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    Microelectromechanical device and method utilizing a porous surface
    161.
    发明授权
    Microelectromechanical device and method utilizing a porous surface 失效
    微机电装置和利用多孔表面的方法

    公开(公告)号：US07564613B2

    公开(公告)日：2009-07-21

    申请号：US11869467

    申请日：2007-10-09

    Applicant: Teruo Sasagawa ,  Lior Kogut

    Inventor： Teruo Sasagawa ,  Lior Kogut

    IPC: G02B26/00

    CPC classification number: B81B3/001 ,  B81B2201/047 ,  B81C2201/0115 ,  G02B26/001

    Abstract: A microelectromechanical device (MEMS) utilizing a porous electrode surface for reducing stiction is disclosed. In one embodiment, a microelectromechanical device is an interferometric modulator that includes a transparent electrode having a first surface; and a movable reflective electrode with a second surface facing the first surface. The movable reflective electrode is movable between a relaxed and actuated (collapsed) position. An aluminum layer is provided on either the first or second surface. The aluminum layer is then anodized to provide an aluminum oxide layer which has a porous surface. The porous surface, in the actuated position, decreases contact area between the electrodes, thus reducing stiction.

    Abstract translation: 公开了一种利用多孔电极表面降低静摩擦力的微机电装置（MEMS）。 在一个实施例中，微机电装置是干涉式调制器，其包括具有第一表面的透明电极; 以及具有面向第一表面的第二表面的可移动反射电极。 可移动反射电极可在松弛和致动（折叠）位置之间移动。 在第一或第二表面上提供铝层。 然后将铝层阳极氧化以提供具有多孔表面的氧化铝层。 处于致动位置的多孔表面减小了电极之间的接触面积，从而减小了静电。

    Deposited thin films and their use in separation and sacrificial layer applications
    165.
    发明授权
    Deposited thin films and their use in separation and sacrificial layer applications 失效
    沉积的薄膜及其在分离和牺牲层应用中的应用

    公开(公告)号：US07427526B2

    公开(公告)日：2008-09-23

    申请号：US09836449

    申请日：2001-04-17

    Applicant: Stephen J. Fonash ,  Wook Jun Nam ,  Youngchul Lee ,  Kyuhwan Chang ,  Daniel J. Hayes ,  A. Kaan Kalkan ,  Sanghoon Bae

    Inventor： Stephen J. Fonash ,  Wook Jun Nam ,  Youngchul Lee ,  Kyuhwan Chang ,  Daniel J. Hayes ,  A. Kaan Kalkan ,  Sanghoon Bae

    IPC: H01L21/00

    CPC classification number: B81C1/0038 ,  B81C1/00119 ,  B81C1/00476 ,  B81C2201/0115 ,  G01N21/17 ,  G01N27/44717 ,  Y10T29/49108

    Abstract: This invention uses large surface to volume ratio materials for separation, release layer, and sacrificial material applications. The invention outlines the material concept, application designs, and fabrication methodologies. The invention is demonstrated using deposited column/void network materials as examples of large surface to volume ratio materials. In a number of the specific applications discussed, it is shown that it is advantageous to create structures on a laminate on a mother substrate and then, using the separation layer material approach, to separate this laminate from the mother substrate using the present separation scheme. It is also shown that the present materials have excellent release layer utility. In a number of applications it is also shown how the approach can be used to uniquely form cavities, channels, air-gaps, and related structures in or on various substrates. Further, it is demonstrated that it also can be possible and advantageous to combine the schemes for cavity formation with the scheme for laminate separation.

    Abstract translation: 本发明使用大的表面体积比的材料用于分离，剥离层和牺牲材料应用。 本发明概述了材料概念，应用设计和制造方法。 本发明使用沉积柱/空隙网络材料作为大表面积与体积比的材料的实例进行了说明。 在讨论的许多具体应用中，显示了在母基板上的层压体上产生结构，然后使用分离层材料方法，使用本分离方案将该层压体与母基板分离是有利的。 还显示出本发明材料具有优异的脱模层效用。 在许多应用中，还显示了该方法如何用于在各种基底中或其上独特地形成腔，通道，气隙和相关结构。 此外，证明了将空腔形成方案与层压分离方案组合也是有可能和有利的。

    Low power silicon thermal sensors and microfluidic devices based on the use of porous sealed air cavity technology or microchannel technology
    167.
    发明授权
    Low power silicon thermal sensors and microfluidic devices based on the use of porous sealed air cavity technology or microchannel technology 失效
    基于使用多孔密封空腔技术或微通道技术的低功率硅热传感器和微流体装置

    公开(公告)号：US07233000B2

    公开(公告)日：2007-06-19

    申请号：US10502465

    申请日：2003-01-16

    Applicant: Androula G. Nassiopoulou ,  Grigoris Kaltsas ,  Dimitrios N. Pagonis

    Inventor： Androula G. Nassiopoulou ,  Grigoris Kaltsas ,  Dimitrios N. Pagonis

    IPC: G01J5/20 ,  H01L27/14 ,  H01L31/0248 ,  H01L21/02

    CPC classification number: B81C1/00071 ,  B81B2201/058 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C2201/0114 ,  B81C2201/0115 ,  G01F1/6845 ,  G01K7/028

    Abstract: This invention provides a miniaturized silicon thermal flow sensor with improved characteristics, based on the use of two series of integrated thermocouples (6, 7) on each side of a heater (4), all integrated on a porous silicon membrane (2) on top of a cavity (3). Porous silicon (2) with the cavity (3) underneath provides very good thermal isolation for the sensor elements, so as the power needed to maintain the heater (4) at a given temperature is very low. The formation process of the porous silicon membrane (2) with the cavity (3) underneath is a two-step single electrochemical process. It is based on the fact that when the anodic current is relatively low, we are in a regime of porous silicon formation, while if this current exceeds a certain value we turn into a regime of electropolishing. The process starts at low current to form porous silicon (2) and it is then turned into electropolishing conditions to form the cavity (3) underneath. Various types of thermal sensor devices, such as flow sensors, gas sensors, IR detectors, humidity sensors and thermoelectric power generators are described using the proposed methodology. Furthermore the present invention provides a method for the formation of microfluidic channels (16) using the same technique of porous silicon (17) and cavity (16) formation.

    Abstract translation: 本发明提供了一种基于在加热器（4）的每一侧上使用两个集成的热电偶（6,7）的系列，具有改进的特性的小型化硅热流量传感器，它们全部集成在顶部的多孔硅膜（2）上 的腔（3）。 具有下面的空腔（3）的多孔硅（2）为传感器元件提供了非常好的热隔离，因此将加热器（4）保持在给定温度所需的功率非常低。 多孔硅膜（2）与下面的腔（3）的形成过程是两步单电化学过程。 这是基于以下事实：当阳极电流相对较低时，我们处于多孔硅形成的状态，而如果该电流超过一定值，则我们变成电解抛光的方式。 该工艺以低电流开始形成多孔硅（2），然后转化为电解抛光条件以形成下面的空腔（3）。 使用所提出的方法描述了各种类型的热传感器装置，例如流量传感器，气体传感器，红外探测器，湿度传感器和热电发电机。 此外，本发明提供了使用与多孔硅（17）和空腔（16）相同的技术形成微流体通道（16）的方法。

    METHOD FOR PRODUCING A COMPONENT HAVING A SEMICONDUCTOR SUBSTRATE AND COMPONENT
    168.
    发明申请
    METHOD FOR PRODUCING A COMPONENT HAVING A SEMICONDUCTOR SUBSTRATE AND COMPONENT 有权
    用于生产具有半导体基材和组分的组分的方法

    公开(公告)号：US20060258037A1

    公开(公告)日：2006-11-16

    申请号：US10544821

    申请日：2003-11-06

    Applicant: Frank Fischer ,  Thorsten Pannek ,  Lars Metzger

    Inventor： Frank Fischer ,  Thorsten Pannek ,  Lars Metzger

    IPC: H01L21/00

    CPC classification number: B81C1/0069 ,  B81C2201/0115

    Abstract: A method for producing a component having a semiconductor substrate, in which porous semiconductor material is generated for the purpose of developing at least one thermally decoupled pattern. In the material that has been rendered porous, a recess or a plurality of recesses is/are etched to produce at least one region that is defined by the one recess or the plurality of recesses and is thermally decoupled. On the at least one region, the pattern to be thermally decoupled is then formed.

    Abstract translation: 一种用于制造具有半导体衬底的部件的方法，其中产生多孔半导体材料用于形成至少一个热解耦图形。 在已经被多孔化的材料中，凹陷或多个凹陷被蚀刻以产生由一个凹部或多个凹部限定并且被热解耦的至少一个区域。 在至少一个区域上，形成待热解耦的图案。

    Method of fabricating micro-needle array
    169.
    发明申请
    Method of fabricating micro-needle array 失效
    微针阵列制作方法

    公开(公告)号：US20060172541A1

    公开(公告)日：2006-08-03

    申请号：US11327463

    申请日：2006-01-09

    Applicant: Chang-seung Lee

    Inventor： Chang-seung Lee

    IPC: H01L21/302 ,  H01L21/311 ,  H01L21/461

    CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C2201/0115

    Abstract: A method of fabricating a micro-needle array is provided. The method of fabricating a micro-needle array having a substrate having a first surface and a second surface spaced in a predetermined interval apart from the first surface, includes patterning on the first surface, thereby forming a shape of micro-needle bodies. Further, micro-passageways are formed that penetrate the first surface of the substrate from the second surface by a porous silicon process, and integrates the micro-passageways, thereby forming the bodies and channels of micro-needles.

    Abstract translation: 提供一种制造微针阵列的方法。 制造具有第一表面和与第一表面隔开预定间隔的第二表面的基底的微针阵列的方法包括在第一表面上的图案化，从而形成微针体的形状。 此外，通过多孔硅工艺形成从第二表面穿透基板的第一表面的微通道，并且将微通道整合，从而形成微针的主体和通道。

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