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    LED lamp heat sink
    1.
    发明授权
    LED lamp heat sink 有权
    LED灯泡散热器

    公开(公告)号：US07144135B2

    公开(公告)日：2006-12-05

    申请号：US10723711

    申请日：2003-11-26

    申请人： Paul S. Martin ,  Franklin J. Wall, Jr.

    发明人： Paul S. Martin ,  Franklin J. Wall, Jr.

    IPC分类号： F21V29/00

    CPC分类号： F21V29/74 ,  F21K9/233 ,  F21S6/003 ,  F21S8/026 ,  F21V7/0091 ,  F21V17/101 ,  F21V17/164 ,  F21V29/004 ,  F21V29/505 ,  F21V29/67 ,  F21V29/673 ,  F21V29/75 ,  F21V29/77 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10

    摘要： An LED lamp includes an exterior shell that has the same form factor as a conventional incandescent light bulb, such as a PAR type bulb. The LED lamp includes an optical reflector that is disposed within the shell and that directs the light emitted from one or more LEDs. The optical reflector and shell define a space that is used to channel air to cool the device. The LED is mounted on a heat sink that is disposed within the shell. A fan moves air over the heat sink and through the spaced defined by the optical reflector and the shell. The shell includes one or more apertures that serve as air inlet or exhaust apertures. One or more apertures defined by the optical reflector and shell at the opening of the shell can also be used as air exhaust or inlet apertures.

    摘要翻译： LED灯包括具有与常规白炽灯泡（例如PAR型灯泡）相同形状因数的外壳。 LED灯包括设置在外壳内并引导从一个或多个LED发出的光的光学反射器。 光学反射器和壳体限定了用于引导空气冷却设备的空间。 LED安装在设置在外壳内的散热器上。 风扇将空气移动到散热器上方并通过光学反射器和外壳限定的间隔。 壳体包括用作空气入口或排气孔的一个或多个孔。 由光学反射器和壳体在壳体的开口处限定的一个或多个孔也可以用作排气孔或入口孔。

    Package-integrated thin film LED
    2.
    发明授权
    Package-integrated thin film LED 有权

    公开(公告)号：US08455913B2

    公开(公告)日：2013-06-04

    申请号：US12969709

    申请日：2010-12-16

    申请人： John Epler ,  Paul S. Martin ,  Michael R. Krames

    发明人： John Epler ,  Paul S. Martin ,  Michael R. Krames

    IPC分类号： H01L33/00

    CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

    摘要： LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the LED die such that the LED layers are between the package substrate and the growth substrate. The package substrate provides electrical contacts and conductors leading to solderable package connections. The growth substrate is then removed. Because the delicate LED layers were bonded to the package substrate while attached to the growth substrate, no intermediate support substrate for the LED layers is needed. The relatively thick LED epitaxial layer that was adjacent the removed growth substrate is then thinned and its top surface processed to incorporate light extraction features. There is very little absorption of light by the thinned epitaxial layer, there is high thermal conductivity to the package because the LED layers are directly bonded to the package substrate without any support substrate therebetween, and there is little electrical resistance between the package and the LED layers so efficiency (light output vs. power input) is high. The light extraction features of the LED layer further improves efficiency.

    Reflective substrate for LEDS
    3.
    发明授权
    Reflective substrate for LEDS 有权
    LEDS反光基板

    公开(公告)号：US08431423B2

    公开(公告)日：2013-04-30

    申请号：US12503951

    申请日：2009-07-16

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/60 ,  H01L33/507 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012

    摘要： An underfill formation technique for LEDs molds a reflective underfill material to encapsulate LED dies mounted on a submount wafer while forming a reflective layer of the underfill material over the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top of the LED dies is removed using microbead blasting while leaving the reflective layer over the submount surface. The exposed growth substrate is then removed from all the LED dies, and a phosphor layer is molded over the exposed LED surface. A lens is then molded over the LEDs and over a portion of the reflective layer. The submount wafer is then singulated. The reflective layer increases the efficiency of the LED device by reducing light absorption by the submount without any additional processing steps.

    摘要翻译： 用于LED的底部填充形成技术模制反射底部填充材料以封装安装在底座晶片上的LED管芯，同时在底座晶片上形成底部填充材料的反射层。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷射除去在LED管芯顶部的固化的底部填充材料，同时将反射层留在底座表面上。 然后将曝光的生长衬底从所有的LED管芯移除，并且在暴露的LED表面上模制荧光体层。 然后将透镜模制在LED上并在反射层的一部分上方。 然后将底座晶片分离。 反射层通过减少副安装座的光吸收而没有任何额外的处理步骤来增加LED器件的效率。

    UNDERFILL PROCESS FOR FLIP-CHIP LEDS
    4.
    发明申请
    UNDERFILL PROCESS FOR FLIP-CHIP LEDS 有权
    FLIP-CHIP LED的底层工艺

    公开(公告)号：US20110223696A1

    公开(公告)日：2011-09-15

    申请号：US13115475

    申请日：2011-05-25

    申请人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

    发明人： Grigoriy Basin ,  Frederic Diana ,  Paul S. Martin ,  Dima Simonian

    IPC分类号： H01L33/52

    CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

    摘要： An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.

    摘要翻译： 用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。 成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。 然后通过激光剥离从所有LED管芯去除暴露的生长衬底，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。 然后将底座晶片分离。 许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。

    Accurate alignment of an LED assembly
    6.
    发明授权
    Accurate alignment of an LED assembly 有权
    LED组件的准确对准

    公开(公告)号：US07170151B2

    公开(公告)日：2007-01-30

    申请号：US10346535

    申请日：2003-01-16

    申请人： Cresente S. Elpedes ,  Zainul Fiteri bin Aziz ,  Paul S. Martin

    发明人： Cresente S. Elpedes ,  Zainul Fiteri bin Aziz ,  Paul S. Martin

    IPC分类号： H01L23/495

    CPC分类号： H01L33/642 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48465

    摘要： An LED assembly includes a heat sink and a submount. The heat sink has a top mating surface that is solder wettable, and the submount has a bottom mating surface that is solder wettable. The top and the bottom mating surfaces have substantially the same shape and area. The submount is soldered atop the heat sink. During solder reflow, the molten solder causes the submount to align with the top mating surface of the heat sink. The LED assembly may further include a substrate having a top mating surface, and the heat sink may further include a bottom mating surface. The top and bottom mating surfaces have substantially the same shape and area. The heat sink is soldered atop the substrate. During solder reflow, the molten solder causes the heat sink to align with the top mating surface of the substrate.

    摘要翻译： LED组件包括散热器和底座。 散热器具有可焊接润湿的顶部配合表面，并且底座具有可焊接润湿的底部配合表面。 顶部和底部配合表面具有基本相同的形状和面积。 底座焊接在散热器顶部。 在焊料回流期间，熔融焊料使得底座与散热器的顶部配合表面对齐。 LED组件还可以包括具有顶部配合表面的衬底，并且散热器还可以包括底部配合表面。 顶部和底部配合表面具有基本相同的形状和面积。 散热器焊接在基板上。 在焊料回流期间，熔融焊料使得散热器与衬底的顶部配合表面对齐。

    PACKAGE-INTEGRATED THIN FILM LED
    9.
    发明申请
    PACKAGE-INTEGRATED THIN FILM LED 有权
    封装集成薄膜LED

    公开(公告)号：US20110084301A1

    公开(公告)日：2011-04-14

    申请号：US12969709

    申请日：2010-12-16

    申请人： John Epler ,  Paul S. Martin ,  Michael R. Krames

    发明人： John Epler ,  Paul S. Martin ,  Michael R. Krames

    IPC分类号： H01L33/48 ,  H01L33/36

    CPC分类号： H01L33/48 ,  H01L24/73 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

    摘要： LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries of the LED die such that the LED layers are between the package substrate and the growth substrate. The package substrate provides electrical contacts and conductors leading to solderable package connections. The growth substrate is then removed. Because the delicate LED layers were bonded to the package substrate while attached to the growth substrate, no intermediate support substrate for the LED layers is needed. The relatively thick LED epitaxial layer that was adjacent the removed growth substrate is then thinned and its top surface processed to incorporate light extraction features. There is very little absorption of light by the thinned epitaxial layer, there is high thermal conductivity to the package because the LED layers are directly bonded to the package substrate without any support substrate therebetween, and there is little electrical resistance between the package and the LED layers so efficiency (light output vs. power input) is high. The light extraction features of the LED layer further improves efficiency.

    摘要翻译： 在衬底上生长LED外延层（n型，p型和有源层）。 对于每个管芯，n和p层电连接到延伸超过LED管芯边界的封装衬底，使得LED层位于封装衬底和生长衬底之间。 封装衬底提供电触头和导体，导致可焊接的封装连接。 然后除去生长底物。 因为精细的LED层在附着于生长衬底的同时与封装衬底结合，所以不需要用于LED层的中间支撑衬底。 然后将与去除的生长衬底相邻的较厚的LED外延层变薄，并将其顶表面加工成掺入光提取特征。 通过减薄的外延层对光的吸收非常小，因为LED层直接接合到封装基板上而没有任何支撑基板，因此封装和LED之间的电阻很小，因此封装的导热性很高 层效率（光输出与功率输入）高。 LED层的光提取特性进一步提高了效率。

    LED PACKAGE WITH PHOSPHOR PLATE AND REFLECTIVE SUBSTRATE
    10.
    发明申请
    LED PACKAGE WITH PHOSPHOR PLATE AND REFLECTIVE SUBSTRATE 审中-公开
    LED包装与磷酸盐和反射基板

    公开(公告)号：US20110049545A1

    公开(公告)日：2011-03-03

    申请号：US12552328

    申请日：2009-09-02

    申请人： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Jeffrey Kmetec ,  Paul S. Martin

    IPC分类号： H01L33/00

    CPC分类号： H01L24/97 ,  H01L33/005 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00

    摘要： After flip chip LEDs are mounted on a submount wafer and their growth substrates removed, a phosphor plate is affixed to the exposed top surface of each LED. A reflective material, such as silicone containing at least 5% TiO2 powder, by weight, is then spun over or molded over the wafer to cover the phosphor plates and the sides of the LEDs. The top surface of the reflective material is then etched using microbead blasting to expose the top of the phosphor plates and create a substantially planar reflective layer over the wafer surface. Lenses may then be formed over the LEDs. The wafer is then singulated. The reflective material reflects all side light back into the LED and phosphor plate so that virtually all light exits the top of the phosphor plate to improve the light emission characteristics.

    摘要翻译： 在将倒装芯片LED安装在底座晶片上并且移除其生长衬底之后，将磷光体板固定到每个LED的暴露的顶表面。 然后将反射材料，例如含有至少5重量％TiO 2的硅氧烷的硅酮在晶片上旋转或模制，以覆盖荧光体板和LED的侧面。 然后使用微珠喷射来蚀刻反射材料的顶表面以暴露荧光体板的顶部并在晶片表面上形成基本上平面的反射层。 然后可以在LED上形成透镜。 然后将晶片切片。 反射材料将所有侧光反射回LED和磷光体板，使得几乎所有的光离开荧光体板的顶部以改善发光特性。