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    Method and system for inspecting a pattern
    11.
    发明授权
    Method and system for inspecting a pattern 失效
    检查图案的方法和系统

    公开(公告)号：US07260256B2

    公开(公告)日：2007-08-21

    申请号：US09571938

    申请日：2000-05-16

    申请人： Takashi Hiroi ,  Maki Tanaka ,  Masahiro Watanabe ,  Asahiro Kuni ,  Hiroyuki Shinada ,  Mari Nozoe ,  Aritoshi Sugimoto ,  Chie Shishido

    发明人： Takashi Hiroi ,  Maki Tanaka ,  Masahiro Watanabe ,  Asahiro Kuni ,  Hiroyuki Shinada ,  Mari Nozoe ,  Aritoshi Sugimoto ,  Chie Shishido

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G06T2207/10056 ,  G06T2207/30148

    摘要： The present invention relates to detection of defects with simple specification of the coordinates, in the inspection of an object having a plurality of patterns in which a portion having the two-dimensional repetition and portions having the repetition only in the X direction and in the Y direction are mixedly present. The cross comparison between a notice point and comparison points, for example which are repetitive pitches away from the notice point, is carried out, and only the portion having the difference which can be found out with any of the comparison points is extracted as a defect candidate, which results in that the portion having the two-dimensional repetition as well as the portion having the repetition only in the X direction or in the Y direction can be inspected. As a result, while the portion, such as an isolated point, having no repetition both in the X direction and in the Y direction is extracted as the defect candidate, the defect candidate is not treated as the defect in the case where the defect candidate of interest occurs regularly in a plurality of objects to be inspected, so that such a defect candidate is excluded to extract only a true defect.

    摘要翻译： 本发明涉及通过简单的坐标指定来检测缺陷，在检查具有多个图案的物体时，其中具有二维重复的部分和仅在X方向上重复的部分和Y 方向混合存在。 执行通知点和比较点之间的交叉比较，例如，距离通知点的重复间距是比较点，并且只有具有任何比较点可以找出的具有差异的部分被提取为缺陷 候选，这导致可以检查具有二维重复的部分以及仅在X方向或Y方向上具有重复的部分。 结果，虽然提取了在X方向和Y方向上都没有重复的诸如孤立点的部分作为缺陷候选，但是在缺陷候选者的情况下，缺陷候选不被视为缺陷 感兴趣的事件定期发生在要检查的多个对象中，因此排除这样的缺陷候选者仅提取真实的缺陷。

    Photomask for test wafers
    15.
    发明授权
    Photomask for test wafers 失效
    用于测试晶片的光掩模

    公开(公告)号：US06841405B2

    公开(公告)日：2005-01-11

    申请号：US10269268

    申请日：2002-10-10

    申请人： Yuichi Hamamura ,  Takaaki Kumazawa ,  Hisao Asakura ,  Aritoshi Sugimoto ,  Kazuyuki Tsunokuni

    发明人： Yuichi Hamamura ,  Takaaki Kumazawa ,  Hisao Asakura ,  Aritoshi Sugimoto ,  Kazuyuki Tsunokuni

    IPC分类号： G01R31/28 ,  H01L21/00

    CPC分类号： G01R31/2812 ,  G01R31/2818

    摘要： A manufacturing method of an electronic device is to improve test efficiency using test structure and improve yield. The manufacturing method performs test using a first lead wire disposed on an insulating layer formed on a substrate and a second lead wire electrically connected to the substrate and disposed on the insulating layer and manages the electronic device on the basis of results of the test to manufacture the electronic device. The manufacturing method includes a step of testing whether the first lead wire is disconnected or not by measuring an electric resistance between both ends of the first lead wire and a step of testing whether the first and second lead wires are short-circuited or not by measuring an electric resistance between the first lead wire and the substrate.

    摘要翻译： 电子设备的制造方法是使用测试结构提高测试效率并提高产量。 该制造方法使用设置在形成于基板上的绝缘层上的第一引线和与基板电连接并设置在绝缘层上的第二引线进行测试，并基于制造试验的结果来管理电子设备 电子设备。 该制造方法包括通过测量第一引线的两端之间的电阻和通过测量第一和第二引线是否短路的步骤来测试第一引线是否断开的步骤 第一引线与基板之间的电阻。

    Method of inspecting circuit pattern and inspecting instrument
    16.
    发明授权
    Method of inspecting circuit pattern and inspecting instrument 失效
    电路图案检查方法

    公开(公告)号：US06703850B2

    公开(公告)日：2004-03-09

    申请号：US10430188

    申请日：2003-05-07

    申请人： Mari Nozoe ,  Hiroyuki Shinada ,  Kenji Watanabe ,  Keiichi Saiki ,  Aritoshi Sugimoto ,  Hiroshi Morioka ,  Maki Tanaka ,  Hiroshi Miyai

    发明人： Mari Nozoe ,  Hiroyuki Shinada ,  Kenji Watanabe ,  Keiichi Saiki ,  Aritoshi Sugimoto ,  Hiroshi Morioka ,  Maki Tanaka ,  Hiroshi Miyai

    IPC分类号： G01R31305

    CPC分类号： H01J37/28 ,  G01R31/307 ,  G09G3/006 ,  H01J37/265 ,  H01J2237/221 ,  H01J2237/2817 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In order to obtain optimum irradiation conditions of an electron beam according to the material and structure of a circuit pattern to be inspected and the kind of a failure to be detected and inspect under the optimum conditions without delay of the inspection time, an inspection device for irradiating the electron beam 19 to the sample board 9 which is a sample, detecting generated secondary electrons by the detector 7, storing obtained signals sequentially in the storage, comparing the same pattern stored in the storage by the comparison calculation unit, and extracting a failure by comparing the predetermined threshold value with the comparison signal by the failure decision unit is provided, wherein the optimum value of the irradiation energy is stored in the data base inside the device beforehand according to the structure of a sample and a recommended value of the irradiation energy suited to inspection can be searched for by inputting or selecting the irradiation energy by a user or inputting information regarding the structure of an article to be inspected.

    摘要翻译： 为了根据要检查的电路图案的材料和结构获得电子束的最佳照射条件以及在最佳条件下无故障检测的种类和检查时间的延迟，检查装置 将电子束19照射到作为样本的样品板9，由检测器7检测产生的二次电子，将获得的信号顺序地存储在存储器中，比较由比较计算单元存储在存储器中的相同模式，并提取故障 提供了通过故障判定单元将预定阈值与比较信号进行比较，其中根据样本的结构和照射的推荐值，将照射能量的最佳值预先存储在设备内部的数据库中 可以通过使用照射能量的输入或选择来搜索适合于检查的能量 或输入关于被检查物品的结构的信息。