Thin film transistor substrate, display device having the same and method of manufacturing the display device
    12.
    发明授权
    Thin film transistor substrate, display device having the same and method of manufacturing the display device 有权
    薄膜晶体管基板,具有相同的显示装置和制造显示装置的方法

    公开(公告)号:US08409916B2

    公开(公告)日:2013-04-02

    申请号:US13233399

    申请日:2011-09-15

    CPC classification number: H01L29/7869 H01L27/1225

    Abstract: A thin film transistor substrate includes an insulating plate; a gate electrode disposed on the insulating plate; a semiconductor layer comprising a metal oxide, wherein the metal oxide has oxygen defects of less than or equal to 3%, and wherein the metal oxide comprises about 0.01 mole/cm3 to about 0.3 mole/cm3 of a 3d transition metal; a gate insulating layer disposed between the gate electrode and the semiconductor layer; and a source electrode and a drain electrode disposed on the semiconductor layer. Also described is a display substrate. The metal oxide has oxygen defects of less than or equal to 3%, and is doped with about 0.01 mole/cm3 to about 0.3 mole/cm3 of 3d transition metal. The metal oxide comprises indium oxide or titanium oxide. The 3d transition metal includes at least one 3d transition metal selected from the group consisting of chromium, cobalt, nickel, iron, manganese, and mixtures thereof.

    Abstract translation: 薄膜晶体管基板包括绝缘板; 设置在绝缘板上的栅电极; 包含金属氧化物的半导体层,其中所述金属氧化物具有小于或等于3%的氧缺陷,并且其中所述金属氧化物包含约0.01mol / cm 3至约0.3mol / cm 3的3d过渡金属; 设置在所述栅极电极和所述半导体层之间的栅极绝缘层; 以及设置在半导体层上的源电极和漏电极。 还描述了显示基板。 金属氧化物具有小于或等于3%的氧缺陷,并且掺杂有约0.01摩尔/ cm3至约0.3摩尔/ cm3的3d过渡金属。 金属氧化物包括氧化铟或二氧化钛。 3d过渡金属包括选自铬,钴,镍,铁,锰及其混合物中的至少一种3d过渡金属。

    METHOD OF MANUFACTURING PHOTOELECTRIC DEVICE
    14.
    发明申请
    METHOD OF MANUFACTURING PHOTOELECTRIC DEVICE 失效
    制造光电器件的方法

    公开(公告)号:US20090233399A1

    公开(公告)日:2009-09-17

    申请号:US12400674

    申请日:2009-03-09

    Abstract: In a method of manufacturing a photoelectric device, a transparent conductive layer is formed on a substrate, and the transparent conductive layer is partially etched using an etching solution including hydrofluoric acid. Thus, a transparent electrode having a concavo-convex pattern on its surface is formed. When the transparent conductive layer is partially etched, a haze of the transparent electrode may be controlled by adjusting an etching time of the transparent conductive layer. Also, since the etching solution is sprayed to the transparent conductive layer to etch the transparent conductive layer, the concavo-convex pattern on the surface of the transparent electrode may be easily formed even though the size of the substrate increases.

    Abstract translation: 在制造光电器件的方法中,在衬底上形成透明导电层,并且使用包括氢氟酸的蚀刻溶液部分蚀刻透明导电层。 因此,形成在其表面具有凹凸图案的透明电极。 当透明导电层被部分蚀刻时,可以通过调节透明导电层的蚀刻时间来控制透明电极的雾度。 此外,由于将蚀刻溶液喷射到透明导电层以蚀刻透明导电层,所以即使基板的尺寸增加,也可以容易地形成透明电极表面上的凹凸图案。

    THIN FILM TRANSITOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    15.
    发明申请
    THIN FILM TRANSITOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    薄膜传输器基板及其制造方法

    公开(公告)号:US20080258143A1

    公开(公告)日:2008-10-23

    申请号:US12100436

    申请日:2008-04-10

    CPC classification number: H01L29/78618 H01L29/458 H01L29/66765 H01L29/7869

    Abstract: A method of manufacturing a thin film transistor (“TFT”) substrate includes forming a first conductive pattern group including a gate electrode on a substrate, forming a gate insulating layer on the first conductive pattern group, forming a semiconductor layer and an ohmic contact layer on the gate insulating layer by patterning an amorphous silicon layer and an oxide semiconductor layer, forming a second conductive pattern group including a source electrode and a drain electrode on the ohmic contact layer by patterning a data metal layer, forming a protection layer including a contact hole on the second conductive pattern group, and forming a pixel electrode on the contact hole of the protection layer. The TFT substrate including the ohmic contact layer formed of an oxide semiconductor is further provided.

    Abstract translation: 制造薄膜晶体管(“TFT”)基板的方法包括在基板上形成包括栅电极的第一导电图案组,在第一导电图案组上形成栅极绝缘层,形成半导体层和欧姆接触层 通过图案化非晶硅层和氧化物半导体层,在栅极绝缘层上,通过图案化数据金属层,在欧姆接触层上形成包括源电极和漏电极的第二导电图案组,形成包括接触的保护层 并且在保护层的接触孔上形成像素电极。 还提供了包括由氧化物半导体形成的欧姆接触层的TFT基板。

    Thin film transistor array panel and method for manufacturing the same
    16.
    发明申请
    Thin film transistor array panel and method for manufacturing the same 审中-公开
    薄膜晶体管阵列面板及其制造方法

    公开(公告)号:US20060118793A1

    公开(公告)日:2006-06-08

    申请号:US11262163

    申请日:2005-10-27

    CPC classification number: H01L29/458 H01L27/124 H01L27/1288 H01L29/4908

    Abstract: A TFT array panel including a substrate, a gate line having a gate electrode, a gate insulating layer formed on the gate line, a data line having a source electrode and a drain electrode spaced apart from the source electrode, a passivation layer formed on the data line and the drain electrode, and a pixel electrode connected to the drain electrode is provided. The TFT array panel further includes a protection layer including Si under at least one of the gate insulating layer and the passivation layer to enhance reliability.

    Abstract translation: 一种TFT阵列面板,包括基板,具有栅极电极的栅极线,栅极线上形成的栅极绝缘层,具有与源极间隔开的源极和漏电极的数据线,形成在栅电极上的钝化层 数据线和漏电极,以及连接到漏电极的像素电极。 TFT阵列板还包括在栅极绝缘层和钝化层中的至少一个之下包括Si的保护层,以增强可靠性。

    THIN FILM TRANSISTOR SUBSTRATE, DISPLAY DEVICE HAVING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY DEVICE
    19.
    发明申请
    THIN FILM TRANSISTOR SUBSTRATE, DISPLAY DEVICE HAVING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY DEVICE 有权
    薄膜晶体管基板,具有该基板的显示装置和制造显示装置的方法

    公开(公告)号:US20120003769A1

    公开(公告)日:2012-01-05

    申请号:US13233399

    申请日:2011-09-15

    CPC classification number: H01L29/7869 H01L27/1225

    Abstract: A thin film transistor substrate includes an insulating plate; a gate electrode disposed on the insulating plate; a semiconductor layer comprising a metal oxide, wherein the metal oxide has oxygen defects of less than or equal to 3%, and wherein the metal oxide comprises about 0.01 mole/cm3 to about 0.3 mole/cm3 of a 3d transition metal; a gate insulating layer disposed between the gate electrode and the semiconductor layer; and a source electrode and a drain electrode disposed on the semiconductor layer. Also described is a display substrate. The metal oxide has oxygen defects of less than or equal to 3%, and is doped with about 0.01 mole/cm3 to about 0.3 mole/cm3 of 3d transition metal. The metal oxide comprises indium oxide or titanium oxide. The 3d transition metal includes at least one 3d transition metal selected from the group consisting of chromium, cobalt, nickel, iron, manganese, and mixtures thereof.

    Abstract translation: 薄膜晶体管基板包括绝缘板; 设置在绝缘板上的栅电极; 包含金属氧化物的半导体层,其中所述金属氧化物具有小于或等于3%的氧缺陷,并且其中所述金属氧化物包含约0.01mol / cm 3至约0.3mol / cm 3的3d过渡金属; 设置在所述栅极电极和所述半导体层之间的栅极绝缘层; 以及设置在半导体层上的源电极和漏电极。 还描述了显示基板。 金属氧化物具有小于或等于3%的氧缺陷,并且掺杂有约0.01摩尔/ cm3至约0.3摩尔/ cm3的3d过渡金属。 金属氧化物包括氧化铟或二氧化钛。 3d过渡金属包括选自铬,钴,镍,铁,锰及其混合物中的至少一种3d过渡金属。

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