公开(公告)号：US20190314533A1

公开(公告)日：2019-10-17

申请号：US16383406

申请日：2019-04-12

Applicant: POINT ENGINEERING CO.,LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Moon Hyun KIM

IPC: A61L2/10 ,  A61L2/26

Abstract: The present invention relates generally to an ultraviolet sterilization module for sterilizing a fluid using ultraviolet light. More particularly, the present invention relates to an ultraviolet sterilization module, configured such that an increase in amount of ultraviolet irradiation is achieved, thus efficiently sterilizing a fluid inside a light transmission member without requiring an increase in size of the light transmission member.

公开(公告)号：US20190305178A1

公开(公告)日：2019-10-03

申请号：US16370674

申请日：2019-03-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L33/00 ,  H01L33/20 ,  H01L21/02

Abstract: The present invention relates to a system having a transfer head for transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a system having a transfer head for transferring a micro LED, the system being configured such that the transfer head does not use an electrostatic force and preventing the generation of an electrostatic force which may cause a problem. In addition, the present invention relates to a system having a transfer head for transferring a micro LED, the system employing a suction structure using a suction force to transfer a micro LED by a porous member, thereby solving problems of the related art.

公开(公告)号：US20190304854A1

公开(公告)日：2019-10-03

申请号：US16369802

申请日：2019-03-29

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK

IPC: H01L21/66 ,  H01L25/075

Abstract: The present invention relates to an inspection and replacement method for a micro LED, the method being configured to inspect whether the micro LED is defective and replace a defective micro LED with a normal micro LED. More particularly, the present invention relates to an inspection and replacement method for a micro LED in which when micro LEDs are transferred to a display substrate, the micro LEDs are inspected so as to detect and remove a defective micro LED, and a normal micro LED is placed at a position where the defective micro LED is removed so as to be replaced with the defective micro LED.

公开(公告)号：US20190189487A1

公开(公告)日：2019-06-20

申请号：US16216376

申请日：2018-12-11

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho Park ,  Sung Hyun BYUN

IPC: H01L21/677 ,  H01L25/075 ,  H01L33/06 ,  H01L33/00 ,  H01L27/15 ,  H01L33/44 ,  H01L33/40 ,  H01L33/42 ,  H01L21/683

CPC classification number: H01L21/67712 ,  H01L21/6838 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/405 ,  H01L33/42 ,  H01L33/44 ,  H01L2933/0016

Abstract: Disclosed is a transfer head for transferring micro-LEDs from a first substrate to a second substrate, particularly, using a vacuum adsorption method. The transfer head includes a porous member having a plurality of pores, in which the micro-LEDs are transferred by creating or releasing a vacuum pressure in the pore of the porous member.

公开(公告)号：US20190165219A1

公开(公告)日：2019-05-30

申请号：US16198383

申请日：2018-11-21

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/52 ,  H01L33/58

Abstract: Disclosed is a substrate for an optical device. The substrate has a cavity for mounting an optical element. The cavity has a sloped wall surface having a surface roughness Ra controlled to fall within a range of 1 nm≤Ra≤100 nm, thereby increasing the surface reflectance inside the cavity in which the optical element is mounted and thus minimizing the loss of light emitted from the optical element. Further disclosed is an optical device package including the same substrate.

公开(公告)号：US10281418B2

公开(公告)日：2019-05-07

申请号：US15247530

申请日：2016-08-25

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N27/12 ,  G01N33/00 ,  H05B3/03 ,  H05B3/26

Abstract: A micro heater includes a heater electrode formed on a first supporting portion. A micro sensor further includes a sensor electrode formed on the first supporting portion. In the micro heater and the micro sensor an anti-etching dam is formed on the supporting portion. The dam protects the shape of the first supporting portion during etching.

公开(公告)号：US10039160B2

公开(公告)日：2018-07-31

申请号：US15142189

申请日：2016-04-29

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

IPC: F21V15/00 ,  H05B33/08 ,  F21V29/70 ,  F21K9/00 ,  F21V23/00 ,  H05K1/02 ,  F21Y115/10

CPC classification number: H05B33/0815 ,  F21K9/00 ,  F21V23/005 ,  F21V29/70 ,  F21Y2115/10 ,  H05B33/0803 ,  H05K1/0209 ,  H05K2201/10106 ,  Y02B20/341

Abstract: A light engine for a light emitting element includes an element substrate on which a plurality of light emitting elements is mounted, a plurality of circuit substrates connected to one another in an insulated state in order to apply a drive voltage to the light emitting elements and connected to the element substrate in an insulated state, and a plurality of protection substrates configured to surround the element substrate and the circuit substrates and to make contact with the element substrate and the circuit substrates in an insulated state.

公开(公告)号：US10014455B2

公开(公告)日：2018-07-03

申请号：US14866073

申请日：2015-09-25

Applicant: Point Engineering Co., Ltd.

Inventor： Seung Ho Park ,  Tae Hwan Song ,  Sung Hyun Byun

IPC: H01L33/62 ,  H05K1/05 ,  H05K1/18 ,  H01L33/60 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H05K1/05 ,  H05K1/185 ,  H05K2201/09745 ,  H05K2201/10106

Abstract: A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature.

公开(公告)号：US20180074033A1

公开(公告)日：2018-03-15

申请号：US15702666

申请日：2017-09-12

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: G01N33/00 ,  G01N27/04

Abstract: Disclosed is a microsensor package. Particularly, disclosed is a microsensor package configured such that a substrate with a sensor electrode is formed with a plurality of pores penetrating vertically therethrough, the lower surface of the substrate is formed with a bonding portion, and the pores under the sensor electrode pad are provided therein with respective connecting portions electrically connecting the sensor electrode pad and the bonding portion, whereby it is possible to provide a light, slim, and compact microsensor package, and it is possible to mount the microsensor package to a printed circuit board (PCB) without wire bonding.

公开(公告)号：US20180045664A1

公开(公告)日：2018-02-15

申请号：US15674463

申请日：2017-08-10

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01N27/12

CPC classification number: G01N27/128 ,  G01N27/123

Abstract: Disclosed is a micro sensor. Particularly, disclosed is a micro sensor capable of changing a resistance value of a resistance unit connected to a sensor electrode depending on a sensing material, the resistance unit having at least two resistors.