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公开(公告)号：US08436380B2
公开(公告)日：2013-05-07
申请号：US12884717
申请日：2010-09-17
Applicant: Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
Inventor： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
IPC: H01L29/22 , H01L29/227 , H01L27/15 , H01L29/267 , H01L29/24
CPC classification number: H01L25/0753 , F21K9/68 , F21V23/00 , H01L33/507 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.
Abstract translation: 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上覆盖由透光盖和印刷电路板限定的内部空间。
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公开(公告)号：USD658788S1
公开(公告)日：2012-05-01
申请号：US29359239
申请日：2010-04-07
Applicant: David C. Dudik , Gary R. Allen , Charles L. Huddleston, II , Joshua I. Rintamaki , Glenn H. Kuenzler , James Reginelli
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公开(公告)号：US20110001422A1
公开(公告)日：2011-01-06
申请号：US12884612
申请日：2010-09-17
Applicant: Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
Inventor： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
IPC: H01J1/62
CPC classification number: H01L25/0753 , F21K9/68 , F21V23/00 , H01L33/507 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
Abstract translation: 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上填充由透光盖和印刷电路板限定的内部空间。
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公开(公告)号：US20080054280A1
公开(公告)日：2008-03-06
申请号：US11516533
申请日：2006-09-06
Applicant: James Reginelli , Srinath K. Aanegola , Emil Radkov
Inventor： James Reginelli , Srinath K. Aanegola , Emil Radkov
CPC classification number: H01L25/0753 , G02F1/353 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/644 , H01L2924/0002 , H01S5/02288 , H01S5/02296 , H01L2924/00
Abstract: In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m.K).
Abstract translation: 在发光封装（8）中，至少一个发光芯片（12,14,16,18）由板（10）支撑。 透光密封剂（30）设置在所述至少一个发光芯片之上并且在所述板的覆盖区域（32）之上。 光透射的大致保形的壳体（40）设置在密封剂上方并且具有通过与密封剂的外表面（34）的气隙（G）间隔开并且大体上与其密封的外表面间隔开的内表面（44）。 至少一个磷光体（50）被布置在所述保形壳中或嵌入所述保形壳中，以响应于所述至少一个发光芯片的照射来输出转换的光。 布置在大致保形壳（40）中的导热填料有效地将复合壳材料的热导率提高到高于0.3W /（m.K）的值。
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公开(公告)号：US20080035947A1
公开(公告)日：2008-02-14
申请号：US10582377
申请日：2004-12-09
Applicant: Stanton Earl Weaver Jr. , Chen-Lun Hsing Chen , Boris Kolodin , Thomas Elliot Stecher , James Reginelli , Deborah Ann Haitko , Xiang Gao , Ivan Eliashevich
Inventor： Stanton Earl Weaver Jr. , Chen-Lun Hsing Chen , Boris Kolodin , Thomas Elliot Stecher , James Reginelli , Deborah Ann Haitko , Xiang Gao , Ivan Eliashevich
IPC: H01L33/00
CPC classification number: H01L33/64 , H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2924/10253 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
Abstract: A surface mount light emitting package includes a chip carrier having top and bottom principal surfaces. At least one light emitting chip is attached to the top principal surface of the chip carrier. A lead frame attached to the top principal surface of the chip carrier. When surface mounted to an associated support, the bottom principal surface of the chip carrier is in thermal contact with the associated support without the lead frame intervening therebetween.
Abstract translation: 表面安装发光封装包括具有顶部和底部主表面的芯片载体。 至少一个发光芯片附着到芯片载体的顶部主表面。 连接到芯片载体的顶部主表面的引线框架。 当表面安装到相关联的支撑件时，芯片载体的底部主表面与相关联的支撑件热接触，而没有引导框架介于其间。
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Patent Agency Ranking
公开(公告)号：US10309587B2
公开(公告)日：2019-06-04
申请号：US13886878
申请日：2013-05-03
Applicant: Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, Jr. , Thomas F. Soules
Inventor： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, Jr. , Thomas F. Soules
IPC: F21K9/64 , F21K9/68 , F21V13/08 , H01L33/46 , H01L33/50 , H01L33/58 , H01L33/60 , F21Y105/10 , F21Y115/10
Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
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公开(公告)号：US20180080614A9
公开(公告)日：2018-03-22
申请号：US13886878
申请日：2013-05-03
Applicant: Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, JR. , Thomas F. Soules
Inventor： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, JR. , Thomas F. Soules
CPC classification number: F21K9/64 , F21K9/68 , F21V13/08 , F21Y2105/10 , F21Y2115/10 , H01L33/46 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
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公开(公告)号：US08362695B2
公开(公告)日：2013-01-29
申请号：US12884612
申请日：2010-09-17
Applicant: Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
Inventor： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
IPC: H01J1/62
CPC classification number: H01L25/0753 , F21K9/68 , F21V23/00 , H01L33/507 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
Abstract translation: 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上填充由透光盖和印刷电路板限定的内部空间。
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公开(公告)号：US07717591B2
公开(公告)日：2010-05-18
申请号：US11965686
申请日：2007-12-27
Applicant: Stanton E. Weaver, Jr. , James Reginelli
Inventor： Stanton E. Weaver, Jr. , James Reginelli
CPC classification number: H05K3/28 , F21K9/64 , H05K3/285 , H05K2201/015 , H05K2201/10106 , H05K2201/2054 , Y10T29/4913
Abstract: A light emitting apparatus includes a support having circuitry disposed thereon, at least one light emitting diode (LED) chip mounted on the support and in electrical communication with the circuitry and a reflective layer on the support adjacent the at least one chip.
Abstract translation: 一种发光装置，包括一个其上设有电路的支撑体，至少一个安装在该支架上并与该电路电气连通的发光二极管（LED）芯片，以及与该至少一个芯片相邻的该支撑件上的反射层。
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公开(公告)号：US20090166653A1
公开(公告)日：2009-07-02
申请号：US11965686
申请日：2007-12-27
Applicant: Stanton E. Weaver, JR. , James Reginelli
Inventor： Stanton E. Weaver, JR. , James Reginelli
IPC: H01L33/00 , F21V7/22 , H01L21/027 , H05K3/32
CPC classification number: H05K3/28 , F21K9/64 , H05K3/285 , H05K2201/015 , H05K2201/10106 , H05K2201/2054 , Y10T29/4913
Abstract: A light emitting apparatus includes a support having circuitry disposed thereon, at least one light emitting diode (LED) chip mounted on the support and in electrical communication with the circuitry and a reflective layer on the support adjacent the at least one chip.
Abstract translation: 一种发光装置，包括一个其上设有电路的支撑体，至少一个安装在该支架上并与该电路电气连通的发光二极管（LED）芯片，以及与该至少一个芯片相邻的该支撑件上的反射层。
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