Abstract:
A power device includes a semiconductor region which in turn includes a plurality of alternately arranged pillars of first and second conductivity type. Each of the plurality of pillars of second conductivity type further includes a plurality of implant regions of the second conductivity type arranged on top of one another along the depth of pillars of second conductivity type, and a trench portion filled with semiconductor material of the second conductivity type directly above the plurality of implant regions of second conductivity type.
Abstract:
The present invention is directed to novel polypeptides having homology to members of the tumor necrosis factor receptor family and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptides molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention and to methods for producing the polypeptides of the present invention.
Abstract:
A trench-gate field effect transistor includes trenches extending into a silicon region of a first conductivity type, and a gate electrodes in each trench. Body regions of second conductivity type extend over the silicon region between adjacent trenches. Each body region forms a PN junction with the silicon region. A gate dielectric layer lines at least upper sidewalls of each trench, and insulates the gate electrode from the body region. Source regions of the first conductivity flank the trenches. A silicon-germanium region vertically extends through each source region and through a corresponding body region, and terminates within the corresponding body region before reaching the PN junction.
Abstract:
The CMOS field effect transistors, used in microprocessors and other digital VLSI circuits, face major challenges such as thin gate dielectrics leakage and scaling limits, severe short channel effects, limited performance improvement with scaling, complicated fabrication process with added special techniques, and surface mobility degradation. This disclosure proposes a new CMOS-compatible optoelectronic transistor. The current is much higher than the MOS transistors, due to the high carrier mobility with bulk transportation. The optoelectronic transistors are scalable to the sub-nanometer ranges without short channel effects. It is also suitable for low power applications and ULSI circuits. The new transistor consists of a laser or LED diode as drain or source, and a photo sensor diode (avalanche photo diode) as source or drain. The transistor is turned on by applying a gate voltage, similar to the CMOS transistors, and a laser or LED light signal is sent to the nearby photo diode, causing an avalanche breakdown and high drain current. The transistor is surrounded by dielectrics and metal isolations, which serve as a metal box or cavity, so the generated laser or LED lights are confined and reflected back from the metal. The drain current increases exponentially with the drain or gate voltage. This exponential drain current vs. drain or gate voltage characteristics makes the optoelectronic transistor run much faster than the transitional linear MOSFET.The optic transistor current-voltage characteristics are totally different from transitional CMOS transistors.
Abstract:
A method of forming a field effect transistor (FET) includes the following steps. A pair of trenches extending into a semiconductor region of a first conductivity type is formed. A shield electrode is formed in a lower portion of each trench. A gate electrode is formed in an upper portion of each trench over but insulated from the shield electrode. First and second well regions of a second conductivity type are formed in the semiconductor region between the pair of trenches such that the first and second well regions are vertically spaced from one another and laterally abut sidewalls of the pair of trenches. The gate electrode and the first shield electrode are formed relative to the first and second well regions such that a channel is formed in each of the first and second well regions when the FET is biased in the on state.
Abstract:
With simply applying the gate voltage, the transistor will start sending out oscillating signals, working like a semiconductor “engine”. A special MOS field effect transistor (FET) includes an extended lightly doped drain and an intrinsic undoped or very lightly doped “gap” between the gate and the heavily doped source. The gap needs to be specially engineered so that the transistor is not always turned on by the MOSFET gate voltage, but will be turned on by the carriers from the forward-biased channel-drain junction diode. Oscillation occurs to the drain current (or voltage) when a suitable gate voltage is applied, due to the repeated back and forth actions of deep depletion in the transistor well and forward bias of the drain-well p-n junction diode. By forming a second spacer gate on one side of the main gate, the device can be used as a non-volatile memory, with the charges stored at the dielectrics / silicon interface, which can significantly impact the oscillating for the READ operation of a memory. This device can also be a frequency amplifier.
Abstract:
The present invention is directed to novel polypeptides having homology to CDO protein and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention, and methods for producing the polypeptides of the present invention.
Abstract:
The present invention is directed to novel polypeptides having homology to certain human uncoupling proteins (“UCPs”) and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention, and methods for producing the polypeptides of the present invention.
Abstract:
A polysilicon film is formed with enhanced selectivity by flowing chlorine during the formation of the film. The chlorine acts as an etchant to insulative areas adjacent polysilicon structures on which the film is desired to be formed. Bottom electrodes for capacitors are formed using this process, followed by an anneal to create hemishperical grain (HSG) polysilicon. Multilayer capacitor containers are formed in a non-oxidizing ambient so that no oxide is formed between the layers. The structure formed is planarized to form separate containers made from doped and undoped amorphous silicon layers. Selected ones of undoped layers are seeded in a chlorine containing environment and annealed to form HSG. A dielectric layer and second electrode are formed to complete the cell capacitor.
Abstract:
The present invention is directed to novel polypeptides and to nucleic acid molecules encoding those polypeptides. Also provided herein are vectors and host cells comprising those nucleic acid sequences, chimeric polypeptide molecules comprising the polypeptides of the present invention fused to heterologous polypeptide sequences, antibodies which bind to the polypeptides of the present invention and to methods for producing the polypeptides of the present invention.