公开(公告)号：US12255158B2

公开(公告)日：2025-03-18

申请号：US16911543

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Neelam Prabhu Gaunkar ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Diego Correas-Serrano ,  Henning Braunisch

IPC: H01L23/66 ,  H01L23/498 ,  H01P3/00 ,  H01P3/08

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US12165994B2

公开(公告)日：2024-12-10

申请号：US17024307

申请日：2020-09-17

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Kristof Darmawikarta ,  Benjamin Duong ,  Telesphor Kamgaing ,  Miranda Ngan ,  Srinivas Pietambaram

IPC: H01L25/065 ,  H01L23/66 ,  H01L25/00 ,  H01P3/08 ,  H01Q1/22 ,  H05K1/02

Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate, a plurality of integrated circuit devices electrically attached to the package substrate, wherein each integrated circuit device of the plurality of integrated circuit devices includes an active surface and a backside surface, and wherein a first integrated circuit device and a second integrated circuit device of the plurality of integrated circuit devices includes radio frequency logic circuitry and a radio frequency antenna formed in or attached thereto, and a radio frequency waveguide on the backside surface of the first integrated circuit device and on the backside surface of the second integrated circuit device.

公开(公告)号：US20240364002A1

公开(公告)日：2024-10-31

申请号：US18139206

申请日：2023-04-25

Applicant: Intel Corporation

Inventor： Harald Gossner ,  Thomas Wagner ,  Bernd Waidhas ,  Georg Seidemann ,  Tae Young Yang ,  Telesphor Kamgaing

IPC: H01Q1/50 ,  H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/50 ,  H01Q1/2283 ,  H01Q9/045

Abstract: An antenna device includes integrated polymer nanocomposite (PNC) devices coupling an antenna on a substrate to both ground and signal terminals. The PNC devices may include PNC material between two electrodes. The PNC devices may be integrated into the antenna device with the substrate including at least one electrode of each of the PNC devices. One PNC device may convey a signal to or from the antenna, e.g., between the antenna and a signal terminal. Another PNC device may convey an electrostatic discharge (ESD) pulse to a ground terminal. The antenna device may include or be coupled to an integrated circuit (IC) die. The IC die may couple to the signal and ground terminals, e.g., opposite the substrate from the antenna.

公开(公告)号：US12126068B2

公开(公告)日：2024-10-22

申请号：US16912027

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16

CPC classification number: H01P3/16

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US20240312869A1

公开(公告)日：2024-09-19

申请号：US18183505

申请日：2023-03-14

Applicant: Intel Corporation

Inventor： Tongyan Zhai ,  Telesphor Kamgaing ,  Min Suet Lim

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/528

CPC classification number: H01L23/473 ,  H01L23/528 ,  H01L24/32 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/32225

Abstract: Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device. In this arrangement, heat can become trapped inside the device. A microfluidic cooling layer is formed near a top or front the device, e.g., over the semiconductor devices and any front side interconnect structures, to transfer heat away from the semiconductor devices.

公开(公告)号：US12007170B2

公开(公告)日：2024-06-11

申请号：US16533235

申请日：2019-08-06

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: F28D15/04 ,  H01L23/367 ,  H01L23/38 ,  H01L23/427

CPC classification number: F28D15/046 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/38 ,  H01L23/427

Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

公开(公告)号：US11894324B2

公开(公告)日：2024-02-06

申请号：US17528049

申请日：2021-11-16

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Telesphor Kamgaing ,  Sri Ranga Sai Boyapati ,  Kristof Darmawikarta ,  Eyal Fayneh ,  Ofir Degani ,  David Levy ,  Johanna M. Swan

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/66 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/17 ,  H01L2223/6627 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2924/19033

Abstract: In-package radio frequency (RF) waveguides as high bandwidth chip-to-chip interconnects and methods for using the same are disclosed. In one example, an electronic package includes a package substrate, first and second silicon dies or tiles, and an RF waveguide. The first and second silicon dies or tiles are attached to the package substrate. The RF waveguide is formed in the package substrate and interconnects the first silicon die or tile with the second silicon die or tile.

公开(公告)号：US11764452B2

公开(公告)日：2023-09-19

申请号：US17672876

申请日：2022-02-16

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Adel A. Elsherbini ,  Telesphor Kamgaing ,  Henning Braunisch ,  Johanna M. Swan

IPC: H01P3/16 ,  H01L23/66 ,  H01P11/00 ,  H04B10/2581

CPC classification number: H01P3/16 ,  H01L23/66 ,  H01P11/006 ,  H01L2223/6627 ,  H04B10/2581

Abstract: Disclosed herein are various designs for dielectric waveguides, as well as methods of manufacturing such waveguides. One type of dielectric waveguides described herein includes waveguides with one or more cavities in the dielectric waveguide material. Another type of dielectric waveguides described herein includes waveguides with a conductive ridge in the dielectric waveguide material. Dielectric waveguides described herein may be dispersion reduced dielectric waveguides, compared to conventional dielectric waveguides, and may be designed to adjust the difference in the group delay between the lower frequencies and the higher frequencies of a chosen bandwidth.

公开(公告)号：US11694962B2

公开(公告)日：2023-07-04

申请号：US17229991

申请日：2021-04-14

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Feras Eid ,  Telesphor Kamgaing ,  Johanna M. Swan

IPC: H01L23/538 ,  B81B7/00 ,  H01L23/28 ,  H01L23/552 ,  H01L21/56

CPC classification number: H01L23/5385 ,  B81B7/0006 ,  B81B7/007 ,  H01L21/565 ,  H01L23/28 ,  H01L23/5384 ,  H01L23/552

Abstract: Embodiments may relate to a microelectronic package that includes an overmold material, a redistribution layer (RDL) in the overmold material, and a die in the overmold material electrically coupled with the RDL on an active side of the die. The RDL is configured to provide electrical interconnection within the overmold material and includes at least one mold interconnect. The microelectronic package may also include a through-mold via (TMV) disposed in the overmold material and electrically coupled to the RDL by the mold interconnect. In some embodiments, the microelectronics package further includes a surface mount device (SMD) in the overmold material. The microelectronics package may also include a substrate having a face on which the overmold is disposed.

公开(公告)号：US20230197620A1

公开(公告)日：2023-06-22

申请号：US17558304

申请日：2021-12-21

Applicant: Intel Corporation

Inventor： Veronica Strong ,  Aleksandar Aleksov ,  Georgios Dogiamis ,  Telesphor Kamgaing ,  Neelam Prabhu Gaunkar ,  Brandon Rawlings

IPC: H01L23/538 ,  H01L21/48 ,  H01L25/065

CPC classification number: H01L23/5384 ,  H01L21/486 ,  H01L25/0652 ,  H01L25/0657 ,  H01L23/49866

Abstract: Methods, systems, apparatus, and articles of manufacture are disclosed for integrated circuit package substrates with high aspect ratio through glass vias. An example microelectronic package including a glass substrate including a via, the via including a high aspect ratio. The example microelectronic package further including a seed layer extending substantially evenly along an inner wall of the via.