High hole mobility p-channel Ge transistor structure on Si substrate
    134.
    发明授权
    High hole mobility p-channel Ge transistor structure on Si substrate 有权
    硅衬底上的高空穴迁移率p沟道Ge晶体管结构

    公开(公告)号:US07791063B2

    公开(公告)日:2010-09-07

    申请号:US11847780

    申请日:2007-08-30

    Abstract: The present disclosure provides an apparatus and method for implementing a high hole mobility p-channel Germanium (“Ge”) transistor structure on a Silicon (“Si”) substrate. One exemplary apparatus may include a buffer layer including a GaAs nucleation layer, a first GaAs buffer layer, and a second GaAs buffer layer. The exemplary apparatus may further include a bottom barrier on the second GaAs buffer layer and having a band gap greater than 1.1 eV, a Ge active channel layer on the bottom barrier and having a valence band offset relative to the bottom barrier that is greater than 0.3 eV, and an AlAs top barrier on the Ge active channel layer wherein the AlAs top barrier has a band gap greater than 1.1 eV. Of course, many alternatives, variations and modifications are possible without departing from this embodiment.

    Abstract translation: 本公开提供了一种在硅(“Si”)衬底上实现高空穴迁移率p沟道锗(“Ge”)晶体管结构的装置和方法。 一个示例性装置可以包括包括GaAs成核层,第一GaAs缓冲层和第二GaAs缓冲层的缓冲层。 该示例性装置还可以包括第二GaAs缓冲层上的底部阻挡层,并具有大于1.1eV的带隙,底部势垒上的Ge活性通道层,并且相对于底部势垒的价带偏移大于0.3 eV和Ge活性通道层上的AlAs顶部势垒,其中AlAs顶部势垒具有大于1.1eV的带隙。 当然,在不脱离本实施例的情况下,可以进行许多替代,变化和修改。

    Trigate transistor having extended metal gate electrode
    137.
    发明申请
    Trigate transistor having extended metal gate electrode 有权
    用具有扩展金属栅电极的晶体管

    公开(公告)号:US20100163970A1

    公开(公告)日:2010-07-01

    申请号:US12317966

    申请日:2008-12-31

    CPC classification number: H01L29/785 H01L29/66795

    Abstract: A trigate device having an extended metal gate electrode comprises a semiconductor body having a top surface and opposing sidewalls formed on a substrate, an isolation layer formed on the substrate and around the semiconductor body, wherein a portion of the semiconductor body remains exposed above the isolation layer, and a gate stack formed on the top surface and opposing sidewalls of the semiconductor body, wherein the gate stack extends a depth into the isolation layer, thereby causing a bottom surface of the gate stack to be below a top surface of the isolation layer.

    Abstract translation: 具有延伸的金属栅电极的触发装置包括半导体本体,其具有形成在基板上的顶表面和相对的侧壁,形成在基板上并围绕半导体主体的隔离层,其中半导体主体的一部分保持暴露在隔离物的上方 层,以及形成在半导体主体的顶表面和相对侧壁上的栅极堆叠,其中栅极堆叠将深度延伸到隔离层中,从而使栅极堆叠的底表面在隔离层的顶表面下方 。

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