SIMULATION-ASSISTED METROLOGY IMAGE ALIGNMENT
    151.
    发明公开

    公开(公告)号:US20230401727A1

    公开(公告)日:2023-12-14

    申请号:US18035233

    申请日:2021-10-19

    Inventor: Te-Sheng WANG

    Abstract: A method for aligning a measured image of a pattern printed on a substrate with a design layout. The method includes: obtaining a design layout of a pattern to be printed on a substrate and a measured image of the pattern printed on the substrate; performing a simulation process to generate a plurality of simulated contours of the design layout for a plurality of process conditions of a patterning process; identifying a set of disfavored locations based on the simulated contours; and performing an image alignment process to align the measured image with a selected contour of the simulated contours using locations other than the set of disfavored locations.

    ACTIVE LEARNING-BASED DEFECT LOCATION IDENTIFICATION

    公开(公告)号:US20230401694A1

    公开(公告)日:2023-12-14

    申请号:US18033786

    申请日:2021-11-02

    CPC classification number: G06T7/001 G06T2207/20081 G06T2207/30148

    Abstract: A method and apparatus for identifying locations to be inspected on a substrate is disclosed. A defect location prediction model is trained using a training dataset associated with other substrates to generate a prediction of defect or non-defect and a confidence score associated with the prediction for each of the locations based on process-related data associated with the substrates. Those of the locations determined by the defect location prediction model as having confidences scores satisfying a confidence threshold are added to a set of locations to be inspected by an inspection system. After the set of locations are inspected, the inspection results data is obtained, and the defect location prediction model is incrementally trained by using the inspection results data and process-related data for the set of locations as training data.

    Temperature conditioning system
    155.
    发明授权

    公开(公告)号:US11835870B2

    公开(公告)日:2023-12-05

    申请号:US17627720

    申请日:2020-06-18

    CPC classification number: G03F7/70891

    Abstract: A passive flow induced vibration reduction system for use in a temperature conditioning system that controls the temperature of at least one component within a lithographic apparatus. This FIV reduction system includes: a conduit that provides a flow path for a liquid through the system; a liquid filled cavity in fluid connection with the conduit, wherein the fluid connection is provided via one or more openings in the wall of the conduit; a membrane configured such that it separates the liquid in the liquid filled cavity from a gas at a substantially ambient pressure and the membrane is configured such that compliance of the membrane reduces at least low frequency flow induced vibrations in the liquid flowing through the conduit; and an end-stop located on the gas side of the membrane, wherein the end-stop is configured to limit an extent of deflection of the membrane.

    Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

    公开(公告)号:US11828585B2

    公开(公告)日:2023-11-28

    申请号:US17692974

    申请日:2022-03-11

    CPC classification number: G01B11/24 G03F7/7085 G03F7/70191 G03F7/70633

    Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.

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