公开(公告)号：US07531796B2

公开(公告)日：2009-05-12

申请号：US11840575

申请日：2007-08-17

Applicant: Junichi Tashiro ,  Yutaka Ikku ,  Toshiaki Fujii

Inventor： Junichi Tashiro ,  Yutaka Ikku ,  Toshiaki Fujii

IPC: H01J37/305 ,  H01J37/30 ,  G01N23/22

CPC classification number: G01N23/2255 ,  G01N1/32 ,  G01N2223/104 ,  G01N2223/32 ,  G01N2223/611 ,  H01J37/3005 ,  H01J37/3045 ,  H01J37/3056 ,  H01J2237/30466 ,  H01J2237/30488 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: Detected is a secondary electron generated by irradiating a focused ion beam while performing etching a sample section and the around through scan-irradiating the focused ion beam. From a changing amount of the detected secondary electron signal an end-point detecting mechanism detects an end point to thereby terminate the etching, so that a center position of a defect or a contact hole is effectively detected even with an FIB apparatus not having a SEM observation function.

Abstract translation: 检测到的是通过照射聚焦离子束而同时进行蚀刻样品部分和周围扫描照射聚焦离子束而产生的二次电子。 从检测到的二次电子信号的变化量中，终点检测机构检测终点，从而终止蚀刻，即使不具有SEM的FIB装置也能够有效地检测缺陷或接触孔的中心位置 观察功能。

公开(公告)号：US07488961B2

公开(公告)日：2009-02-10

申请号：US11586232

申请日：2006-10-25

Applicant: Masashi Muramatsu ,  Tomokazu Kozakai ,  Ryoji Hagiwara

Inventor： Masashi Muramatsu ,  Tomokazu Kozakai ,  Ryoji Hagiwara

IPC: A61N5/00 ,  H01J37/302

CPC classification number: H01J37/3026 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/222 ,  H01J37/265 ,  H01J37/28 ,  H01J37/3174 ,  H01J2237/2809 ,  H01J2237/2813 ,  H01J2237/30461 ,  H01J2237/30488 ,  H01J2237/31761

Abstract: A computer sets a process area based on an image obtained by observing a mask, and determines the positions of representative points that form a contour of the process area for each pixel with sub-pixel accuracy that is better than a pixel, the position of each of the representative points being able to be set to either the center position of the pixel or a position displaced therefrom. Furthermore, for the pixels within the process area, the computer sets the center positions of the pixels as the representative points and corrects the positions of the representative points of the pixels within the process area on a sub-pixel basis such that nonuniformity between the representative points is reduced. When the mask is processed, the charged particle beam is applied with sub-pixel accuracy to the positions of the representative points that form the contour for the pixels that includes the contour of the process area and to the positions of the corrected representative points for the pixels within the process area.

Abstract translation: 计算机基于通过观察掩模获得的图像来设置处理区域，并且确定形成每个像素的处理区域的轮廓的代表点的位置，其中子像素精度优于像素，每个像素的位置 能够将代表点设置为像素的中心位置或从其偏移的位置。 此外，对于处理区域内的像素，计算机将像素的中心位置设置为代表点，并且在子像素的基础上校正处理区域内的像素的代表点的位置，使得代表之间的不均匀性 积分减少。 当处理掩模时，将带电粒子束以子像素精度施加到形成用于包括处理区域的轮廓的像素的轮廓的代表点的位置以及针对该处理区域的修正的代表点的位置 处理区域内的像素。

公开(公告)号：US07485880B2

公开(公告)日：2009-02-03

申请号：US11586190

申请日：2006-10-25

Applicant: Tomokazu Kozakai ,  Masashi Muramatsu ,  Ryoji Hagiwara

Inventor： Tomokazu Kozakai ,  Masashi Muramatsu ,  Ryoji Hagiwara

IPC: A61N5/00 ,  H01J37/302

CPC classification number: B23K15/02 ,  B23K15/0013 ,  H01J37/28 ,  H01J37/304 ,  H01J37/3056 ,  H01J2237/31744 ,  H01J2237/31749

Abstract: After a scan area for observing or processing a mask is set, a computer of the charged particle beam apparatus determines a plurality of scan lines in the scan area by the following steps of: setting a scan line along the outer circumference of the scan area; determining a scan line inside and along the thus set scan line; determining a scan line inside and along the thus determined scan line; and repeating the step of determining a scan line. After the scan lines are determined, the computer controls a scanning circuit to apply an ion beam to the scan lines while thinning out scan lines and/or pixels.

Abstract translation: 在设置用于观察或处理掩模的扫描区域之后，带电粒子束装置的计算机通过以下步骤确定扫描区域中的多条扫描线：沿着扫描区域的外周设置扫描线; 沿着这样设置的扫描线确定扫描线; 沿着这样确定的扫描线确定扫描线; 以及重复确定扫描线的步骤。 在扫描线被确定之后，计算机控制扫描电路以将扫描线施加离子束同时减少扫描线和/或像素。

公开(公告)号：US07459699B2

公开(公告)日：2008-12-02

申请号：US11286684

申请日：2005-11-23

Applicant: Masahiro Kiyohara ,  Makoto Sato ,  Tatsuya Asahata

Inventor： Masahiro Kiyohara ,  Makoto Sato ,  Tatsuya Asahata

IPC: G01J1/00 ,  G01N21/00 ,  G01N23/00

CPC classification number: G01N23/225 ,  H01J2237/317

Abstract: A laser mark which will be the positioning mark for a secondary charged particle image in the charged particle beam apparatus is applied by moving the sample processing/observation area in the charged particle beam apparatus so as to come into the view field while performing an observation by an infrared microscope, and by a using a laser optical system disposed coaxially with an optical observation system, the mark made at the periphery of the processing/observation object area. Next, by a superposition of an infrared transmission image and a CAD data, the processing/observation object area and the laser mark are registered onto the CAD data. And, by a correlation of the registered data read from the charged particle beam apparatus and the secondary charged particle image, it is possible to accurately and easily determine the processing position.

Abstract translation: 作为带电粒子束装置中的二次带电粒子图像的定位标记的激光标记是通过移动带电粒子束装置中的样品处理/观察区域进行观察的场所，同时进行观察 通过使用与光学观察系统同轴设置的激光光学系统，在处理/观察对象区域的周围形成标记。 接下来，通过红外透射图像和CAD数据的叠加，将处理/观察对象区域和激光标记登记在CAD数据上。 并且，通过从带电粒子束装置读取的登录数据与二次带电粒子图像的相关性，可以准确且容易地确定处理位置。

公开(公告)号：US07424093B2

公开(公告)日：2008-09-09

申请号：US11805665

申请日：2007-05-24

Applicant: Takayuki Fukai ,  Yoshiki Matoba ,  Masanori Takahashi

Inventor： Takayuki Fukai ,  Yoshiki Matoba ,  Masanori Takahashi

IPC: G01N23/223

CPC classification number: G01N23/223 ,  G01N2223/076 ,  G01N2223/618 ,  G01N2223/635 ,  G01N2223/639

Abstract: To provide a fluorescent X-ray analysis apparatus, whereby a peak-back ratio is improved by effectively exciting a focused element and a detection limit of the focused element is improved by decreasing a scattered X-ray to be a background. A sample housing has one or more wall surfaces made of a material through which an X-ray transmits and an X-ray source is arranged so that a primary X-ray is irradiated on the wall surface. In addition, the sample housing is arranged so that a wall surface different from a wall surface on which the primary X-ray is irradiated is opposed to an X-ray detector incident window. Further, the primary X-ray from the X-ray source is arranged so as to be able to irradiate the wall surface of the sample housing to which the X-ray detector incident window is opposed. The sample housing has a shape extending in response to extension of a viewing filed that a detection element in the X-ray detector is seen from the X-ray detector incident window. In addition, on the wall of the sample housing, a metal for secondarily exciting the focused element is arranged on an area other than an area through which the primary X-ray transmits and an area where the fluorescent X-ray from the focused element passes to the detector.

Abstract translation: 为了提供一种荧光X射线分析装置，通过有效地激发聚焦元件来提高峰回比，并且通过将散射的X射线减少为背景来提高聚焦元件的检测极限。 样品壳体具有一个或多个由X射线透过的材料制成的壁表面，并且X射线源被布置成使得主壁X射线照射在壁表面上。 另外，样品壳体被布置成使得不同于其上照射有初级X射线的壁表面的壁表面与X射线检测器入射窗口相对。 此外，来自X射线源的主要X射线被布置成能够照射X射线检测器入射窗口相对的样品壳体的壁表面。 样品壳体具有响应于从X射线检测器入射窗看到X射线检测器中的检测元件的观察区域的延伸而延伸的形状。 此外，在样品壳体的壁上，用于次要激发聚焦元件的金属被布置在除了主X射线透射的区域之外的区域和来自聚焦元件的荧光X射线通过的区域 到检测器。

公开(公告)号：US07373806B2

公开(公告)日：2008-05-20

申请号：US10925049

申请日：2004-08-24

Applicant: Itaru Kitajima ,  Kazutoshi Watanabe ,  Shigeru Wakiyama ,  Masatoshi Yasutake ,  Akira Inoue

Inventor： Itaru Kitajima ,  Kazutoshi Watanabe ,  Shigeru Wakiyama ,  Masatoshi Yasutake ,  Akira Inoue

IPC: G01B5/28

CPC classification number: G01Q10/065 ,  G01Q60/32

Abstract: A scanning probe microscope has a probe tip for undergoing a scanning operation to scan a sample surface in X- and Y-directions parallel to the sample surface and for undergoing movement in a Z-direction vertical to the sample surface. A vibration unit vibrates the probe tip at a vibration frequency that resonates with of forcedly vibrates the probe tip. An observation unit collects observational data from the sample surface when the probe tip is in proximity or contact with the sample surface. A detection unit detects a variation in the state of vibration of the probe tip when the probe tip is in proximity or contact with the sample surface during a scanning operation. A control controls scanning of the probe tip in the X- and Y-directions and movement of the probe tip in the Z-direction, and controls scanning of the probe tip in a direction parallel to the sample surface after the observational data is collected from the sample surface and until the probe tip reached a next observation position in the X- and Y-direction. During a scanning operation, the control unit controls the probe tip to move in the Z-direction away from the sample surface only when the detection unit detects a variation in the state of vibration of the probe tip.

Abstract translation: 扫描探针显微镜具有用于进行扫描操作的探针尖端，以在与样品表面平行的X和Y方向上扫描样品表面，并且在垂直于样品表面的Z方向上进行移动。 振动单元以与谐振的振动频率振动探针尖端，强制地振动探针尖端。 当探头尖端接近或与样品表面接触时，观察单元从样品表面收集观察数据。 检测单元在扫描操作期间当探针尖端接近或接触样品表面时检测探针尖端的振动状态的变化。 控制器控制探针尖端沿X方向和Y方向的扫描以及探针尖端沿Z方向的移动，并且在从观察数据收集之后控制探针尖端在与样品表面平行的方向上的扫描 样品表面，直到探针尖端到达X和Y方向的下一个观察位置。 在扫描操作期间，只有当检测单元检测到探针尖端的振动状态的变化时，控制单元才控制探针尖端沿Z方向移动离开样品表面。

公开(公告)号：US07285792B2

公开(公告)日：2007-10-23

申请号：US11086812

申请日：2005-03-21

Applicant: Naoya Watanabe ,  Osamu Takaoka

Inventor： Naoya Watanabe ,  Osamu Takaoka

IPC: G01B5/28

CPC classification number: G03F1/72 ,  G01Q80/00

Abstract: A sample to be processed is disposed within a processing cell which contains a liquid. Scratch processing using a scanning probe microscope is performed within the liquid so that chips or shavings removed from the sample scatter within the liquid rather than collecting on the surface of the sample. The processing cell has a supply port and a discharge port so that new liquid can be supplied within the cell through the supply port after the termination of the scratch processing to clean the cell. In this manner, chips or shavings generated by scratch processing a defect portion of the sample can be removed completely without being collected at the surface of a sample despite the surface tension of adsorbed water existing on the sample surface and/or electrostatic charges caused by friction.

Abstract translation: 要处理的样品设置在含有液体的处理单元内。 在液体内进行使用扫描探针显微镜的划痕处理，使得从样品中除去的碎屑或碎屑在液体内分散而不是收集在样品的表面上。 处理单元具有供给口和排出口，使得能够在暂时处理结束之后通过供给口在电池内供给新的液体，以清洁电池。 以这种方式，尽管样品表面存在吸附水的表面张力和/或由摩擦引起的静电电荷，但是通过刮擦处理产生的切屑或刨屑可以被完全去除而不被收集在样品的表面 。

公开(公告)号：US07267731B2

公开(公告)日：2007-09-11

申请号：US10712147

申请日：2003-11-13

Applicant: Kouji Iwasaki

Inventor： Kouji Iwasaki

IPC: C21D1/54

CPC classification number: C23C16/047 ,  B33Y50/02 ,  H01J37/3023 ,  H01J2237/30411 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749

Abstract: A method of fabricating a three-dimensional microstructure provides data corresponding to information relating to the structure of a three-dimensional microstructure design. A sample is processed in accordance with the provided data by irradiating the sample with a charged-particle beam while controlling processing conditions of the charged-particle beam. Dimensions of the processed sample are compared with the provided data to identify differences between the structure of the processed sample and the structure of the three-dimensional microstructure design. The sample is then irradiated again with a charged-particle beam to correct the identified structural differences while adjusting the processing conditions of the charged-particle beam to thereby fabricate a three-dimensional microstructure having a structure substantially the same as the structure of the three-dimensional microstructure design.

Abstract translation: 制造三维微结构的方法提供对应于与三维微结构设计的结构有关的信息的数据。 在控制带电粒子束的处理条件的同时，通过用带电粒子束照射样品，根据提供的数据处理样品。 将处理过的样品的尺寸与提供的数据进行比较，以识别经处理样品的结构与三维微结构设计的结构之间的差异。 然后再次用带电粒子束照射样品以校正所识别的结构差异，同时调节带电粒子束的处理条件，从而制造具有与三维结构基本相同的结构的三维微结构， 尺寸微结构设计。

公开(公告)号：US07241997B2

公开(公告)日：2007-07-10

申请号：US11032801

申请日：2005-01-11

Applicant: Akikazu Odawara ,  Satoshi Nakayama ,  Keiichi Tanaka

Inventor： Akikazu Odawara ,  Satoshi Nakayama ,  Keiichi Tanaka

IPC: H01L27/18 ,  H01L39/00

CPC classification number: G01T1/1606

Abstract: A superconducting X-ray detection apparatus has a refrigerator, a cooling head cooled by the refrigerator, and a stacked structure connected to an end portion of the cooling head. The stacked structure comprises a sensor holder, a low-temperature first-stage amplifier connected to the sensor holder, and a superconducting X-ray detector mounted on the low-temperature first-stage amplifier.

Abstract translation: 超导X射线检测装置具有冰箱，由冰箱冷却的冷却头，以及与冷却头的端部连接的层叠结构。 堆叠结构包括传感器保持器，连接到传感器保持器的低温第一级放大器和安装在低温第一级放大器上的超导X射线检测器。

公开(公告)号：US07107826B2

公开(公告)日：2006-09-19

申请号：US11096875

申请日：2005-04-01

Applicant: Naoya Watanabe ,  Osamu Takaoka

Inventor： Naoya Watanabe ,  Osamu Takaoka

IPC: H01J37/352

CPC classification number: G01Q60/32 ,  G01Q80/00 ,  G03F1/72

Abstract: There is provided a device in which a probe can be used for both of observation and correction, and which can, even if a next generation photomask of ultra minute structure is made an object, perform a desired processing without injuring a normal portion in a process of obtaining information of a position and a shape of a defect part, and without impairing the probe also at a processing time. It has been adapted such that, at an observation time, a contact pressure between a probe and a mask is reduced to 0.1 nN by applying a vibration of 1 kHz to 1 MHz to the probe. It has been adapted such that a cantilever used in the present invention is formed by a silicon material of 100–600 μm in length and 5–50 μm in thickness and, at the observation time, the probe contacts with the mask at the contact pressure of 0.1 nN and, at the processing time, a defect correction can be performed by causing the probe to contact with the mask at the contact pressure of 10 nN to 1 mN.

Abstract translation: 提供了一种可以将探头用于观察和校正的装置，并且即使下一代超微小结构的光掩模被制成物体也可以进行所需的处理而不损害处理中的正常部分 获得缺陷部分的位置和形状的信息，并且在处理时间也不损害探针。 已经适应使得在观察时间，通过向探针施加1kHz至1MHz的振动，将探针和掩模之间的接触压力降低至0.1nN。 已经适应使得本发明中使用的悬臂由长度为100〜600μm，厚度为5-50μm的硅材料形成，并且在观察时刻，探针以接触压力与掩模接触 0.1nN，并且在处理时间，可以通过使探针以10nN至1mN的接触压力与掩模接触来进行缺陷校正。