摘要:
Methods are provided for operating a magnetic random access memory device including a memory cell having a magnetic tunnel junction structure on a substrate. In particular, a writing current pulse may be provided through the magnetic tunnel junction structure, and a writing magnetic field pulse may be provided through the magnetic tunnel junction structure. In addition, at least a portion of the writing magnetic field pulse may be overlapping in time with respect to at least a portion of the writing current pulse, and at least a portion of the writing current pulse and/or at least a portion of the writing magnetic field pulse may be non-overlapping in time with respect to the other. Related devices are also discussed.
摘要:
A method for fabricating a capacitor of a semiconductor device, and a capacitor made in accordance with the method, wherein the method includes forming a plate electrode polysilicon layer on a semiconductor substrate having a cell array region and a core/peripheral circuit region. The plate electrode polysilicon layer in the cell array region is patterned to form an opening, wherein the inner wall of the opening is used as a plate electrode. After forming a dielectric layer in the opening, a storage node is formed as a spacer on the dielectric layer on the inner wall of the opening. The plate electrode polysilicon layer in the core/peripheral circuit region remains to provide the same height between the cell array region where the cell capacitor is formed and the core/peripheral circuit region.
摘要:
A method of fabricating a MOS transistor is provided. According to the method, a rapid thermal anneal is applied to a semiconductor substrate having active regions doped with well impurity ions and channel impurity ions. Thus, during implantation of the well and the channel impurity ions, crystalline defects resulting from the implantation can be cured by the rapid thermal anneal.
摘要:
Active areas of integrated circuits can be formed by implanting first ions into a first active area of a substrate adjacent to an isolation structure in the substrate and between a source and a drain region of the integrated circuit to provide a first concentration of ions in the first active area. Second ions are implanted into the first active area and a second active area of the substrate adjacent to the first active area and spaced-apart from the isolation structure on the substrate to provide a second concentration of ions in the second active area and a third concentration of ions in the first active area that is greater than the first and second concentrations. As a result, the level of ion concentration can be higher at the edge of an active channel region than at the center of the channel. The increased concentration of ions in the active area adjacent to the side wall of the trench may reduce a current between the source and drain regions of the transistor when voltage that is less than a threshold voltage of the transistor is applied to the gate electrode of the transistor. Thus, a reduction in the threshold voltage of the transistor can be inhibited. Integrated circuit transistors are also disclosed.
摘要:
An etch-stop layer is selectively provided between layers of a multiple-layered circuit in a selective manner so as to allow for outgassing of impurities during subsequent fabrication processes. The etch-stop layer is formed over an underlying stud so as to serve as an alignment target during formation of an overlying stud formed in an upper layer. In this manner multiple-layered circuits, for example memory devices, can be fabricated in relatively dense
摘要:
The size of a pad in the present invention is reduced, thereby preventing a polymer etch-stop, suppressing a short between a gate and a gate conductive layer exposed by the damage of an oxide layer covering the gate conductive layer, and extending a top surface area of a pad beyond the technical limitation of a photo equipment. As a result, it is possible to greatly secure the alignment of a buried contact electrically connected to the pad.
摘要:
Ferroelectric memory devices include a plate line, a bit line, a ferroelectric memory cell containing a first access transistor and a first ferroelectric capacitor electrically connected in series between the bit line and the plate line, and a word line electrically connected to a gate electrode of the first access transistor. A row decoder and a preferred plate line pulse generator are also provided to generate a write voltage of first magnitude (e.g., Vcc) on the plate line during a write time interval and a read voltage of a second magnitude (e.g., Vcc+&agr;), greater than the first magnitude, on the plate line during a read time interval. These different magnitudes of the write and read voltage for the plate line are generated in response to a control signal (CP), so that during a read operation, the magnitude of the change in voltage across the ferroelectric capacitor will be sufficient to enable a complete charge transfer of 2QR when the ferroelectric memory cell is storing a data 1 value. The plate line pulse generator may comprise a pulse generator, a voltage boosting circuit having an input electrically coupled to an output of the pulse generator and a switch circuit to electrically couple an output of the pulse generator to an output of the plate line pulse generator when the control signal is in a first logic state (during a write operation) and electrically couple an output of the voltage boosting circuit to the output of the plate line pulse generator when the control signal is in a second logic state (during a read operation).
摘要:
A method for fabricating a semiconductor device with different gate oxide layers is provided. In this method, oxidation is controlled in accordance with the active area dimension so that the oxide grows more thinly at a wider active width in a peripheral region, and grows more thickly at a narrower active width in a cell array region. In this method, a gate pattern is formed over a semiconductor substrate having different active areas. Gate spacer are formed and an active-dimension-dependant oxidation process is then performed to grow oxide layers of different thicknesses in the cell array region and the peripheral region.