Abrasive articles comprising a fluorochemical agent for wafer surface
modification
    11.
    发明授权
    Abrasive articles comprising a fluorochemical agent for wafer surface modification 失效
    包含用于晶片表面改性的含氟化合物的磨料制品

    公开(公告)号:US6121143A

    公开(公告)日:2000-09-19

    申请号:US933870

    申请日:1997-09-19

    摘要: This invention relates to fixed abrasive articles and abrasive constructions containing at least one fluorochemical agent. The fixed abrasive articles and abrasive constructions are used in semiconductor wafer surface modification processes during the fabrication of semiconductor devices. Specifically, fixed abrasive articles comprise an abrasive composite that is coextensive with a backing and at least one fluorochemical agent associated with the composite. The invention further relates to methods of making fixed abrasive articles comprising at least one fluorochemical agent.

    摘要翻译: 本发明涉及含有至少一种含氟化合物的固定磨料制品和研磨结构。 在制造半导体器件期间,将固定的磨料制品和研磨结构用于半导体晶片表面改性工艺中。 具体地,固定的磨料制品包括与背衬共同延伸的磨料复合材料和与复合材料相关联的至少一种含氟化合物。 本发明还涉及制备包含至少一种含氟化合物的固定磨料制品的方法。

    Polymers having silicon-containing acetal or ketal functional groups
    14.
    发明授权
    Polymers having silicon-containing acetal or ketal functional groups 有权
    具有含硅缩醛或缩酮官能团的聚合物

    公开(公告)号:US06479219B2

    公开(公告)日:2002-11-12

    申请号:US10035900

    申请日:2001-12-26

    IPC分类号: G03F7039

    摘要: The polymers of the present invention are characterized by having at least one pendent acetal or ketal functional group in which at least two substituents of the acetal/ketal carbon atom independently comprise at least one silicon atom. The compositions of the present invention are useful as positive working resist compositions, in particular as the top imaging layer in a bilayer resist scheme for use in the manufacture of integrated circuits.

    摘要翻译: 本发明的聚合物的特征在于具有至少一个侧链缩醛或缩酮官能团,其中缩醛/缩酮碳原子的至少两个取代基独立地包含至少一个硅原子。 本发明的组合物可用作正性抗蚀剂组合物,特别是用于制造集成电路的双层抗蚀剂方案中的顶部成像层。

    LAMINATE BODY, AND METHOD FOR MANUFACTURING THIN SUBSTRATE USING THE LAMINATE BODY
    19.
    发明申请
    LAMINATE BODY, AND METHOD FOR MANUFACTURING THIN SUBSTRATE USING THE LAMINATE BODY 审中-公开
    层合体,以及使用层压体制造薄基材的方法

    公开(公告)号:US20080014532A1

    公开(公告)日:2008-01-17

    申请号:US11457567

    申请日:2006-07-14

    IPC分类号: G03C5/00

    摘要: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

    摘要翻译: 提供了一种层叠体,其包括待研磨的基底和支撑体,其中基底可被研磨成非常小(薄)的厚度,然后可以与支撑体分离而不损坏基底。 一个实施方案是一种层压体,其包括待研磨的基材,与待研磨基材接触的可固化的硅氧烷粘合剂层,包含光吸收剂和可热分解树脂的光热转换层和透光载体。 在与粘合剂层接触的基板表面研磨后,通过透光层照射层叠体,分解光热转换层,分离基板和透光支撑体。