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131.
公开(公告)号:US11764225B2
公开(公告)日:2023-09-19
申请号:US17344391
申请日:2021-06-10
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Anthony K. Stamper , Uzma Rana , Siva P. Adusumilli , Steven M. Shank
CPC classification number: H01L27/1203 , H01L21/28052 , H01L21/28518 , H01L21/84 , H01L29/45 , H01L29/4933
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to field effect transistors and methods of manufacture. The structure includes: at least one gate structure comprising source/drain regions; and at least one isolation structure perpendicular to the at least one gate structure and within the source/drain regions.
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132.
公开(公告)号:US11749671B2
公开(公告)日:2023-09-05
申请号:US17067033
申请日:2020-10-09
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Kaustubh Shanbhag , Glenn Workman
IPC: H01L27/02 , H01L21/8238 , H01L21/762
CPC classification number: H01L27/0207 , H01L21/7624 , H01L21/823892
Abstract: The disclosure provides integrated circuit (IC) structures and methods to form the same. Methods according to the disclosure may be performed on a substrate having a first doping type, the substrate extending between a first end and a second end. A deep well is formed within the substrate, the deep well including a well boundary defined between the deep well and a remainder of the substrate. The well boundary is horizontally distal to a midpoint between the first end and the second end of the substrate. A first active semiconductor region is formed at least partially over the substrate, and an oppositely-doped second active semiconductor region is formed at least partially over the deep well.
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公开(公告)号:US11749559B2
公开(公告)日:2023-09-05
申请号:US17983436
申请日:2022-11-09
Applicant: GlobalFoundries U.S. Inc.
Inventor: Steven M. Shank , Anthony K. Stamper , Ian McCallum-Cook , Siva P. Adusumilli
IPC: H01L21/763 , H01L29/06 , H01L27/12 , H01L21/762 , H01L21/324 , H01L21/84 , H01L21/265 , H01L21/74 , H01L29/32 , H01L21/02 , H01L27/06 , H01L29/10
CPC classification number: H01L21/763 , H01L21/26506 , H01L21/26526 , H01L21/26533 , H01L21/324 , H01L21/743 , H01L21/76267 , H01L21/76283 , H01L21/84 , H01L27/1203 , H01L29/0642 , H01L29/0649 , H01L29/32 , H01L21/0217 , H01L21/02164 , H01L21/02238 , H01L21/02255 , H01L21/02271 , H01L27/0629 , H01L29/1087
Abstract: Structures with altered crystallinity beneath semiconductor devices and methods associated with forming such structures. Trench isolation regions surround an active device region composed of a single-crystal semiconductor material. A first non-single-crystal layer is arranged beneath the trench isolation regions and the active device region. A second non-single-crystal layer is arranged beneath the trench isolation regions and the active device region. The first non-single-crystal layer is arranged between the second non-single-crystal layer and the active device region.
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公开(公告)号:US11747560B2
公开(公告)日:2023-09-05
申请号:US17411122
申请日:2021-08-25
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Yusheng Bian , Roderick A. Augur
CPC classification number: G02B6/1228 , G02B6/125 , G02B6/136 , G02B2006/12061
Abstract: Disclosed is a photonic integrated circuit (PIC) structure including: a first waveguide with a first main body and a first end portion, which is tapered; and a second waveguide with a second main body and a second end portion, which has two branch waveguides that are positioned adjacent to opposing sides, respectively, of the first end portion of the first waveguide and that branch out from the second main body, thereby forming a V, U or similar shape. The arrangement of the two branch waveguides of the second end portion of the second waveguide relative to the tapered first end portion of the first waveguide allows for mode matching conditions to be met at multiple locations at the interface between the waveguides, thereby creating multiple signal paths between the waveguides and effectively reducing the light signal power density along any one path to prevent or at least minimize any power-induced damage.
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公开(公告)号:US20230273369A1
公开(公告)日:2023-08-31
申请号:US17680421
申请日:2022-02-25
Applicant: GlobalFoundries U.S. Inc.
Inventor: Shesh Mani Pandey , Yusheng Bian , Steven M. Shank , Judson Holt
Abstract: Photonics structures including an optical component and methods of fabricating a photonics structure including an optical component. The photonics structure includes an optical component, a substrate having a cavity and a dielectric material in the cavity, and a dielectric layer positioned in a vertical direction between the optical component and the cavity. The optical component is positioned in a lateral direction to overlap with the cavity in the substrate.
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公开(公告)号:US20230268401A1
公开(公告)日:2023-08-24
申请号:US17747476
申请日:2022-05-18
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Hong Yu , Jianwei Peng , Vibhor Jain
IPC: H01L29/417 , H01L29/737 , H01L29/08 , H01L29/10 , H01L29/423 , H01L29/66
CPC classification number: H01L29/41708 , H01L29/7371 , H01L29/0804 , H01L29/0821 , H01L29/1008 , H01L29/42304 , H01L29/66242
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a bipolar transistor with self-aligned asymmetric spacer and methods of manufacture. The structure includes: a base formed on a semiconductor substrate; an asymmetrical spacer surrounding the base; an emitter on a first side of the base and separated from the base by the asymmetrical spacer; and a collector on a second side of the base and separated from the base by the asymmetrical spacer.
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公开(公告)号:US20230267259A1
公开(公告)日:2023-08-24
申请号:US17679178
申请日:2022-02-24
Applicant: GlobalFoundries U.S. Inc.
Inventor: Navneet Jain , Mahbub Rashed
IPC: G06F30/392 , G06F30/398
CPC classification number: G06F30/392 , G06F30/398 , G06F2111/20
Abstract: Disclosed are embodiments of a computer-aided design system and corresponding method for power-optimized timing closure of an integrated circuit (IC) design. In the embodiments, a cell library includes sets of cells, where each cell in the same set has the same internal structure but different combinations of cell boundary isolation structures associated with different passive delay values. Timing closure includes replacement of a cell in a previously generated layout with another cell from the same set in order to adjust delay (e.g., increase delay) of a data signal or clock signal and, thereby facilitate fixing of a previously identified violation of a timing constraint. By eliminating or at least minimizing the need to insert buffer and/or inverter cells into a layout to add delay to a data signal and/or a clock signal during timing closure, the embodiments avoid or at least limit concurrent increases in power consumption and area consumption.
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公开(公告)号:US20230266526A1
公开(公告)日:2023-08-24
申请号:US17674905
申请日:2022-02-18
Applicant: GlobalFoundries U.S. Inc.
Inventor: Shesh Mani Pandey , Yusheng Bian , Francis O. Afzal
CPC classification number: G02B6/0288 , G02B6/036
Abstract: Disclosed is an optical waveguide including a waveguide core and waveguide cladding surrounding the waveguide core. The waveguide cladding includes at least one stack of cladding material layers positioned laterally adjacent to a sidewall of the waveguide core such that each cladding material layer in the stack abuts the sidewall of the waveguide core. Each of the cladding material layers in the stack has a smaller refractive index than the waveguide core and at least two of the cladding material layers in the stack have different refractive indices, thereby tailoring field confinement and reshaping the optical mode. Different embodiments include different numbers of cladding material layers in the stack, different stacking orders of the cladding material layers, different waveguide core types, symmetric or asymmetric cladding structures on opposite sides of the waveguide core, etc. Also disclosed is a method of forming the optical waveguide.
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公开(公告)号:US11721719B2
公开(公告)日:2023-08-08
申请号:US17074891
申请日:2020-10-20
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Vibhor Jain , Anthony K. Stamper , John J. Ellis-Monaghan , Steven M. Shank , Rajendran Krishnasamy
IPC: H01L29/06 , H01L29/08 , H01L29/66 , H01L29/737 , H01L21/763 , H01L29/165
CPC classification number: H01L29/0642 , H01L21/763 , H01L29/0826 , H01L29/165 , H01L29/66242 , H01L29/7371
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors (HBTs) with a buried trap rich region and methods of manufacture. The structure includes: a trap rich isolation region embedded within the bulk substrate; and a heterojunction bipolar transistor above the trap rich isolation region, with its sub-collector region separated by the trap rich isolation region by a layer of the bulk substrate.
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公开(公告)号:US11719773B2
公开(公告)日:2023-08-08
申请号:US17375166
申请日:2021-07-14
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Hemant M. Dixit , Vinayak Bharat Naik , Kazutaka Yamane , Eng Huat Toh
CPC classification number: G01R33/098 , G01R33/0005 , G01R33/093
Abstract: A magnetic field sensor may include a plurality of MTJ elements. Each MTJ element of has a state indicated by a magnetic moment direction of a sensing layer relative to a pinned, reference layer in an absence of an external magnetic field. The plurality of MTJ elements are arranged into two identical sets of at least two MTJ elements, where each MTJ element in each respective set has a different state. The states of the MTJ elements are arranged in a manner to measure the external magnetic field regardless of the direction of the external magnetic field. The MTJ elements include identical layers, and are electrically serially connected.
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