公开(公告)号：US20250156058A1

公开(公告)日：2025-05-15

申请号：US19024844

申请日：2025-01-16

Applicant: Applied Materials, Inc.

Inventor： Jui-Che Lin ,  Yan-Jhu Chen ,  Chao-Hsien Lee ,  Shauh-Teh Juang ,  Pengyu Han ,  Wallace Wang

IPC: G06F3/04847 ,  G06F3/0481 ,  H01L21/02

Abstract: An electronic device manufacturing system configured to adjust a virtual knob associated with a trained machine learning model. The virtual knob is configured to adjust a representative value of the trained machine learning model to control a performance of the trained machine learning model. Sensor data is provided as input to the trained machine learning model, the sensor data being associated with a substrate manufacturing process performed on a substate. An output value of the modified machine learning model is obtained, the output value being indicative of metrology data.

公开(公告)号：US20250155883A1

公开(公告)日：2025-05-15

申请号：US18939065

申请日：2024-11-06

Applicant: Applied Materials, Inc.

Inventor： Prashanth Kothnur ,  Ala Moradian ,  Umesh Madhav Kelkar ,  Phillip Stout ,  Badri Ramamurthi ,  Karthik Ramanathan ,  Ananth Bhoj ,  Dalong Zhao

IPC: G05B19/418

Abstract: In one aspect of the present disclosure, a method includes obtaining, by a processing device, input data indicative of a first set of process parameters. The method further includes providing the input data to a first process model. The method further includes obtaining, from the first process model, first predictive output indicative of performance of a first process operation in accordance with the first set of process parameters. The method further includes providing the first predictive output to a second process model. The method further includes obtaining, from the second process model, second predictive output indicative of performance of a second process operation, different than the first process operation or a repetition of the first process operation, in accordance with the first set of process parameters. The method further includes performing a corrective action in view of the second predictive output.

公开(公告)号：US20250155797A1

公开(公告)日：2025-05-15

申请号：US18715317

申请日：2021-12-16

Applicant: Applied Materials, Inc.

Inventor： Chi-Ming TSAI ,  Thomas L. LAIDIG

IPC: G03F7/00 ,  G03F7/16

Abstract: Embodiments described herein provide for a system, a software application, and a method of a lithography process to form a three-dimensional profile in a single exposure operation. An image projections system of a lithography system will provide a plurality of shots to a photoresist layer. To form a three-dimensional profile in the photoresist layer, a local shot density of a plurality of shots within an exposure area will be varied. The local shot density will determine a dose provided by the image projection system at each sub-grid of an exposure area. The dose will determine the thickness of a photoresist layer when the plurality of shots are projected to the photoresist layer.

公开(公告)号：US12302641B2

公开(公告)日：2025-05-13

申请号：US17636998

申请日：2019-09-23

Applicant: Applied Materials, Inc.

Inventor： Chung-Shin Kang ,  Thomas L. Laidig ,  Yinfeng Dong ,  Yao-Cheng Yang ,  Chen-Chien Hung ,  Shivaraj Gururaj Kamalapura ,  Tsaichuan Kao

IPC: G06F30/398 ,  G03F7/00 ,  H10D89/10

Abstract: A digital pattern generation system comprises a memory and a controller. The controller is coupled the memory and is configured to remove redundant cells from a digital pattern file, generate a first updated digital pattern file and compare the first updated digital pattern file with the digital pattern file. Further a number of vertexes of a first arc of the first updated digital pattern file is reduced to generate a second updated digital pattern file. Additionally, a first cell of the second updated digital pattern file is replaced with an alternative version of the first cell to generate a third updated digital pattern file. Further, one or more polygons within the third updated digital pattern file is converted to one or more quad polygons to generate an optimized digital pattern file.

公开(公告)号：US12297946B2

公开(公告)日：2025-05-13

申请号：US18181959

申请日：2023-03-10

Applicant: Applied Materials, Inc.

Inventor： Daemian Raj Benjamin Raj ,  Kiran Garikipati ,  Kurt R. Langeland ,  Syed A. Alam

IPC: F16L41/03 ,  B01F25/43 ,  B01F101/58 ,  G05D11/13

Abstract: Exemplary modular gas blocks may include a body having inlet and outlet ends. The body may define a portion of a first gas path along a length of the body and may define a second gas path along a width of the body. The first gas path may include channel segments defined within the body. The inlet end may define a gas inlet that is coupled with the first gas path. The body may define first fluid ports that are coupled with the first gas path. A fluid port of the first fluid ports may be coupled with the gas inlet. The first fluid ports may be coupled with one another via a respective channel segment. An upper surface may define a lateral fluid port that is spaced apart from a first fluid port along the width and is coupled with the first fluid port via the second gas path.

公开(公告)号：US20250151219A1

公开(公告)日：2025-05-08

申请号：US18836794

申请日：2023-03-24

Applicant: Applied Materials, Inc.

Inventor： Helinda NOMINANDA ,  Tae Kyung WON ,  Han NGUYEN ,  Seong Ho YOO ,  Soo Young CHOI ,  Sung Hwan YOON ,  Yoon Duck HAN ,  Chang Woo LEE ,  Kyung Whan PARK ,  Shi Youl SHIN

IPC: H05K5/03 ,  G02B1/14 ,  G02B1/18

Abstract: Embodiments of the present disclosure relate to flexible display devices, including dual-sided wet hardcoats for flexible cover lens structures, and related methods and coating systems. The flexible cover lens film has beneficial strength, elasticity. optical transmission, and anti-abrasion properties. In one or more embodiments. a cover lens structure for display devices includes a substrate layer including a first side and a second side. The cover lens structure includes a first wet hardcoat layer deposited on the first side of the substrate layer, and a second wet hardcoat layer deposited on the second side of the substrate layer. The cover lens structure includes one or more adhesion promotion layers formed above the second side. and a dry hardcoat layer formed above the second side.

公开(公告)号：US20250149305A1

公开(公告)日：2025-05-08

申请号：US18386721

申请日：2023-11-03

Applicant: Applied Materials, Inc.

Inventor： Tianshu LI ,  Yikai CHEN ,  Aniruddha PAL ,  Yao-Hung YANG ,  Saurabh M. CHAUDHARI

IPC: H01J37/32 ,  C23C16/32

Abstract: A method for forming a part for a process chamber incorporates a substrate core in the part. The method may include performing a silicon carbide (SIC) deposition process on a substrate to form a SiC coating of approximately 1 mm to approximately 2 mm on all sides of the substrate to form a composite SiC structure where the substrate is composed of a stack of a plurality of substrates each with a thickness of approximately 1 mm to approximately 2 mm and separating the stack of the plurality of substrates of the composite SiC structure to form multiple composite structures where each multiple composite structure has an SiC coating on a top surface and on all side surfaces and a bottom surface of exposed substrate material.

公开(公告)号：US20250146134A1

公开(公告)日：2025-05-08

申请号：US18500690

申请日：2023-11-02

Applicant: Applied Materials, Inc.

Inventor： Zuoming ZHU ,  Shu-Kwan LAU ,  Errol Antonio C. SANCHEZ ,  Abhishek DUBE ,  Ala MORADIAN

IPC: C23C16/52 ,  C23C16/455 ,  H01L21/67

Abstract: Embodiments of the present disclosure relate to multi-flow gas circuits, processing chambers, and related apparatus and methods applicable for semiconductor manufacturing. In one or more embodiments, a processing chamber includes a chamber body, one or more heat sources, and a gas circuit in fluid communication with the chamber body. The gas circuit includes a first flow controller and a first set of valves in fluid communication with the first flow controller. The first set of valves are in fluid communication with a first set of inject passages. The gas circuit includes a second flow controller and a second set of valves in fluid communication with the second flow controller. The second set of valves is in fluid communication with a second set of inject passages. The second set of inject passages and the first set of inject passages alternate with respect to each other along the plurality of flow levels.

公开(公告)号：US20250145431A1

公开(公告)日：2025-05-08

申请号：US19013922

申请日：2025-01-08

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Srinivasa Rao YEDLA

IPC: B66F3/36 ,  B66F3/24 ,  B66F13/00 ,  H01J37/02

Abstract: A method and apparatus for lifting a process station from a processing module is described herein. The apparatus includes a lift assembly disposed on the processing module, a lift cage, and one or more guide pins. The lift assembly is disposed to be capable of reaching each of the process stations disposed within the processing module. The lift assembly is used for replacement and maintenance of the process stations and further enables the automated removal and placement of the process stations within the processing module. Maintenance methods enabled by the lift assembly are additionally disclosed herein.

公开(公告)号：US12295215B2

公开(公告)日：2025-05-06

申请号：US18545676

申请日：2023-12-19

Applicant: Applied Materials, Inc.

Inventor： Ji-young Choung ,  Dieter Haas ,  Yu Hsin Lin ,  Jungmin Lee ,  Seong Ho Yoo ,  Si Kyoung Kim

IPC: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K59/12 ,  H10K59/173 ,  H10K59/80 ,  H10K71/00

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.