Abstract:
An information providing system includes a reception unit that receives first information concerning a process to be performed by an apparatus from a customer via a network, a processing unit which simulates the process based on the first information and prepares second information based on a result of the simulation, and a transmission unit which transmits the second information to the customer via a network.
Abstract:
An alignment apparatus for aligning a reflective reticle includes a light source for emitting alignment light, an optical alignment mark provided on the reticle, and a reference mark provided on a reticle stage that holds the reticle. A detecting unit detects the alignment light reflected from the alignment mark and the reference mark, and the reticle is aligned on the basis of the result of detection by the detection unit.
Abstract:
Disclosed is a method and apparatus which are arranged to detect magnitude of correlation between (i) an explanatory variable corresponding to operation data related to an operation made by an exposure apparatus for exposing a substrate, and (ii) a response variable corresponding to inspection data related to a result of inspection made to the substrate after the same is exposed, the magnitude of correlation between the explanatory variable and the response variable being detected with respect to each of different combinations of operation data pieces, and also arranged to specify, on the basis of detected correlation magnitudes and with respect to one of the different combinations of operation data pieces, a category of the operation data and the correlation between the explanatory variable and the response variable.
Abstract:
Provided is a polishing method of polishing a substrate by rotating the substrate and a pad while keeping the pad in contact with the substrate, the method including: a first polishing step of polishing the substrate by rotating the substrate and the pad in a first direction; and a second polishing step of polishing the substrate by rotating the substrate and the pad in a second direction opposite to the first direction.
Abstract:
A management system including an acquisition device for acquiring actual processing results obtained by operating an industrial device with a set parameter value and another parameter value, and an estimated processing result, an inspection device for inspecting the processing result obtained with the set parameter value, and acquiring and accumulating an inspection result value, a change device for changing the set parameter value on the basis of the processing results acquired by the acquisition device and the inspection result value obtained by the inspection device, an evaluation device for evaluating a variation state of the processing results on the basis of an inspection result value accumulated by the inspection device, and a decision device for deciding, on the basis of an evaluation result by the evaluation device, a frequency at which the acquisition device is executed.
Abstract:
An information providing system includes a reception unit that receives first information concerning a process to be performed by an apparatus from a customer via a network, a processing unit which simulates the process based on the first information and prepares second information based on a result of the simulation, and a transmission unit which transmits the second information to the customer via a network.
Abstract:
A method of detecting relative position of a reflecting-type reticle and a substrate with the reticle having an alignment mark thereon. The method includes a holding step of holding the reticle on a reticle stage which has a reference mark, and a detection step of detecting position of the alignment mark on the reticle based on alignment light reflected from the alignment mark and detecting relative position between the reference mark on the reticle stage and the alignment mark.
Abstract:
A shape measuring method for measuring a shape of a surface of an object. The method includes a first measuring step for measuring the surface of the object by detecting light from the object, and a second measuring step for measuring the surface of the object by relatively scanning a probe and the object. A scanning speed changes on the basis of the result of the first measurement step.
Abstract:
A semiconductor device manufacturing apparatus management system includes a semiconductor device manufacturing apparatus which operates in accordance with a parameter, an obtaining device for obtaining evaluation values of an operation result of the semiconductor device manufacturing apparatus corresponding to a plurality of parameter values of the parameter, a holding device for holding the evaluation values obtained by the obtaining device for each object to be processed by the semiconductor device manufacturing apparatus, and an optimization device for analyzing the evaluation values held by the holding device. The optimization device optimizes the parameter on the basis of at least one of a sensitivity representing a change degree of the evaluation values upon the change in the parameter, and a variation amount of the evaluation values for each object to be processed.
Abstract:
An alignment method for aligning first and second objects, in an exposure apparatus for transferring a pattern of the first object onto the second object as being coated with a resist, includes a process of producing an alignment offset value related to an alignment mark forming region on the second object, after formation of the resist coating thereon, and a process of aligning the first object with the second object as being coated with the resist, in the exposure apparatus, on the basis of the offset value as produced.