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公开(公告)号：USD571738S1
公开(公告)日：2008-06-24
申请号：US29281100
申请日：2007-06-14
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公开(公告)号：US07316488B2
公开(公告)日：2008-01-08
申请号：US11053091
申请日：2005-02-07
CPC分类号： H01L33/60 , F21S41/141 , F21Y2115/10 , H01L33/58
摘要： A beam shutter is disclosed that is affixed to an LED die submount or circuit board to sharply define the emitted pattern. The beam shutter may be a solid piece of aluminum or any other opaque material to block a portion of the light emitted from the LED die. The beam shutter is particularly advantageous for shaping the LED light for car headlamps.
摘要翻译： 公开了一种光束快门，其被固定到LED管芯基座或电路板上以锐利地限定所发射的图案。 光束快门可以是实心的铝片或任何其他不透明材料，以阻挡从LED管芯发射的光的一部分。 光束快门对于汽车前照灯的LED灯的成形特别有利。
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13.发明申请COMMON OPTICAL ELEMENT FOR AN ARRAY OF PHOSPHOR CONVERTED LIGHT EMITTING DEVICES 有权磷光转换发光装置阵列的通用光学元件公开(公告)号：US20120043564A1
公开(公告)日：2012-02-23
申请号：US13288291
申请日：2011-11-03
申请人： MICHAEL D. CAMRAS , WILLIAM R. IMLER , FRANKLIN J. WALL, JR. , FRANK M. STERANKA , MICHAEL R. KRAMES , HELENA TICHA , LADISLAV TICHY , Robertus G. Alferink
发明人： MICHAEL D. CAMRAS , WILLIAM R. IMLER , FRANKLIN J. WALL, JR. , FRANK M. STERANKA , MICHAEL R. KRAMES , HELENA TICHA , LADISLAV TICHY , Robertus G. Alferink
IPC分类号： H01L33/08
CPC分类号： H05B33/0857 , H01L25/0753 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.
摘要翻译： 设备具有至少一个发光器件（LED）裸片，该发光器件（LED）裸片安装在具有随后热粘合到LED管芯上的光学元件的基座上。 LED管芯通过接触凸块电连接到副安装座，接触凸块具有比用于将光学元件热粘合到LED管芯的温度高的熔点。 在一个实现中，单个光学元件被结合到安装到基座上的多个LED芯片，并且基座和光学元件具有大致相同的热膨胀系数。 或者，可以使用多个光学元件。 光学元件或LED管芯可以用波长转换材料的涂层覆盖。 在一个实施方案中，测试该器件以确定产生的波长，并且添加波长转换材料的附加层，直到产生所需的波长。
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公开(公告)号：US20100198009A1
公开(公告)日：2010-08-05
申请号：US12759169
申请日：2010-04-13
申请人： Mina Farr , Franklin J. Wall, JR. , Chris Togami , Gary D. Sasser
发明人： Mina Farr , Franklin J. Wall, JR. , Chris Togami , Gary D. Sasser
IPC分类号： A61B1/04
CPC分类号： A61B1/00103 , A61B1/00177 , A61B1/05 , A61B1/0615 , A61B1/0638 , A61B1/0676 , A61B1/0684 , A61B17/00234 , A61B17/3421 , A61B17/3439 , A61B90/37 , A61B90/53 , A61B2017/0023 , A61B2017/00296 , A61B2017/3484 , A61B2090/0813 , A61B2090/309 , A61B2090/373
摘要： Various embodiments for providing removable, pluggable and disposable opto-electronic modules for illumination and imaging for endoscopy or borescopy are provided for use with portable display devices. Generally, various medical or industrial devices can include one or more solid state or other compact electro-optic illuminating elements located thereon. Additionally, such opto-electronic modules may include illuminating optics, imaging optics, and/or image capture devices. The illuminating elements may have different wavelengths and can be time-synchronized with an image sensor to illuminate an object for imaging or detecting purpose or other conditioning purpose. The removable opto-electronic modules may be plugged onto the exterior surface of another medical device, deployably coupled to the distal end of the device, or otherwise disposed on the device.
摘要翻译： 提供了用于提供用于内窥镜检查或孔镜的照明和成像的可移除，可插拔和一次性光电模块的各种实施例，用于便携式显示装置。 通常，各种医疗或工业设备可以包括位于其上的一个或多个固态或其他紧凑的电光照明元件。 此外，这样的光电模块可以包括照明光学器件，成像光学器件和/或图像捕获器件。 照明元件可以具有不同的波长，并且可以与图像传感器时间同步以照亮物体以进行成像或检测目的或其他调节目的。 可拆卸的光电模块可以被插入到另一医疗装置的外表面上，可展开地联接到装置的远端，或者以其他方式设置在装置上。
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公开(公告)号：US07144135B2
公开(公告)日：2006-12-05
申请号：US10723711
申请日：2003-11-26
IPC分类号： F21V29/00
CPC分类号： F21V29/74 , F21K9/233 , F21S6/003 , F21S8/026 , F21V7/0091 , F21V17/101 , F21V17/164 , F21V29/004 , F21V29/505 , F21V29/67 , F21V29/673 , F21V29/75 , F21V29/77 , F21V29/773 , F21V29/83 , F21Y2115/10
摘要： An LED lamp includes an exterior shell that has the same form factor as a conventional incandescent light bulb, such as a PAR type bulb. The LED lamp includes an optical reflector that is disposed within the shell and that directs the light emitted from one or more LEDs. The optical reflector and shell define a space that is used to channel air to cool the device. The LED is mounted on a heat sink that is disposed within the shell. A fan moves air over the heat sink and through the spaced defined by the optical reflector and the shell. The shell includes one or more apertures that serve as air inlet or exhaust apertures. One or more apertures defined by the optical reflector and shell at the opening of the shell can also be used as air exhaust or inlet apertures.
摘要翻译： LED灯包括具有与常规白炽灯泡（例如PAR型灯泡）相同形状因数的外壳。 LED灯包括设置在外壳内并引导从一个或多个LED发出的光的光学反射器。 光学反射器和壳体限定了用于引导空气冷却设备的空间。 LED安装在设置在外壳内的散热器上。 风扇将空气移动到散热器上方并通过光学反射器和外壳限定的间隔。 壳体包括用作空气入口或排气孔的一个或多个孔。 由光学反射器和壳体在壳体的开口处限定的一个或多个孔也可以用作排气孔或入口孔。
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公开(公告)号：US08231251B2
公开(公告)日：2012-07-31
申请号：US11262192
申请日：2005-10-28
IPC分类号： F21V7/00
CPC分类号： F21V7/0025 , F21K9/68 , F21V17/005 , F21Y2115/10 , H01L33/60 , Y10S362/80
摘要： Collection optics are used with one or more light emitting diodes to produce, e.g., collimated light. The collection optics are produced in multiple pieces including a small reflective ring that surrounds the one or more light emitting diodes. The reflective ring may be positioned relative to the LEDs, using a mesa upon which the LEDs are mounted, as a lateral positioning guide. A separate upper reflector uses the reflective ring as a lateral positioning guide during assembly. The reflective ring and the upper reflector include reflective sidewalls that are approximately continuous when the reflective ring and upper reflector are assembled.
摘要翻译： 收集光学器件与一个或多个发光二极管一起使用以产生例如准直光。 收集光学器件以多个片段制造，包括围绕一个或多个发光二极管的小反射环。 反射环可以相对于LED定位，使用其上安装有LED的台面作为横向定位引导件。 单独的上反射器在组装期间使用反射环作为横向定位导向器。 反射环和上反射器包括当反射环和上反射器组装时大致连续的反射侧壁。
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公开(公告)号：US07952112B2
公开(公告)日：2011-05-31
申请号：US11118898
申请日：2005-04-29
IPC分类号： H01L23/12
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： A submount for red, green, and blue LEDs is described where the submount has thermally isolated trenches and/or holes in the submount so that the high heat generated by the green/blue AlInGaN LEDs is not conducted to the red AlInGaP LEDs. The submount contains conductors to interconnect the LEDs in a variety of configurations. In one embodiment, the AlInGaP LEDs are recessed in the submount so all LEDs have the same light exit plane. The submount may be used for LEDs generating other colors, such as yellow, amber, orange, and cyan.
摘要翻译： 描述了用于红色，绿色和蓝色LED的基座，其中子安装座在底座中具有热隔离的沟槽和/或孔，使得由绿色/蓝色AlInGaN LED产生的高热不传导到红色AlInGaP LED。 底座包含用于以各种配置互连LED的导体。 在一个实施例中，AlInGaP LED凹陷在底座中，因此所有LED具有相同的光出射平面。 底座可用于产生其他颜色的LED，例如黄色，琥珀色，橙色和青色。
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公开(公告)号：US07759144B2
公开(公告)日：2010-07-20
申请号：US12359166
申请日：2009-01-23
IPC分类号： H01L21/00 , H01L21/50 , H01L21/48 , H01L21/44 , H01L29/22 , H01L27/15 , H01L29/267 , H01L23/52
CPC分类号： H01L33/64 , C04B2237/407 , H01L33/08 , H01L33/38 , H01L33/647 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H05K1/0306 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor light emitting device package includes a substrate with a core and a copper layer overlying the core. The light emitting device is connected to the substrate directly or indirectly through a wiring substrate. The core of the substrate may be, for example, ceramic, Al2O3, AlN, alumina, silicon nitride, or a printed circuit board. The copper layer may be bonded to the core by a process such as direct bonding of copper or active metal brazing.
摘要翻译： 半导体发光器件封装包括具有芯的衬底和覆盖在芯上的铜层。 发光装置通过布线基板直接或间接地连接到基板。 衬底的芯可以是例如陶瓷，Al 2 O 3，AlN，氧化铝，氮化硅或印刷电路板。 可以通过诸如铜或活性金属钎焊的直接结合的方法将铜层结合到芯上。
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