Abstract:
An organic thin film transistor array substrate including a substrate divided into an LCD region and an OTFT region; a first dielectric layer formed on the substrate in the LCD region and having a first uneven portion; an organic semiconducting layer formed on the substrate in the OTFT region; a gate, source, and drain formed in the OTFT region, wherein the source and drain are in contact with the organic semiconducting layer to form a channel between the source and drain; and a pixel electrode formed on the first uneven portion of the first dielectric layer in the LCD region.
Abstract:
A method for defining a layout of 3-D devices, such as a finFET, is provided. The method includes determining an area required by a desired 3-D device and designing a circuit using planar devices having an equivalent area. The planar device corresponding to the desired 3-D device is used to layout a circuit design, thereby allowing circuit and layout designers to work at a higher level without the need to specify each individual fin or 3-D structure. Thereafter, the planar design may be converted to a 3-D design by replacing planar active areas with 3-D devices occupying an equivalent area.
Abstract:
A semiconductor structure and methods of forming the same are provided. The semiconductor structure includes a semiconductor substrate; a first inter-layer dielectric (ILD) over the semiconductor substrate; a contact extending from a top surface of the first ILD into the first ILD; a second ILD over the first ILD; a bottom inter-metal dielectric (IMD) over the second ILD; and a dual damascene structure comprising a metal line in the IMD and a via in the second ILD, wherein the via is connected to the contact.
Abstract:
A semiconductor device with improved source/drain junctions and methods for fabricating the device are disclosed. A preferred embodiment comprises a MOS transistor with a gate structure overlying a substrate, lightly doped source/drain regions formed in the substrate aligned to the gate structure, sidewall spacers formed on the sidewalls of the gate structure and overlying the lightly doped source/drain regions, deeper source/drain diffusions formed into the substrate aligned to the sidewall spacers and additional pocket implants of source/drain dopants formed at the boundary of the deeper source/drain diffusions and the substrate. In a preferred method, the additional pocket implants are formed using an angled ion implant with the angle being between 4 and 45 degrees from vertical. Additional embodiments include recesses formed in the source/drain regions and methods for forming the recesses.
Abstract:
An assembly of a NanoCell comprising a disordered array of metallic islands interlinked with molecules between metallic input/output leads and with disordered arrays of molecules and Au islands is disclosed. The NanoCell may function both as a memory device that is programmable post-fabrication. The assembled NanoCells exhibit reproducible switching behavior and at least two types of memory effects at room temperature. The switch-type memory is characteristic of a destructive read while the conductivity-type memory features a nondestructive read. Both types of s memory effects are stable for more than a week at room temperature and bit level ratios (0:1) of the conductivity-type memory have been observed to be as high as 104:1 and reaching 106:1 upon ozone treatment which likely destroys extraneous leakage pathways. The invention demonstrates the efficacy of a disordered
Abstract:
A method for cleaning and forming an oxide film on a surface, particularly a silicon surface. The surface is initially cleaned and then exposed to ozone vapor, which forms the oxide film on the surface. The method is particularly useful for forming a pre-liner oxide film on trench surfaces in the fabrication of STI (shallow trench isolation) structures.
Abstract:
A dummy region varactor for improving a CMP process and improving electrical isolation from active areas and a method for forming the same, the varactor including a semiconductor substrate having a dummy region said dummy region including a first well region having a first polarity; shallow trench isolation (STI) structures disposed in the dummy region defining adjacent mesa regions comprising first, second, and third mesa regions; a second well region having a second polarity underlying the first mesa region having the second polarity to form a PN junction interface; wherein said second and third mesa regions having the first polarity are formed adjacent either side of said first mesa region.
Abstract:
The invention provides an organic thin film transistor array substrate, comprising: a substrate, having a liquid crystal display area and an organic thin film transistor area; a pixel electrode, formed on the substrate in the LCD area; a first alignment film, formed on the pixel electrode; a second alignment film, formed on the substrate in the OTFT area; an organic semiconductor layer, formed on the second alignment film, wherein the organic semiconductor layer is aligned along the direction of the second alignment film; and a gate, a source and a drain, formed in the OTFT area, wherein the source and the drain are in contact with the organic semiconductor layer and a channel is formed between the source and the drain.
Abstract:
A method for forming a FIN-FET device employs a blanket planarizing layer formed upon a blanket topographic gate electrode material layer. The blanket planarizing layer is patterned and employed as a mask layer for patterning the blanket topographic gate electrode material layer to form a gate electrode. Since the blanket planarizing layer is formed as a planarizing layer, a photoresist layer formed thereupon is formed with enhanced resolution. As a result, the gate electrode is also formed with enhanced resolution. A resulting FIN-FET structure has the patterned planarizing layer formed in an inverted “U” shape upon the gate electrode.
Abstract:
A cloth hood is made by punching a flexible cloth into a pair of bilaterally symmetrical twin pieces and stitching them together. The cloth hood includes a gap formed at a position corresponding to that of each eye in respective pieces, a jutting portion below each gap, a recess portion defined at somewhere below the jutting portion and along the peripheral stitch line of the cloth hood, an extension end defined below the recess portion, another recess portion arranged at a position almost exactly opposite to the mentioned recess portion and top and bottom ends of the cloth hood shaped in arc style. As the cloth hood can be closely and flexibly attached onto a user's head, it is possible to prevent hair or scalp bits from being dropped to the floor without incurring any discomfort to the user.