Abstract:
An integrated circuit package-in-package system includes: mounting an integrated circuit device over a package carrier; forming a subassembly including: providing an integrated circuit package system having a carrier interposer with an integrated circuit die thereover, and mounting a device under the carrier interposer; mounting the subassembly over the integrated circuit device; and encapsulating the subassembly and the integrated circuit device over the package carrier.
Abstract:
A slide hinge device mounted between two terminal bodies opening and closing by a slide type. The slide hinge device includes a rail hinge unit and a slide hinge unit. The rail hinge unit includes a guide bar disposed parallel with a side of the rail plate, and the slide hinge unit includes a slide guide, in which a penetration hole corresponding to the guide bar is formed in the center thereof, for sliding along the guide bar and a guide frame bound with the slide guide as one body. Also, a lubricating bush is previously connected between the guide bar and a moving bush, and the rail hinge unit and the slide guide may be simultaneously molded by die casting or injection molding. The slide guide may be manufactured by using self-lubricating material. The hinge device using the guide bar may be molded via one molding process. Since, basically, the slide hinge device is formed by a single molding process, an error between components may be minimized.
Abstract:
An apparatus and a method for handover between a broadband wireless communication system and a heterogeneous communication system are provided. An operating method of a base station for the handover between a broadband wireless communication system and a and a heterogeneous communication system includes when a terminal enters a border cell, sending a message requesting to measure a signal level of a downlink, to the terminal, when a signal level measured by the terminal falls below a preset threshold, requesting a handover, to a corresponding heterogeneous communication system, over a core network, receiving a message, including channel allocation information for the handover, from the corresponding heterogeneous communication system, and forwarding the message, including the channel allocation information, to the terminal. Hence, when the terminal gets out of the service coverage area of the broadband wireless communication system, it can be handed over to the heterogeneous communication system seamlessly.
Abstract:
A semiconductor chip package with a flash memory portion and a method and system for testing the same are provided. After an internal cycling test is automatically and independently initiated on the flash memory chip, a test on other memory portions in the semiconductor chip package is performed. The semiconductor chip package includes a first flash memory portion, at least one second memory portions, and an internal cycling tester repetitively performing a batch programming operation and a batch erase operation on the first flash memory portion.
Abstract:
The present invention relates to new compounds directly increasing kinase activity of p90 ribosomal S6 kinase 1 (RSK1), a pharmaceutical composition comprising them as active ingredient, a use thereof to prevent or treat hepatic fibrosis or cirrhosis, and a method for preventing or treating hepatic fiborsis or cirrhosis, comprising administering a therapeutically effective amount of the composition to mammal.
Abstract:
Disclosed is a method of setting a data transmission rate capable of setting data transmission rate of a data packet received from an upper node in mobile communication system based on a wireless environment and retransmission rate. The preferred embodiment provides not only a method to check data flow to optimize the method of assigning and withdrawing wireless channels assigned to the mobile station, but also a method of assigning and withdrawing wireless channels by checking a wireless environment and a data flow at the same time using NAK frame affected by wireless environment. It is thus possible to quickly determine the influence from a wireless environment that frequently varies and to control a data transmission rate while ensuring the mobility of the database.
Abstract:
A method for fabricating a semiconductor device including surface cleaning includes forming a gate stack on a semiconductor substrate, cleaning contaminants present on the surface of the semiconductor substrate exposed through a contact hole using an etchant including a fluorine (F)-containing species dispersed in an alcohol, and filling a contact hole with a conductive layer to form a connection contact. The etchant preferably has a low selectivity of 1 or less.
Abstract:
An integrated circuit package system that includes providing a wafer level spacer including apertures, which define unit spacers that are interconnected, and configuring the unit spacers to substantially align over devices formed within a substrate.
Abstract:
An integrated circuit package system that includes forming a strip level net spacer including support bars, tie bars and paddles. Configuring the support bars, the tie bars and the paddles to form open regions and interconnecting the support bars, the tie bars and the paddles to provide structural support to vertically stacked semiconductor devices.
Abstract:
The present invention relates to an electrode assembly and a pouch type lithium rechargeable battery having the same, which can minimize the total volume of a battery while maximizing a distance between electrode tabs. Insulation members cover portions of electrode tabs to prevent contact of an electrode tab with another electrode tab and electrode plate with opposite polarity. The shape of the insulation member is changed to effectively increase the distance between electrode tabs and to reduce overall thickness or width of the battery.