公开(公告)号：US20110095315A1

公开(公告)日：2011-04-28

申请号：US12632598

申请日：2009-12-07

Applicant: Ji Hyun PARK ,  Seog Moon Choi ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Tae Hyun Kim

Inventor： Ji Hyun PARK ,  Seog Moon Choi ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Tae Hyun Kim

IPC: H01L33/00

CPC classification number: H01L33/56 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate 11 and has a cavity space therein; electrode pads which are formed on the conductive substrate and which are spaced apart from the circuit layer by predetermined intervals such that trenches are formed between the circuit layer and the electrode pads; an optical element which is mounted in the cavity space of the circuit layer and which is electrically connected with the electrode pads; and a fluorescent resin layer which is formed on the circuit layer and the optical element to allow the optical element to uniformly emit light. The package substrate is advantageous in that uniform white light can be realized.

Abstract translation: 本文公开了一种用于光学元件的封装基板，包括：导电基板，其上形成有绝缘层; 电路层，其形成在导电基板11上并具有空腔; 电极焊盘，其形成在导电衬底上并且与电路层隔开预定间隔，使得在电路层和电极焊盘之间形成沟槽; 光学元件，其安装在所述电路层的空腔中并与所述电极焊盘电连接; 以及形成在电路层和光学元件上以允许光学元件均匀发光的荧光树脂层。 封装基板的优点在于可以实现均匀的白光。

公开(公告)号：US20110079751A1

公开(公告)日：2011-04-07

申请号：US12906917

申请日：2010-10-18

Applicant: Cheol-Hee PARK ,  Se-Hui Sohn ,  Seung-Tae Hong ,  Won-Jong Kwon ,  Tae-Hoon Kim

Inventor： Cheol-Hee PARK ,  Se-Hui Sohn ,  Seung-Tae Hong ,  Won-Jong Kwon ,  Tae-Hoon Kim

IPC: C09K5/00 ,  C01B19/00

CPC classification number: H01L35/16 ,  C09K11/881 ,  C09K11/885 ,  H01B1/08 ,  H01B1/10 ,  H01L31/0272 ,  H01L31/032 ,  H01L31/072 ,  H01L31/0725 ,  H01L35/18 ,  H01L35/22 ,  Y02E10/50

Abstract: Thermoelectric conversion materials, expressed by the following formula: Bi1-xMxCuwOa-yQ1yTeb-zQ2z. Here, M is at least one element selected from the group consisting of Ba, Sr, Ca, Mg, Cs, K, Na, Cd, Hg, Sn, Pb, Eu, Sm, Mn, Ga, In, Ti, As and Sb; Q1 and Q2 are at least one element selected from the group consisting of S, Se, As and Sb; x, y, z, w, a, and b are 0≦x

Abstract translation: 热电转换材料，由下式表示：Bi1-xMxCuwOa-yQ1yTeb-zQ2z。 这里，M是选自Ba，Sr，Ca，Mg，Cs，K，Na，Cd，Hg，Sn，Pb，Eu，Sm，Mn，Ga，In，Ti，As和 锑 Q1和Q2是选自S，Se，As和Sb中的至少一种元素; x，y，z，w，a和b分别为0＆nlE; x <1,0,0

公开(公告)号：US20110079750A1

公开(公告)日：2011-04-07

申请号：US12902927

申请日：2010-10-12

Applicant: Cheol-Hee Park ,  Se-Hui Sohn ,  Won-Jong Kwon ,  Tae-Hoon Kim ,  Seung-Tae Hong

Inventor： Cheol-Hee Park ,  Se-Hui Sohn ,  Won-Jong Kwon ,  Tae-Hoon Kim ,  Seung-Tae Hong

IPC: C09K5/00 ,  H01B1/02

CPC classification number: H01L35/16 ,  C09K11/881 ,  C09K11/885 ,  H01B1/08 ,  H01B1/10 ,  H01L31/0272 ,  H01L31/032 ,  H01L31/072 ,  H01L31/0725 ,  H01L35/18 ,  H01L35/22 ,  Y02E10/50

Abstract: Disclosed is a new compound semiconductor represented by the chemical formula: Bi1-x-yLnxMyCuOTe where Ln belongs to the lanthanoid series and is any one or more elements selected from the group consisting of La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, M is any one or more elements selected from the group consisting of Ba, Sr, Ca, Mg, Cd, Hg, Sn, Pb, Mn, Ga, In, Tl, As and Sb, and 0

Abstract translation: 公开了由化学式Bi1-x-yLnxMyCuOTe表示的新的化合物半导体，其中Ln属于镧系元素，并且是选自La，Ce，Pr，Nd，Pm，Sm，Eu中的任何一种或多种元素 ，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu中的任一种，M是选自Ba，Sr，Ca，Mg，Cd，Hg，Sn，Pb，Mn，Ga， In，Tl，As和Sb，0

公开(公告)号：US20110031608A1

公开(公告)日：2011-02-10

申请号：US12562829

申请日：2009-09-18

Applicant: Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Bum Sik Jang ,  Ji Hyun Park

Inventor： Tae Hyun KIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Bum Sik Jang ,  Ji Hyun Park

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L23/24 ,  H01L23/04 ,  H01L23/13 ,  H01L23/142 ,  H01L23/36 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed is a power device package, which has high heat dissipation performance and includes an anodized metal substrate including a metal plate having a cavity formed on one surface thereof and an anodized layer formed on both the surface of the metal plate and the inner wall of the cavity and a circuit layer formed on the metal plate, a power device mounted in the cavity of the metal plate so as to be connected to the circuit layer, and a resin sealing material charged in the cavity of the metal plate. A method of fabricating the power device package is also provided.

Abstract translation: 公开了一种功率器件封装，其具有高散热性能，并且包括阳极氧化金属基板，其包括金属板，金属板的一个表面上形成有空腔，阳极氧化层形成在金属板的表面和金属板的内壁上 空腔和形成在金属板上的电路层，安装在金属板的空腔中以连接到电路层的功率器件，以及填充在金属板的空腔中的树脂密封材料。 还提供了制造功率器件封装的方法。

公开(公告)号：US07881650B2

公开(公告)日：2011-02-01

申请号：US12036514

申请日：2008-02-25

Applicant: Su-ho Shin ,  Dong-woo Lee ,  Tae-gyu Kim ,  Chang-hoon Jung ,  Tae-hoon Kim ,  Hwan-hee Kim

Inventor： Su-ho Shin ,  Dong-woo Lee ,  Tae-gyu Kim ,  Chang-hoon Jung ,  Tae-hoon Kim ,  Hwan-hee Kim

IPC: G03G15/20

CPC classification number: G03G15/2064 ,  G03G2215/2035

Abstract: A fusing device includes a rotatable pressing roller, a fusing belt to rotate by a rotational force transmitted from the rotatable pressing roller, a nip forming member to contact an inner surface of the fusing belt to form a nip on a contact area between the rotatable pressing roller and the fusing belt, a heating member formed in approximately an internal central portion of the fusing belt to heat the nip forming member and the fusing belt, an inner support member formed within the fusing belt to press a nip part of the nip forming member toward the rotatable pressing roller, and an outer support member formed outside the fusing belt, and both ends of the outer support member being engaged with the inner support member to thereby reinforce the strength of the inner support member and form a path for radiation heat to disperse. The support unit includes an inner support member placed within the belt unit, and an outer support member placed outside the belt unit, both ends of the outer support member being engaged with the inner support member to reinforce the strength of the inner support member and to form a path for a radiation heat to disperse.

Abstract translation: 定影装置包括可旋转的加压辊，通过从可旋转的加压辊传递的旋转力而旋转的定影带，夹持形成构件，其与定影带的内表面接触，以在可旋转的压制 辊和定影带，形成在定影带的大致中心部分的加热构件，以加热夹持形成构件和定影带;形成在定影带内的内部支撑构件，以挤压辊隙形成构件的夹持部分 朝向可旋转的压辊，以及形成在定影带外部的外支撑构件，并且外支撑构件的两端与内支撑构件接合，从而增强内支撑构件的强度，并形成用于辐射热的路径 分散。 支撑单元包括放置在皮带单元内的内支撑构件和设置在皮带单元外部的外支撑构件，外支撑构件的两端与内支撑构件接合以增强内支撑构件的强度， 形成辐射热分散的路径。

公开(公告)号：US20100309597A1

公开(公告)日：2010-12-09

申请号：US12724548

申请日：2010-03-16

Applicant: Pankaj AGARWAL ,  Sung-jin CHOI ,  Tae-hoon KIM

Inventor： Pankaj AGARWAL ,  Sung-jin CHOI ,  Tae-hoon KIM

IPC: H02H3/20 ,  H03K5/153 ,  H02H3/24

CPC classification number: H02H1/0038 ,  H02H3/207 ,  H05B33/089 ,  Y02B20/341

Abstract: An apparatus for preventing abnormal voltage, a light emitting module, and a display apparatus are provided. The present apparatus for preventing abnormal voltage extracts the highest voltage and the lowest voltage among voltage applied from a plurality of loads, includes two voltage distribution units distributing the highest voltage and the lowest voltage, and detects whether the highest voltage and the lowest voltage applied from the voltage distribution unit are within a predetermined range. Accordingly, the apparatus for preventing abnormal voltage is not affected greatly in terms of its size and cost even if the number of loads to be protected increases.

Abstract translation: 提供一种防止异常电压的装置，发光模块和显示装置。 用于防止异常电压的本装置提取从多个负载施加的电压中的最高电压和最低电压，包括分配最高电压和最低电压的两个电压分配单元，并且检测是否施加了最高电压和最低电压 电压分配单元在预定范围内。 因此，即使要保护的负载数量增加，用于防止异常电压的装置在其尺寸和成本方面也不会受到很大的影响。

公开(公告)号：US20100297661A1

公开(公告)日：2010-11-25

申请号：US12672498

申请日：2008-08-06

Applicant: Dong Su Kim ,  Nam Hoon Cho ,  Hyung Jin Na ,  Young Deuk Choi ,  Jae Ho Jang ,  Hye-Kyung Kim ,  Mo Yoel Park ,  Won Man Park ,  Tae-hoon Kim ,  Dong Hee Lee ,  Kyung Mok Park

Inventor： Dong Su Kim ,  Nam Hoon Cho ,  Hyung Jin Na ,  Young Deuk Choi ,  Jae Ho Jang ,  Hye-Kyung Kim ,  Mo Yoel Park ,  Won Man Park ,  Tae-hoon Kim ,  Dong Hee Lee ,  Kyung Mok Park

IPC: G01N33/53

CPC classification number: G01N33/57438 ,  C07K16/3038 ,  C07K16/40 ,  G01N33/5011 ,  G01N33/5017 ,  G01N33/573 ,  G01N2333/91017

Abstract: Disclosed herein are a composition and a kit for diagnosing renal cell carcinoma. The composition and kit employ, as a renal cell carcinoma marker, nicotinamide N-methyltransferase, L-plastin, secretagogin, NM23A, CapG, which is an actin regulatory protein, and/or C4a anaphylatoxin.

Abstract translation: 本文公开了用于诊断肾细胞癌的组合物和试剂盒。 作为肾细胞癌标记物的组合物和试剂盒使用烟酰胺N-甲基转移酶，L-丝胶蛋白，促分泌素，NM23A，CapG，其是肌动蛋白调节蛋白和/或C4a过敏毒素。

公开(公告)号：US07807478B2

公开(公告)日：2010-10-05

申请号：US12690831

申请日：2010-01-20

Applicant: Tae Hoon Kim

Inventor： Tae Hoon Kim

IPC: H01L21/00

CPC classification number: H01L45/04 ,  H01L45/1233 ,  H01L45/124 ,  H01L45/146 ,  H01L45/1616

Abstract: A nonvolatile memory device and its fabrication method of the present invention may ensure a margin of the threshold drive voltage during a design process of the device by forming a resistance layer determining phase of ReRAM along an upper edge of a lower electrode, and improve operating characteristics of the device

Abstract translation: 本发明的非易失性存储器件及其制造方法可以通过沿下电极的上边缘形成ReRAM的电阻层确定相位来确保器件设计过程期间的阈值驱动电压的余量，并且改善操作特性 的设备

公开(公告)号：US20100193940A1

公开(公告)日：2010-08-05

申请号：US12382907

申请日：2009-03-26

Applicant: Tae Hyun Kim ,  Tae Hoon Kim ,  Yun Pyo Kwak ,  Sung Keun Park ,  Jong Yeol Jeon

Inventor： Tae Hyun Kim ,  Tae Hoon Kim ,  Yun Pyo Kwak ,  Sung Keun Park ,  Jong Yeol Jeon

IPC: H01L23/02 ,  H01L21/52

CPC classification number: H01L23/10 ,  H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/00

Abstract: The present invention relates to a wafer level package and a method of manufacturing the same. The wafer level package includes a first substrate including a first region and second regions with grooves around the first region; a semiconductor device positioned in the first region; first sealing members positioned in the grooves; a second substrate including projection units corresponding to the second regions in order to form a cavity corresponding to the first region; and second sealing members which are positioned above the projection units and laminate the first and second substrates to each other by being bonded to the first sealing members, and can prevent the sealing members from flowing to any region except for the sealing regions.

Abstract translation: 本发明涉及一种晶片级封装及其制造方法。 晶片级封装包括包括第一区域的第一基板和围绕第一区域的凹槽的第二区域; 位于所述第一区域中的半导体器件; 位于凹槽中的第一密封构件; 第二基板，包括对应于第二区域的投影单元，以形成对应于第一区域的空腔; 以及第二密封构件，其位于投影单元的上方并且通过结合到第一密封构件将第一和第二基板彼此层合，并且可以防止密封构件流到除了密封区域之外的任何区域。

公开(公告)号：US20100124810A1

公开(公告)日：2010-05-20

申请号：US12690831

申请日：2010-01-20

Applicant: Tae Hoon Kim

Inventor： Tae Hoon Kim

IPC: H01L21/02

CPC classification number: H01L45/04 ,  H01L45/1233 ,  H01L45/124 ,  H01L45/146 ,  H01L45/1616

Abstract: A nonvolatile memory device and its fabrication method of the present invention may ensure a margin of the threshold drive voltage during a design process of the device by forming a resistance layer determining phase of ReRAM along an upper edge of a lower electrode, and improve operating characteristics of the device

Abstract translation: 本发明的非易失性存储器件及其制造方法可以通过沿下电极的上边缘形成ReRAM的电阻层确定相位来确保器件设计过程期间的阈值驱动电压的余量，并且改善操作特性 的设备