公开(公告)号：US07962023B2

公开(公告)日：2011-06-14

申请号：US12494811

申请日：2009-06-30

Applicant: Jin-won Lee ,  Chong-sam Chung ,  Min-jae Lee ,  Sung-hyun Kim ,  Hae-in Chung

Inventor： Jin-won Lee ,  Chong-sam Chung ,  Min-jae Lee ,  Sung-hyun Kim ,  Hae-in Chung

IPC: G03B17/00 ,  G02B27/64 ,  H04N5/228

CPC classification number: H04N5/23248 ,  G02B27/646 ,  H04N5/2328

Abstract: An image stabilizer includes a rotor including a lens assembly, and configured to move perpendicular to an optical axis of light passing through the lens assembly, and a suspension unit configured to support movement of the rotor and to prevent the rotor from moving non-perpendicular to the optical axis of the light passing through the lens assembly. Accordingly, the image stabilizer prevents variance of characteristics of a rotor in a low frequency band according to the position and distortion of phase characteristics in a high frequency band. Therefore, the image stabilizer has consistent operation characteristics regardless of the position, posture, and movement of a person using an image capture device containing the image stabilizer.

Abstract translation: 图像稳定器包括转子，该转子包括透镜组件，并且被配置为垂直于穿过透镜组件的光的光轴移动;以及悬架单元，其构造成支撑转子的运动并且防止转子非垂直于 透过透镜组件的光的光轴。 因此，图像稳定器根据高频带中的相位特性的位置和失真来防止低频带中的转子的特性的变化。 因此，无论使用包含图像稳定器的图像捕获装置的人的位置，姿势和移动如何，图像稳定器具有一致的操作特性。

公开(公告)号：US20110133332A1

公开(公告)日：2011-06-09

申请号：US12926279

申请日：2010-11-05

Applicant: Seon Jae Mun ,  Dae Young Lee ,  Tae Joon Chung ,  Dong Gyu Lee ,  Jin Won Choi

Inventor： Seon Jae Mun ,  Dae Young Lee ,  Tae Joon Chung ,  Dong Gyu Lee ,  Jin Won Choi

IPC: H01L23/498 ,  H01L21/60

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There is provided a package substrate allowing for enhanced reliability by improving the structure of a solder bump and a method of fabricating the same. The package substrate includes: a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a post terminal provided on the conductive pad inside the opening; and a solder bump provided on the post terminal and having an angle between a bottom surface and a side surface thereof ranging from 80° to 120°.

Abstract translation: 提供了一种通过改善焊料凸块的结构来提高可靠性的封装衬底及其制造方法。 封装衬底包括：具有至少一个导电焊盘的衬底; 绝缘层，设置在所述基板上并具有用于暴露所述导电焊盘的开口; 位于所述开口内的所述导电垫上的支柱端子; 以及设置在立柱端子上并且在其底表面和侧表面之间具有从80°至120°的角度的焊料凸块。

公开(公告)号：US20110127676A1

公开(公告)日：2011-06-02

申请号：US12805295

申请日：2010-07-22

Applicant: Jin Won Choi ,  Seung Jean Moon ,  Ki Taek Lee

Inventor： Jin Won Choi ,  Seung Jean Moon ,  Ki Taek Lee

IPC: H01L23/48 ,  H01B5/00

CPC classification number: H01L23/49811 ,  H01L2224/32225 ,  H01L2924/09701

Abstract: Disclosed is a lead pin for a semiconductor package. The lead pin includes a coupling pin inserted into a hole formed in an external device, a head portion disposed at one end of the coupling pin, and a step portion formed in a stepped manner between the coupling pin and the head portion, the step portion having a smaller size than the head portion.

Abstract translation: 公开了一种用于半导体封装的引脚。 引导销包括插入到形成在外部装置中的孔中的联接销，设置在联接销的一端的头部和在连接销和头部之间以阶梯形式形成的台阶部分，台阶部分 具有比头部小的尺寸。

公开(公告)号：US20110116246A1

公开(公告)日：2011-05-19

申请号：US12818497

申请日：2010-06-18

Applicant: Jin-Won LEE ,  Yul-Kyo Chung ,  Seung-Hyun Sohn ,  Moon-Il Kim

Inventor： Jin-Won LEE ,  Yul-Kyo Chung ,  Seung-Hyun Sohn ,  Moon-Il Kim

IPC: H05K1/18 ,  B32B37/02

CPC classification number: H05K1/18 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H05K3/30 ,  H05K3/46 ,  Y10T29/49146 ,  Y10T156/10

Abstract: An electronic component embedded printed circuit board and a method of manufacturing the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a first substrate, which has a cavity formed therein, a first electronic component, which is embedded in the cavity in a face-down manner, a second electronic component, which is stacked on an upper side of the first electronic component and embedded in the cavity in a face-up manner, and a second substrate, which is stacked on upper and lower surfaces of the first substrate.

Abstract translation: 公开了电子部件嵌入式印刷电路板及其制造方法。 根据本发明的实施例的电子部件嵌入式印刷电路板可以包括：第一基板，其具有形成在其中的空腔;第一电子部件，以面朝下的方式嵌入在所述空腔中;第二电子部件 所述第一基板被堆叠在所述第一电子部件的上侧并以面朝上的方式嵌入所述空腔中;以及第二基板，其被堆叠在所述第一基板的上表面和下表面上。

公开(公告)号：US20110115121A1

公开(公告)日：2011-05-19

申请号：US12926864

申请日：2010-12-14

Applicant: Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

Inventor： Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

IPC: B29C45/00 ,  B82Y30/00

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K7/20481 ,  H05K2201/026 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

公开(公告)号：US07930510B2

公开(公告)日：2011-04-19

申请号：US12031248

申请日：2008-02-14

Applicant: Sang Cheol Kim ,  Hae Yong Kim ,  Chang Min Shin ,  Jin Won Kim ,  Mi Sun Yu ,  Jin Ho Chang ,  Pyeong Soo Mah

Inventor： Sang Cheol Kim ,  Hae Yong Kim ,  Chang Min Shin ,  Jin Won Kim ,  Mi Sun Yu ,  Jin Ho Chang ,  Pyeong Soo Mah

IPC: G06F12/00

CPC classification number: G06F12/023 ,  G06F9/5016

Abstract: Provided is a method of dynamically reallocating a thread stack in a multi-threaded operating system, and more particularly, a method of dynamically allocating a thread stack of a multi-threaded operating system in an embedded system for wireless sensor nodes. The method includes the steps of: measuring sizes of data and non-data sections of a stack with respect to each thread; determining a new size of the non-data section of each stack based on the size of the data section of the stack measured with respect to each thread; and adjusting the size of the non-data section of each stack to the determined new size. According to the method, even without the source code analysis, an amount of memory spaces to be used can be reduced compared to that of a conventional static stack allocation method.

Abstract translation: 提供了一种在多线程操作系统中动态地重新分配线程栈的方法，更具体地说，一种在无线传感器节点的嵌入式系统中动态分配多线程操作系统的线程栈的方法。 该方法包括以下步骤：测量堆栈相对于每个线程的数据和非数据部分的大小; 基于相对于每个线程测量的堆叠的数据部分的大小来确定每个堆栈的非数据部分的新尺寸; 并且将每个堆栈的非数据段的大小调整到所确定的新大小。 根据该方法，即使没有源代码分析，与常规静态堆栈分配方法相比，也可以减少要使用的存储空间量。

公开(公告)号：US20110079926A1

公开(公告)日：2011-04-07

申请号：US12923621

申请日：2010-09-29

Applicant: Tae Joon Chung ,  Jin Won Choi ,  Dong Gyu Lee ,  Hueng Jae Oh ,  Seon Jae Mun

Inventor： Tae Joon Chung ,  Jin Won Choi ,  Dong Gyu Lee ,  Hueng Jae Oh ,  Seon Jae Mun

IPC: H01L23/522 ,  H01L21/768

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/054 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.

Abstract translation: 提供了制造用于倒装芯片的基板的方法和使用其制造的用于倒装芯片的基板。 该方法包括提供包括至少一个导电焊盘的基底衬底，在基底衬底上形成阻焊层，阻焊层包括暴露导电焊盘的第一开口，在阻焊层上形成干膜，干膜 包括与所述第一开口连接的第二开口，在所述第一开口中形成金属柱和所述第二开口的一部分，用焊膏填充所述金属柱上方的所述第二开口，通过对所述第一开口进行回流处理来形成焊料盖 焊膏，使焊盘的表面平坦化，并除去干膜。 因此，可以实现精细的间距和提高可靠性。

公开(公告)号：US20110068473A1

公开(公告)日：2011-03-24

申请号：US12805559

申请日：2010-08-05

Applicant: Ki Taek Lee ,  Hueng Jae OH ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

Inventor： Ki Taek Lee ,  Hueng Jae OH ,  Sung Won Jeong ,  Gi Sub Lee ,  Jin Won Choi

IPC: H01L23/498 ,  H01B5/00

CPC classification number: H01L23/49811 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract translation: 提供了一种用于封装基板的引脚，包括：连接销插入形成在外部基板中的孔中; 形成在连接销的一端的头部; 以及形成在头部的一个表面上的阻挡部分，以便阻止焊膏的路径，使得当头部安装在头部上时，防止焊膏流过以覆盖头部的上部 封装衬底。

公开(公告)号：US20110058561A1

公开(公告)日：2011-03-10

申请号：US12807334

申请日：2010-09-02

Applicant: Sun-Ju Kim ,  Jeong-Hoon Park ,  Sung-Wook Park ,  Jai-Ho Lee ,  Jin-Won Seo

Inventor： Sun-Ju Kim ,  Jeong-Hoon Park ,  Sung-Wook Park ,  Jai-Ho Lee ,  Jin-Won Seo

IPC: H04L12/56

CPC classification number: H04L12/6418 ,  H04L12/5692 ,  H04L61/2015 ,  H04L69/16 ,  H04L69/161 ,  H04L69/22 ,  H04W8/26 ,  H04W88/06

Abstract: An apparatus and a method for transmitting/receiving a packet in a dual modem mobile communication terminal support data communication using both a host modem and a slave modem by additionally driving the slave modem when packet traffic is heavy. In the method for transmitting/receiving, at a host modem, a packet in a mobile communication terminal that includes the host modem and a slave modem, when a packet is received under a state where only the host modem is driven, it is determined whether a buffer count of the host modem is greater than a reference value. When the buffer count of the host modem is greater than the reference value, the slave modem is additionally driven and the received packet is provided to the slave modem.

Abstract translation: 用于在双调制解调器移动通信终端中发送/接收分组的装置和方法通过在分组业务量较大时另外驱动从调制解调器来支持使用主调制解调器和从调制解调器的数据通信。 在主机调制解调器中发送/接收包含主机调制解调器和从调制解调器的移动通信终端中的分组的方法中，当仅在主机调制解调器被驱动的状态下接收分组时，确定是否 主机调制解调器的缓冲区计数大于参考值。 当主机调制解调器的缓冲区计数大于参考值时，从调制解调器被另外驱动，并且接收的分组被提供给从调制解调器。

公开(公告)号：USD633114S1

公开(公告)日：2011-02-22

申请号：US29367322

申请日：2010-08-05

Applicant: Woon Kyu Seo ,  Jung Yeon Hwang ,  Jin Won Kang ,  Myung Dong You ,  Han Jin Jung

Designer： Woon Kyu Seo ,  Jung Yeon Hwang ,  Jin Won Kang ,  Myung Dong You ,  Han Jin Jung