Abstract:
A power conversion device includes an enclosure containing one or more drops of a liquid. A capacitive electret transducer is coupled to the enclosure. In response to applied heat at a heating surface, the liquid vaporizes and then condenses on a flexible membrane of the capacitive electret transducer. The flexible membrane is displaced in response to the vaporization-condensation and the capacitive electret transducer generates an output current.
Abstract:
An integrated circuit features a FET, an UTBOX layer plumb with the FET, an underlayer ground plane with first doping plumb with the FET's gate and channel, first and second underlayer semiconducting elements, both plumb with the drain or source, electrodes in contact respectively with the ground plane and with the first element, one having first doping and being connected to a first voltage, the other having the first doping and connected to a second bias voltage different from the first, a semiconducting well having the second doping and plumb with the first ground plane and both elements, a first trench isolating the first FET from other components of the integrated circuit and extending through the layer into the well, and second and third trenches isolating the FET from the electrodes, and extending to a depth less than a plane/well interface.
Abstract:
A method of manufacturing a pinned photodiode, including: forming a region of photon conversion into electric charges of a first conductivity type on a substrate of the second conductivity type; coating said region with a layer of a heavily-doped insulator of the second conductivity type; and annealing to ensure a dopant diffusion from the heavily-doped insulator layer.
Abstract:
The disclosure relates to an image sensor comprising a substrate region in a semiconductor material; an active layer in contact with the substrate region; and a photodiode array formed in the active layer. The substrate region has a doping level such that the resistivity of the substrate region is less than 6 mOhm·cm.
Abstract:
A SPAD-type photodiode has a semiconductor substrate with a light-receiving surface. A lattice formed of interlaced strips made of a first material covers the light receiving surface. The lattice includes lattice openings with lateral walls covered by a spacer made of a second material. Then first and second materials have different optical indices, and further each optical index is less than or equal to the substrate optical index. A pitch of the lattice is of the order of a magnitude of an operating wavelength of the photodiode. The first and second materials are transparent at that operating wavelength. The lattice is made of a conductive material electrically coupled to an electrical connection node (for example, a bias voltage node).
Abstract:
An electronic device includes a transimpedance amplifier stage having an amplifier end stage of the class AB type and a preamplifier stage coupled between an output of a frequency transposition stage and an input of the amplifier end stage. A self-biased common-mode control stage is configured to bias the preamplifier stage. The preamplifier stage is formed by a differential amplifier with an active load that is biased in response to the self-biased common-mode control stage.
Abstract:
For programming an antifuse memory, the power consumption of the memory is assessed during programming mode. The power consumption is compared with a threshold. When the threshold is exceeded, indicative of successful programming of the antifuse memory cell, the programming mode is terminated.
Abstract:
The present disclosure relates to a photodiode comprising: a P-conductivity type substrate region, an electric charge collecting region for collecting electric charges appearing when a rear face of the substrate region receives light, the collecting region comprising an N-conductivity type region formed deep in the substrate region, an N-conductivity type read region formed in the substrate region, and an isolated transfer gate, formed in the substrate region in a deep isolating trench extending opposite a lateral face of the N-conductivity type region, next to the read region, and arranged for receiving a gate voltage to transfer electric charges stored in the collecting region toward the read region.
Abstract:
A method of manufacturing an integrated circuit including photonic components on a silicon layer and a laser made of a III-V group material includes providing the silicon layer positioned on a first insulating layer that is positioned on a support. First trenches are etched through the silicon layer and stop on the first insulating layer, and the first trenches are covered with a silicon nitride layer. Second trenches are etched through a portion of the silicon layer, and the first and second trenches are filled with silicon oxide, which are planarized. The method further includes removing the support and the first insulating layer, and bonding a wafer including a III-V group heterostructure on the rear surface of the silicon layer.
Abstract:
A model for simulating the electrical behavior of a thyristor includes a model of an NPN bipolar transistor whose emitter forms the cathode of the thyristor and the base forms a low-side control terminal of the thyristor, and a model of a PNP bipolar transistor whose emitter forms the anode of the thyristor and the base forms a high-side control terminal of the thyristor, the collector of the PNP transistor being connected to the low-side control terminal and the collector of the NPN transistor being connected to the high-side control terminal. The transistor models are present a small signal behavior over the entire range of anode currents of the thyristor, whereby the transistor models exhibit a gain drop when the anode current exits the small signal range.