告)号：US4782991A

公开(公告)日：1988-11-08

申请号：US124714

申请日：1987-11-24

Applicant: Dennis L. Breu

Inventor： Dennis L. Breu

IPC: B23K1/00 ,  B23K3/00 ,  H05K13/04 ,  B23K3/06 ,  B23K37/06

CPC classification number: H05K13/0486 ,  B23K1/00 ,  B23K3/00 ,  B23K2201/42

Abstract: A solder reflow machine for removing and replacing electronic components of the pin-grid array type having a large number of leads soldered into a very densely populated printed circuit board. The machine utilizes a heat-transfer liquid and a vacuum to remove the component from the board. The printed circuit board is positioned with the component facing downwardly. A tank containing the heat-transfer liquid is located below the printed circuit board. The apparatus includes a solder reflow head which has a component-engaging vacuum plate with a central opening that is in communication with a vacuum source through a pipe which is pulled downwardly to remove the component. The component is surrounded by a wall in combination with the bottom of the printed circuit board and seals off the liquid flow path. The heat-transfer liquid is pumped up through a pipe that extends into a storage tank so that it flows into, an input passageway in the solder reflow head over the component leads to reflow the solder and down an exit passageway.

Abstract translation: 一种用于去除和更换具有焊接到非常密集的印刷电路板中的大量引线的针阵列型的电子部件的焊料回流焊机。 该机器利用传热液体和真空从板上去除组件。 印刷电路板位于组件朝下的位置。 包含传热液体的罐位于印刷电路板的下方。 该装置包括一个焊料回流焊头，该焊料回流焊头具有一个具有中心开口的部件接合真空板，该中心开口通过一个管子与真空源连通，该管被向下拉以去除该部件。 该部件由与印刷电路板的底部组合的壁包围并密封液体流动路径。 传热液体通过延伸进入储罐的管道被泵送，使其流入，组件上的回流焊头中的输入通道导致焊料回流并向下排出通道。

公开(公告)号：US4778099A

公开(公告)日：1988-10-18

申请号：US129637

申请日：1987-12-07

Applicant: David R. Dines

Inventor： David R. Dines

IPC: B23K1/20 ,  B23K3/00 ,  H01R43/02 ,  B23K31/02 ,  H05K3/34

CPC classification number: H01R43/0256 ,  B23K1/20 ,  B23K3/00 ,  B23K2201/42

Abstract: The present invention is directed to a method for soldering each of a plurality of members (40), arranged in one or more parallel rows, to a separate one of a plurality of metallized pads (42) on a substrate (10), each pad being contiguous with a corresponding member. The method is initiated by tilting the substrate so that one end of each row of members and the metallized pads contiguous therewith are at a higher elevation than the other end. A stream (80) of molten solder and a dripping stream (88) of flux droplets are directed onto the substrate into the regions where the members are contiguous with the metallized pads. Simultaneously, the substrate is displaced relative to the streams along a path (96) inclined with respect to the horizontal and parallel to the rows of members so that the members and the metallized pads are successively coated with solder and then flux. The inclination of the substrate is such that the solder and flux flow downwardly, under gravity, past a successive one of the members and metallized pads. The force of gravity on the solder, together with the presence of the flux, is sufficient to break the surface tension of the solder between adjacent members to prevent a solder bridge therebetween.

Abstract translation: 本发明涉及一种用于将以一个或多个平行排布置的多个构件（40）中的每一个焊接到衬底（10）上的多个金属化焊盘（42）中的单独一个的方法，每个衬垫 与对应的成员相邻。 该方法是通过使衬底倾斜而引起的，使得每排构件的一端和与其相邻的金属化衬垫处于比另一端更高的高度。 将熔融焊料的流（80）和焊剂液滴的滴流（88）引导到基板上，使其与金属化焊盘邻接。 同时，衬底相对于流沿着相对于水平方向倾斜且平行于构件行的路径（96）移位，使得构件和金属化衬垫连续地涂覆有焊料，然后焊剂。 衬底的倾斜度使得焊料和焊剂在重力作用下向下流过连续的一个构件和金属化焊盘。 焊料上的重力与助焊剂的存在一起足以破坏相邻构件之间的焊料的表面张力，以防止其间的焊接桥。

公开(公告)号：US4775776A

公开(公告)日：1988-10-04

申请号：US880798

申请日：1986-07-01

Applicant: Armin Rahn ,  Sabi Avramescu ,  Marcel Drouin

Inventor： Armin Rahn ,  Sabi Avramescu ,  Marcel Drouin

IPC: B23K1/08 ,  B23K3/04 ,  B23K3/06 ,  G05D23/19 ,  H01R43/02 ,  H05K3/34 ,  F27B9/06

CPC classification number: B23K3/0653 ,  B23K1/085 ,  B23K3/04 ,  G05D23/1917 ,  H01R43/02 ,  H05K3/3494 ,  B23K2201/42 ,  H05K2203/163 ,  H05K3/3468

Abstract: A multi stage heater heats items on a conveyor so that they follow a predetermined temperature profile. The heater is used for printed circuit boards or the like when heated for soldering and avoids thermal gradients that can occur with heating different materials. The heater has a first heater for applying a first quantity of heat to items on the conveyor, a temperature sensing device for determining temperature of items leaving the first heater, a second heater downstream of the first heater and a control system which compares signals from the temperature sensing device with a predetermined temperataure profile to produce a first control output to control the first heater and a second control output to control the second heater so that items passing through the heater follow the predetermined temperature profile.

Abstract translation: 多级加热器加热输送机上的物品，使其遵循预定的温度曲线。 加热器用于加热焊接​​时的印刷电路板等，并避免加热不同材料时可能发生的热梯度。 加热器具有第一加热器，用于将第一热量施加到输送机上的物品，温度感测装置，用于确定离开第一加热器的物品的温度，第一加热器下游的第二加热器;以及控制系统， 温度感测装置具有预定的温度曲线以产生第一控制输出以控制第一加热器和第二控制输出以控制第二加热器，使得通过加热器的物品遵循预定的温度分布。

公开(公告)号：US4757780A

公开(公告)日：1988-07-19

申请号：US865232

申请日：1986-05-20

Applicant: Donald J. Spigarelli ,  Douglas J. Peck ,  Walter J. Hall ,  James L. Finney

Inventor： Donald J. Spigarelli ,  Douglas J. Peck ,  Walter J. Hall ,  James L. Finney

IPC: B23K1/015 ,  B23K1/018 ,  B23K1/08 ,  H05K3/34 ,  H05K3/24 ,  B05C3/10

CPC classification number: H05K3/34 ,  B23K1/015 ,  B23K1/018 ,  B23K1/085 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/044 ,  H05K2203/0746 ,  H05K2203/0776 ,  H05K2203/088 ,  H05K2203/1509

Abstract: A vapor phase system for soldering of a workpiece. A vessel for containing an electronic liquid which is heated to generate a zone of saturated vapor. A first inclined throat communicates with the vessel and a solder pot is located within the vessel. The solder pot including a reservoir for containing molten solder, a second throat aligned with the first throat and communicating at one end with molten solder contained in the reservoir means and communicating at the other end with the saturated vapor, molten solder contained in the reservoir means is pumped through the second throat and is captured by the reservoir and a conveyor carries work product through the first throat, through the saturated vapor and into the second throat whereby the work product will become immersed in the molten solder contained within the second throat.

Abstract translation: 用于焊接工件的气相系统。 用于容纳电子液体的容器，其被加热以产生饱和蒸汽区域。 第一倾斜喉管与容器连通，并且容器内设有焊锡锅。 焊料罐包括用于容纳熔融焊料的储存器，与第一喉部对准的第二喉部，并且在一端与包含在储存器装置中的熔融焊料连通，并且在另一端与在储存器装置中包含的饱和蒸气，熔融焊料连通 被泵送通过第二喉管并且被储存器捕获，并且输送器通过第一喉管，通过饱和蒸气并将其运送到第二喉部，由此工件将浸入包含在第二喉部内的熔融焊料中。

公开(公告)号：US4739919A

公开(公告)日：1988-04-26

申请号：US61760

申请日：1987-06-15

Applicant: Jacques Van Den Brekel ,  Hector Pitre

Inventor： Jacques Van Den Brekel ,  Hector Pitre

IPC: B23K37/06 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3452 ,  B23K37/06 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/0557 ,  H05K2203/1572 ,  H05K2203/304 ,  H05K3/3415 ,  H05K3/3447

Abstract: A soldering mask for soldering the leads of leaded components to a circuit pattern on a surface of a circuit board also having surface mounted components already soldered to the circuit pattern on that surface, comprises a flat metal plate having a recess in the top surface of the plate for reception of the circuit board. Cavities in the bottom surface of the recess house the surface mounted components. Openings through the plate from the bottom surface of the recess permit passage of leads and also permit access by the solder to solder the leads to the circuit pattern.

Abstract translation: 用于将引线元件的引线焊接到电路板表面上的电路图案的焊接掩模也具有已经焊接到该表面上的电路图案的表面安装元件，该平板金属板在其表面上具有凹陷 板接收电路板。 凹槽底面的凹坑容纳表面安装的部件。 从凹槽的底表面穿过板的开口允许引线通过，并且还允许焊料进入以将引线焊接到电路图案。

公开(公告)号：US4700877A

公开(公告)日：1987-10-20

申请号：US842317

申请日：1986-03-21

Applicant: Ralph G. Dodds ,  Patrick B. Ryan

Inventor： Ralph G. Dodds ,  Patrick B. Ryan

IPC: H01R43/02 ,  B23K20/12 ,  B23K37/04

CPC classification number: H01R43/0256 ,  B23K2201/42 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49213 ,  Y10T29/53183 ,  Y10T29/53265

Abstract: A machine for bonding connectors to the edge of a pcb by a Luc process has upper and lower wheels which are translated along the edge of the pcb for engaging the connectors to be applied respectively to the faces of the board. The relative position of the wheels at any given time is determined by mounting one of them to move with a jaw which closes down onto one of the faces.

Abstract translation: 用于通过Luc处理将连接器连接到pcb的边缘的机器具有沿着pcb边缘平移的上轮和下轮，用于将连接器分别接合到板的表面。 车轮在任何给定时间的相对位置是通过将其中一个安装在与其中一个面相连的颚板上移动来确定的。

公开(公告)号：US4620663A

公开(公告)日：1986-11-04

申请号：US702740

申请日：1985-02-19

Applicant: Hitoshi Odashima ,  Hideaki Sasaki ,  Shinichi Kazui ,  Shigeo Shiono ,  Osamu Isshiki ,  Takeshi Kawana

Inventor： Hitoshi Odashima ,  Hideaki Sasaki ,  Shinichi Kazui ,  Shigeo Shiono ,  Osamu Isshiki ,  Takeshi Kawana

IPC: B23K1/005 ,  B23K26/08 ,  H05K3/30 ,  H05K3/34 ,  H05K13/00 ,  H05K13/04 ,  B23K37/04 ,  B23K31/02

CPC classification number: H05K13/0061 ,  B23K1/0056 ,  B23K26/0838 ,  H05K13/0465 ,  H05K3/303 ,  H05K3/3421 ,  B23K2201/42 ,  H05K2201/10689 ,  H05K2203/104 ,  H05K2203/107 ,  H05K3/3494 ,  Y02P70/613

Abstract: An apparatus for connecting wiring patterns on a wiring board and leads of a parts to be mounted on the wiring board, via the solder provided between the leads and the patterns. The parts-connecting apparatus enables, especially, circuit elements of a high degree of, to be connected automatically with high reliability and accuracy by using solder through the steps of setting the wiring board in a predetermined position while pressing a surface thereof so as to remove the warp from the wiring board, fastening the leads of the part to the wiring patterns by a magnet provided on the lower surface of the wiring board, and heating the solder provided on the portions of the leads which are fastened to the wiring patterns.

Abstract translation: 一种用于通过设置在引线和图案之间的焊料，将布线板上的布线图案和要安装在布线板上的部件的引线相连接的装置。 部件连接装置尤其能够通过使用焊料，通过将电路板设置在预定位置的同时按压其表面从而自动地以高可靠性和精度自动连接，从而能够高效地连接电路元件， 来自布线板的翘曲，通过设置在布线板的下表面上的磁体将部件的引线紧固到布线图案，以及加热设置在紧固到布线图案的引线部分上的焊料。