公开(公告)号：US20080095715A1

公开(公告)日：2008-04-24

申请号：US11570156

申请日：2005-06-15

Applicant: Alan Cuthbertson ,  Robert James Nairne

Inventor： Alan Cuthbertson ,  Robert James Nairne

IPC: A61K49/00 ,  C07K7/64

CPC classification number: A61K49/0056 ,  A61K49/0032 ,  C07K5/0817 ,  C07K5/126 ,  C07K14/70546 ,  G01N33/533

Abstract: The invention relates to new peptide-based compounds and their use in diagnostic optical imaging techniques. More specifically the invention relates to the use of such peptide-based compounds as targeting vectors that bind to receptors associated with angiogenesis. The compounds are labelled with at least one cyanine dye reporter and may be used as contrast agents in optical imaging in diagnosis of angiogenesis-related diseases.

Abstract translation: 本发明涉及新的基于肽的化合物及其在诊断光学成像技术中的应用。 更具体地，本发明涉及这种基于肽的化合物作为与血管发生相关的受体结合的靶向载体的用途。 该化合物用至少一种花青染料报告物进行标记，并可用作造影剂用于诊断血管发生相关疾病的光学成像。

公开(公告)号：US20080095701A1

公开(公告)日：2008-04-24

申请号：US11575163

申请日：2005-09-14

Applicant: Magne Solbakken ,  Bente Ardo ,  Alan Cuthbertson ,  Alexander Gibson

Inventor： Magne Solbakken ,  Bente Ardo ,  Alan Cuthbertson ,  Alexander Gibson

IPC: A61K51/08 ,  C07K7/04

CPC classification number: A61K51/088

Abstract: The invention relates to conjugates of formula (III) or (IIIa), or a salt thereof, their use as radiopharmaceuticals, processes for their preparation, and synthetic intermediates used in such processes.

Abstract translation: 本发明涉及式（III）或（IIIa）的缀合物或其盐，它们作为放射性药物的用途，其制备方法以及在这些方法中使用的合成中间体。

公开(公告)号：US20070148647A1

公开(公告)日：2007-06-28

申请号：US10560508

申请日：2005-05-11

Applicant: Sajinder Luthra ,  Frank Brady ,  Nicholas Jeffery ,  Erik Arstad ,  Alexander Gibson ,  Duncan Wynn ,  Alan Cuthbertson ,  Magne Solbakken

Inventor： Sajinder Luthra ,  Frank Brady ,  Nicholas Jeffery ,  Erik Arstad ,  Alexander Gibson ,  Duncan Wynn ,  Alan Cuthbertson ,  Magne Solbakken

IPC: C12Q1/68

CPC classification number: C07B59/00 ,  C07B63/00 ,  C07B2200/11

Abstract: The invention relates to novel processes for the purification of radiolabelled tracers, using a solid-support bound scavenger group. The general concept being illustrated by the scheme:

Abstract translation: 本发明涉及使用固体支持结合清除剂组来纯化放射性标记的示踪剂的新方法。 计划说明的一般概念：

公开(公告)号：US20050127530A1

公开(公告)日：2005-06-16

申请号：US10735117

申请日：2003-12-13

Applicant: Zhang Fan ,  Zhang Chao ,  Liu Wuping ,  Chok Liep ,  Hsia Choo ,  Lim Kheng ,  Alan Cuthbertson ,  Tan Boom

Inventor： Zhang Fan ,  Zhang Chao ,  Liu Wuping ,  Chok Liep ,  Hsia Choo ,  Lim Kheng ,  Alan Cuthbertson ,  Tan Boom

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L29/40

CPC classification number: H01L24/06 ,  H01L23/53223 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2224/05552

Abstract: A structure and method for an improved a bond pad structure. We provide a top wiring layer and a top dielectric (IMD) layer over a semiconductor structure. The buffer dielectric layer is formed over the top wiring layer and the top dielectric (IMD) layer. We form a buffer opening in the buffer dielectric layer exposing at least of portion of the top wiring layer. We form a barrier layer over the buffer dielectric layer, and the top wiring layer in the buffer opening. A conductive buffer layer is formed over the barrier layer. We planarize the conductive buffer layer to form a buffer pad in the buffer opening. We form a passivation layer over the buffer pad and the buffer dielectric layer. We form a bond pad opening in the passivation layer over at least a portion of the buffer pad. We form a bond pad support layer over the buffer pad and the buffer dielectric layer. We form a bond pad layer over the a bond pad support layer. The bond pad layer and the bond pad support layer are patterned to form a bond pad and bond pad support.

Abstract translation: 一种改进接合焊盘结构的结构和方法。 我们在半导体结构上提供顶部布线层和顶部电介质（IMD）层。 缓冲电介质层形成在顶部布线层和顶部电介质（IMD）层上。 我们在缓冲介电层中形成缓冲开口，露出至少部分顶部布线层。 我们在缓冲介质层上形成阻挡层，缓冲开口中形成顶部布线层。 导电缓冲层形成在阻挡层上。 我们平面化导电缓冲层以在缓冲开口中形成缓冲垫。 我们在缓冲垫和缓冲电介质层上形成钝化层。 我们在缓冲垫的至少一部分上在钝化层中形成接合焊盘开口。 我们在缓冲垫和缓冲电介质层上形成接合焊盘支撑层。 我们在接合垫支撑层上形成接合垫层。 将接合焊盘层和接合焊盘支撑层图案化以形成接合焊盘和接合焊盘支撑。

公开(公告)号：US20050090095A1

公开(公告)日：2005-04-28

申请号：US10690998

申请日：2003-10-22

Applicant: Yeow Lim ,  Wuping Liu ,  Tae Lee ,  Bei Zhang ,  Juan Tan ,  Alan Cuthbertson ,  Chin Neo

Inventor： Yeow Lim ,  Wuping Liu ,  Tae Lee ,  Bei Zhang ,  Juan Tan ,  Alan Cuthbertson ,  Chin Neo

IPC: H01L21/4763 ,  H01L21/768 ,  H01L29/06

CPC classification number: H01L21/76807 ,  H01L21/76829 ,  H01L21/76834

Abstract: A method of forming an aligned dual damascene opening, comprising including the following sequential steps. A structure having a metal structure formed thereover is provided. A layer stack is formed over the metal structure. The layer stack comprises, in ascending order: a bottom etch stop layer; a lower dielectric material layer; a middle etch stop layer; a middle dielectric material layer; and an upper dielectric layer. The upper dielectric layer is patterned to form an opening exposing a portion of the underlying middle dielectric material layer. The opening having a width. A patterned mask layer is formed over the patterned upper dielectric layer leaving exposed opposing portions of the patterned upper dielectric layer. The middle dielectric material layer is patterned to form an opening therein using the patterned mask layer and the exposed portions of the upper dielectric layer as masks. The middle dielectric material layer opening exposing a portion of the middle etch stop layer. The middle etch stop layer is removed at its exposed portion to form a patterned middle etch stop layer having an opening exposing a portion of the lower dielectric material layer. Simultaneously patterning: the patterned middle dielectric material layer using the patterned upper dielectric layer as a mask to form an inchoate upper trench opening; and the lower dielectric material layer using the patterned mask layer and the patterned middle etch stop layer as masks to form an inchoate lower via opening aligned with the inchoate upper trench opening. The inchoate lower via opening exposing a portion of the underlying bottom etch stop layer. The patterned mask layer is removed. The patterned upper dielectric material layer, the exposed portions of the patterned middle etch stop layer and the exposed portion of the bottom etch stop layer are removed to convert: the inchoate upper trench opening into a final upper trench opening; and the inchoate lower via opening into a final lower via opening to form the dual damascene opening.

公开(公告)号：US06451687B1

公开(公告)日：2002-09-17

申请号：US09721898

申请日：2000-11-24

Applicant: Huang Liu ,  John Sudijono ,  Juan Boon Tan ,  Edwin Goh ,  Alan Cuthbertson ,  Arthur Ang ,  Feng Chen ,  Qiong Li ,  Peter Chew

Inventor： Huang Liu ,  John Sudijono ,  Juan Boon Tan ,  Edwin Goh ,  Alan Cuthbertson ,  Arthur Ang ,  Feng Chen ,  Qiong Li ,  Peter Chew

IPC: H01L214763

CPC classification number: H01L21/76826 ,  H01L21/31612 ,  H01L21/31629 ,  H01L21/76831

Abstract: An intermetal dielectric structure for integrated circuits and a manufacturing method therefore is provided having a premetal dielectric and a metal line thereon, with a SRO liner on the premetal dielectric layer and the metal lines, a FGS dielectric layer over the SRO liner, a SRO film over the FGS dielectric layer, and a TEOS dielectric layer over the SRO film. Vias through the FGS dielectric layer are treated to have fluorine-free regions around the vias. The structure is not subject to fluorine attack on the metal lines or vias while having a stable FGS dielectric layer with less fluorine out-gassing and out-diffusion.

公开(公告)号：US08529874B2

公开(公告)日：2013-09-10

申请号：US12600265

申请日：2008-05-16

Applicant: Edvin Wilhelm Johannesen ,  Alan Cuthbertson

Inventor： Edvin Wilhelm Johannesen ,  Alan Cuthbertson

IPC: A61B10/00 ,  A61B5/00 ,  A61B8/00

CPC classification number: A61K49/0056 ,  A61B5/0071 ,  A61B5/4842 ,  A61K49/0032

Abstract: The present invention relates to labelled cMet binding peptides suitable for optical imaging in vivo. The peptides are labelled with an optical reporter group suitable for imaging in the red to near-infrared region. Also disclosed are pharmaceutical compositions and kits, as well as in vivo imaging methods, especially of use in the detection, staging, diagnosis, monitoring of disease progression or monitoring of treatment of colorectal cancer (CRC).

Abstract translation: 本发明涉及适用于体内光学成像的标记的cMet结合肽。 肽用适于在红色至近红外区域成像的光学报告基团标记。 还公开了药物组合物和试剂盒，以及体内成像方法，特别是用于检测，分期，诊断，监测疾病进展或监测结肠直肠癌（CRC）的治疗。

公开(公告)号：US08404802B2

公开(公告)日：2013-03-26

申请号：US12053829

申请日：2008-03-24

Applicant: Alan Cuthbertson ,  Bard Indrevoll

Inventor： Alan Cuthbertson ,  Bard Indrevoll

IPC: C07K7/64

CPC classification number: A61K51/082 ,  A61K47/60 ,  A61K47/62 ,  A61K47/64 ,  A61K51/088 ,  C07K7/02 ,  C07K7/06 ,  C07K14/78

Abstract: The invention relates to new peptide-based compounds for use as diagnostic imaging agents or as therapeutic agents wherein the agents comprise a targeting vector which binds to receptors associated with integrin receptors.

公开(公告)号：US08221720B2

公开(公告)日：2012-07-17

申请号：US10560508

申请日：2005-05-11

Applicant: Sajinder Kaur Luthra ,  Frank Brady ,  Nicholas Toby Jeffery ,  Erik Arstad ,  Alexander Mark Gibson ,  Duncan Wynn ,  Alan Cuthbertson ,  Magne Solbakken

Inventor： Sajinder Kaur Luthra ,  Frank Brady ,  Nicholas Toby Jeffery ,  Erik Arstad ,  Alexander Mark Gibson ,  Duncan Wynn ,  Alan Cuthbertson ,  Magne Solbakken

IPC: A61K51/00 ,  A61M36/14

CPC classification number: C07B59/00 ,  C07B63/00 ,  C07B2200/11

Abstract: The invention relates to novel processes for the purification of radiolabelled tracers, using a solid-support bound scavenger group. The general concept being illustrated by the scheme:

Abstract translation: 本发明涉及使用固体支持结合清除剂组来纯化放射性标记的示踪剂的新方法。 计划说明的一般概念：

公开(公告)号：US07994134B2

公开(公告)日：2011-08-09

申请号：US12423953

申请日：2009-04-15

Applicant: Alan Cuthbertson ,  Bård Indrevoll ,  Magne Solbakken ,  Torgrim Engell ,  Colin Mill Archer ,  Harry John Wadsworth

Inventor： Alan Cuthbertson ,  Bård Indrevoll ,  Magne Solbakken ,  Torgrim Engell ,  Colin Mill Archer ,  Harry John Wadsworth

IPC: A61K38/00 ,  A61K38/12 ,  C07K14/705

CPC classification number: C07K7/06 ,  A61K38/00 ,  A61K47/60 ,  A61K47/6425 ,  A61K49/0002 ,  A61K51/082 ,  A61K51/088 ,  C07K14/745

Abstract: The invention relates to new peptide-based compounds for use as diagnostic imaging agents or as therapeutic agents wherein the agents comprise targeting vectors which bind to integrin receptors.

Abstract translation: 本发明涉及用作诊断显像剂或作为治疗剂的新的基于肽的化合物，其中所述试剂包含与整联蛋白受体结合的靶向载体。