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    Light emitting packages and methods of making same
    5.
    发明授权
    Light emitting packages and methods of making same 有权
    发光封装及其制造方法

    公开(公告)号：US07842960B2

    公开(公告)日：2010-11-30

    申请号：US11516533

    申请日：2006-09-06

    申请人： James Reginelli ,  Srinath K. Aanegola ,  Emil Radkov

    发明人： James Reginelli ,  Srinath K. Aanegola ,  Emil Radkov

    IPC分类号： H01L21/00

    CPC分类号： H01L25/0753 ,  G02F1/353 ,  H01L33/507 ,  H01L33/54 ,  H01L33/58 ,  H01L33/644 ,  H01L2924/0002 ,  H01S5/02288 ,  H01S5/02296 ,  H01L2924/00

    摘要： In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).

    摘要翻译： 在发光封装（8）中，至少一个发光芯片（12,14,16,18）由板（10）支撑。 透光密封剂（30）设置在所述至少一个发光芯片之上并且在所述板的覆盖区域（32）之上。 光透射的大致保形的壳体（40）设置在密封剂上方并且具有通过与密封剂的外表面（34）的气隙（G）间隔开并且大体上与其密封的外表面间隔开的内表面（44）。 至少一个磷光体（50）被布置在所述保形壳中或嵌入所述保形壳中，以响应于所述至少一个发光芯片的照射来输出转换的光。 设置在大致保形壳（40）中的导热填充材料有效地将复合壳材料的热导率提高到高于0.3W /（m·K）的值。

    CIRCUIT BOARD FOR DIRECT FLIP CHIP ATTACHMENT
    6.
    发明申请
    CIRCUIT BOARD FOR DIRECT FLIP CHIP ATTACHMENT 失效
    电路板直接连接芯片连接

    公开(公告)号：US20090212317A1

    公开(公告)日：2009-08-27

    申请号：US12038200

    申请日：2008-02-27

    申请人： Boris Kolodin ,  James Reginelli

    发明人： Boris Kolodin ,  James Reginelli

    IPC分类号： H01L33/00 ,  H01L21/60

    CPC分类号： H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/027 ,  H05K3/064 ,  H05K2201/09363 ,  H05K2201/10106 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00

    摘要： A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.

    摘要翻译： 封装方法包括：通过在绝缘板上形成基本上连续的导电层形成电路板，并移除所述连续导电层的选定部分以限定导电迹线; 激光切割导电迹线以通过激光切割形成的激光切割间隙来彼此电隔离的子迹线; 以及将发光二极管（LED）芯片连接到所述激光切割间隙上或与所述激光切割间隙相邻的所述电路板，所述接合包括在不使用插入的基座的情况下将所述LED芯片的电极可操作地电连接到所述子迹线之一。 半导体封装包括结合到电路板的导电迹线的子迹线的LED芯片倒装芯片，子迹线通过小于或约100微米的窄间隙彼此电隔离。

    Circuit board for direct flip chip attachment
    10.
    发明授权
    Circuit board for direct flip chip attachment 失效
    用于直接倒装芯片连接的电路板

    公开(公告)号：US07749813B2

    公开(公告)日：2010-07-06

    申请号：US12038200

    申请日：2008-02-27

    申请人： Boris Kolodin ,  James Reginelli

    发明人： Boris Kolodin ,  James Reginelli

    IPC分类号： H01L21/00 ,  H01L23/12 ,  H01L23/053 ,  H05K1/00 ,  H05K3/02 ,  H05K3/10

    CPC分类号： H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/027 ,  H05K3/064 ,  H05K2201/09363 ,  H05K2201/10106 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00

    摘要： A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.

    摘要翻译： 封装方法包括：通过在绝缘板上形成基本上连续的导电层形成电路板，并移除所述连续导电层的选定部分以限定导电迹线; 激光切割导电迹线以通过激光切割形成的激光切割间隙来彼此电隔离的子迹线; 以及将发光二极管（LED）芯片连接到所述激光切割间隙上或与所述激光切割间隙相邻的所述电路板，所述接合包括在不使用插入的基座的情况下将所述LED芯片的电极可操作地电连接到所述子迹线之一。 半导体封装包括结合到电路板的导电迹线的子迹线的LED芯片倒装芯片，子迹线通过小于或约100微米的窄间隙彼此电隔离。