Method of manufacturing integrated circuit

    公开(公告)号:US12243822B2

    公开(公告)日:2025-03-04

    申请号:US18447572

    申请日:2023-08-10

    Abstract: A method includes forming a first transistor stack over a substrate. The first transistor stack includes: a first transistor of a first conductivity type, and a second transistor of a second conductivity type different from the first conductivity type. The second transistor is above the first transistor. A plurality of first conductive lines is formed in a first metal layer above the first transistor stack. The plurality of first conductive lines includes, over the first transistor stack, a power conductive line configured to route power to the first transistor stack, one or more signal conductive lines configured to route one or more signals to the first transistor stack, and a shielding conductive line configured to shield the routed one or more signals. The one or more signal conductive lines are between the power conductive line and the shielding conductive line.

    Integrated circuit and method of forming the same

    公开(公告)号:US12205941B2

    公开(公告)日:2025-01-21

    申请号:US17727338

    申请日:2022-04-22

    Abstract: An integrated circuit includes a set of active regions, a first set of contacts, a set of gates, a first set of power rails and a first set of vias. The set of active regions extends in a first direction. The first set of contacts overlaps the set of active regions, and a first and a second cell boundary of the integrated circuit that extends in a second direction. The set of gates extends in the second direction, overlaps the set of active regions, and is between the first and second cell boundary. The first set of power rails extends in the first direction, and overlaps at least the first set of contacts. The first set of vias electrically couples the first set of contacts and the first set of power rails together. The set of active regions extend continuously through the first cell boundary and the second cell boundary.

    TIE OFF DEVICE
    146.
    发明申请

    公开(公告)号:US20240387547A1

    公开(公告)日:2024-11-21

    申请号:US18785700

    申请日:2024-07-26

    Abstract: An integrated circuit device includes a first power rail, a first active area extending in a first direction, and a plurality of gates contacting the first active area and extending in a second direction perpendicular to the first direction. A first transistor includes the first active area and a first one of the gates. The first transistor has a first threshold voltage (VT). A second transistor includes the first active area and a second one of the gates. The second transistor has a second VT different than the first VT. A tie-off transistor is positioned between the first transistor and the second transistor, and includes the first active area and a third one of the gates, wherein the third gate is connected to the first power rail.

    Flip-flop with delineated layout for reduced footprint

    公开(公告)号:US12015409B2

    公开(公告)日:2024-06-18

    申请号:US17339121

    申请日:2021-06-04

    CPC classification number: H03K3/35625 G01R31/318541 H01L27/0207 H01L27/092

    Abstract: In some embodiments, a flip-flop is disposed as an integrated circuit layout on a flip-flop region of a semiconductor substrate. The flip-flop includes a first clock inverter circuit that resides within the flip-flop region, and a second clock inverter circuit residing within the flip-flop region. The first clock inverter circuit and the second clock inverter circuit are disposed on a first line. Master switch circuitry is made up of a first plurality of devices which are circumscribed by a master switch perimeter that resides within the flip-flop region of the integrated circuit layout. The master switch circuitry and the first clock inverter circuit are disposed on a second line perpendicular to the first line. Slave switch circuitry is operably coupled to an output of the master switch circuitry. The slave switch circuitry is made up of a third plurality of devices that are circumscribed by a slave switch perimeter. The slave switch circuitry and the second clock inverter circuit are disposed on a third line that is in parallel with and spaced apart from the second line.

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