Apparatus and method for specifying correlation, exposure apparatus, and device manufacturing method
    13.
    发明申请
    Apparatus and method for specifying correlation, exposure apparatus, and device manufacturing method 失效
    用于指定相关性的装置和方法,曝光装置和装置制造方法

    公开(公告)号:US20070019857A1

    公开(公告)日:2007-01-25

    申请号:US11489360

    申请日:2006-07-19

    Abstract: Disclosed is a method and apparatus which are arranged to detect magnitude of correlation between (i) an explanatory variable corresponding to operation data related to an operation made by an exposure apparatus for exposing a substrate, and (ii) a response variable corresponding to inspection data related to a result of inspection made to the substrate after the same is exposed, the magnitude of correlation between the explanatory variable and the response variable being detected with respect to each of different combinations of operation data pieces, and also arranged to specify, on the basis of detected correlation magnitudes and with respect to one of the different combinations of operation data pieces, a category of the operation data and the correlation between the explanatory variable and the response variable.

    Abstract translation: 公开了一种方法和装置,其被设置为检测(i)对应于与由曝光装置曝光基板的曝光装置进行的操作有关的操作数据的解释变量的相关性,以及(ii)与检查数据相对应的响应变量 与在曝光之后对基板进行检查的结果相关,解释变量与响应变量之间的相关性的大小相对于操作数据的不同组合检测到,并且还被布置为在 检测到的相关幅度的基础,以及操作数据的不同组合之一,操作数据的类别以及解释变量与响应变量之间的相关性。

    Polishing method and apparatus
    14.
    发明授权
    Polishing method and apparatus 失效
    抛光方法和设备

    公开(公告)号:US07081038B2

    公开(公告)日:2006-07-25

    申请号:US11003447

    申请日:2004-12-06

    Applicant: Hideki Ina

    Inventor: Hideki Ina

    CPC classification number: B24B49/12 B24B37/042

    Abstract: Provided is a polishing method of polishing a substrate by rotating the substrate and a pad while keeping the pad in contact with the substrate, the method including: a first polishing step of polishing the substrate by rotating the substrate and the pad in a first direction; and a second polishing step of polishing the substrate by rotating the substrate and the pad in a second direction opposite to the first direction.

    Abstract translation: 提供了一种通过在保持衬垫与衬底接触的同时旋转衬底和衬垫来抛光衬底的抛光方法,所述方法包括:第一抛光步骤,通过沿第一方向旋转衬底和衬垫来抛光衬底; 以及第二抛光步骤,通过沿与第一方向相反的第二方向旋转衬底和衬垫来抛光衬底。

    Management system, management apparatus, management method, and device manufacturing method
    15.
    发明授权
    Management system, management apparatus, management method, and device manufacturing method 失效
    管理体系,管理手段,管理方法和装置制造方法

    公开(公告)号:US07069104B2

    公开(公告)日:2006-06-27

    申请号:US10423888

    申请日:2003-04-28

    Abstract: A management system including an acquisition device for acquiring actual processing results obtained by operating an industrial device with a set parameter value and another parameter value, and an estimated processing result, an inspection device for inspecting the processing result obtained with the set parameter value, and acquiring and accumulating an inspection result value, a change device for changing the set parameter value on the basis of the processing results acquired by the acquisition device and the inspection result value obtained by the inspection device, an evaluation device for evaluating a variation state of the processing results on the basis of an inspection result value accumulated by the inspection device, and a decision device for deciding, on the basis of an evaluation result by the evaluation device, a frequency at which the acquisition device is executed.

    Abstract translation: 一种管理系统,包括:获取装置,用于获取通过操作具有设定参数值和另一参数值的工业设备获得的实际处理结果;以及估计处理结果;检查装置,用于检查用设定参数值获得的处理结果;以及 获取和累积检查结果值,根据由获取装置获取的处理结果和由检查装置获得的检查结果值来改变设定参数值的改变装置,用于评估检测结果值的变化状态的评估装置 基于由检查装置积存的检查结果值的处理结果,以及判定装置,其根据评价装置的评价结果​​,决定执行获取装置的频率。

    Management system and apparatus, method therefor, and device manufacturing method
    19.
    发明授权
    Management system and apparatus, method therefor, and device manufacturing method 有权
    管理系统及装置,方法及装置制造方法

    公开(公告)号:US06785583B2

    公开(公告)日:2004-08-31

    申请号:US10423893

    申请日:2003-04-28

    Abstract: A semiconductor device manufacturing apparatus management system includes a semiconductor device manufacturing apparatus which operates in accordance with a parameter, an obtaining device for obtaining evaluation values of an operation result of the semiconductor device manufacturing apparatus corresponding to a plurality of parameter values of the parameter, a holding device for holding the evaluation values obtained by the obtaining device for each object to be processed by the semiconductor device manufacturing apparatus, and an optimization device for analyzing the evaluation values held by the holding device. The optimization device optimizes the parameter on the basis of at least one of a sensitivity representing a change degree of the evaluation values upon the change in the parameter, and a variation amount of the evaluation values for each object to be processed.

    Abstract translation: 半导体器件制造装置管理系统包括根据参数操作的半导体器件制造装置,获得装置,用于获得与参数的多个参数值相对应的半导体器件制造装置的操作结果的评估值, 保持装置,用于保持由半导体装置制造装置中的每个待处理对象获得装置获得的评估值;以及优化装置,用于分析由保持装置保持的评估值。 优化装置基于表示参数的变化时的评价值的变化程度的灵敏度和对待处理对象的评价值的变化量中的至少一个来优化参数。

    Alignment method and exposure apparatus using the same
    20.
    发明授权
    Alignment method and exposure apparatus using the same 失效
    对准方法和使用其的曝光装置

    公开(公告)号:US06636311B1

    公开(公告)日:2003-10-21

    申请号:US09450682

    申请日:1999-11-30

    Abstract: An alignment method for aligning first and second objects, in an exposure apparatus for transferring a pattern of the first object onto the second object as being coated with a resist, includes a process of producing an alignment offset value related to an alignment mark forming region on the second object, after formation of the resist coating thereon, and a process of aligning the first object with the second object as being coated with the resist, in the exposure apparatus, on the basis of the offset value as produced.

    Abstract translation: 一种用于对准第一和第二物体的对准方法,在用于将第一物体的图案转印到第二物体上的涂布抗蚀剂的曝光装置中,包括产生与对准标记形成区域相关的取向偏移值的处理 第二个目的是在其上形成抗蚀剂涂层之后,以及在曝光装置中,基于产生的偏移值,将第一物体与第二物体对准被涂覆有抗蚀剂的处理。

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