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19 条记录 (耗时 0.021 秒)

    Electroform, methods of making electroforms, and products made from electroforms
    11.
    发明申请
    Electroform, methods of making electroforms, and products made from electroforms 审中-公开
    电铸，电铸方法，以及由电铸制成的产品

    公开(公告)号：US20070125655A1

    公开(公告)日：2007-06-07

    申请号：US11292508

    申请日：2005-12-02

    申请人： Paul Buckley ,  Dennis Coyle ,  Michael Davis ,  Richard Edwards ,  Kenneth Zarnoch

    发明人： Paul Buckley ,  Dennis Coyle ,  Michael Davis ,  Richard Edwards ,  Kenneth Zarnoch

    IPC分类号： C25D1/10

    CPC分类号： C25D1/006 ,  C25D1/10

    摘要： In one embodiment, the method for making an electroform comprises: attaching a sub-master to a first side of a stiffener plate to form a mounted sub-master, wherein the stiffener plate is longer and/or wider than the sub-master such that, when the sub-master is attached to the stiffener plate, the stiffener plate forms a boarder around the sub-master, disposing conductive rim on the stiffener plate in physical contact with the boarder and with the edges of the sub-master, masking edges and a second side of the stiffener plate, passivating the surface to form a passivation layer, plating the surface and non-masked areas of the conductive rim with a metal to form a metal layer, and removing the metal layer to form the electroform.

    摘要翻译： 在一个实施例中，用于制造电铸的方法包括：将子母板附接到加强板的第一侧以形成安装的子母模，其中所述加强板比所述副母模更长和/或更宽，使得 当副主机连接到加强板时，加强板在副主机周围形成一个边缘，将加强板上的导电边缘设置在与边板物理接触的同时与子主机的边缘，掩蔽边缘 并且加强板的第二侧，钝化表面以形成钝化层，用金属镀覆导电边缘的表面和非掩蔽区域以形成金属层，以及去除金属层以形成电铸。

    Multilayer electroform, methods of making multilayer electroforms, and products made therefrom
    13.
    发明申请
    Multilayer electroform, methods of making multilayer electroforms, and products made therefrom 审中-公开
    多层电铸，制备多层电铸的方法以及由其制成的产品

    公开(公告)号：US20070125653A1

    公开(公告)日：2007-06-07

    申请号：US11292475

    申请日：2005-12-02

    申请人： Dennis Coyle ,  Kenneth Zarnoch

    发明人： Dennis Coyle ,  Kenneth Zarnoch

    IPC分类号： C25D1/00

    CPC分类号： C25D1/003 ,  C25D1/006 ,  C25D1/10

    摘要： In one embodiment, the method for making an electroform comprises: passivating a sub-master to form a passivation layer, disposing the passivated sub-master into an initial electroplating solution, applying a first current, depositing a first metal onto the passivated sub-master to form an initial coating on the sub-master, moving the initially coated sub-master from the initial electroplating solution to a subsequent plating solution, applying a second current, depositing a subsequent layer of a second metal onto the initial coating to form a multilayer, and removing the multilayer to form the electroform.

    摘要翻译： 在一个实施例中，制造电铸的方法包括：钝化子母板以形成钝化层，将钝化的次母模放置在初始电镀溶液中，施加第一电流，将第一金属沉积到钝化子母模上 在子母模上形成初始涂层，将初始涂覆的副母料从初始电镀溶液移动到随后的镀液中，施加第二电流，将第二金属的后续层沉积到初始涂层上以形成多层 ，并除去多层以形成电铸。

    Poly (arylene ether) composition and method
    19.
    发明申请
    Poly (arylene ether) composition and method 失效
    聚（亚芳基醚）组合物和方法

    公开(公告)号：US20050075463A1

    公开(公告)日：2005-04-07

    申请号：US10678459

    申请日：2003-10-03

    申请人： Kenneth Zarnoch ,  John Campbell ,  Glen Merfeld ,  John Rude ,  Prameela Susarla ,  Michael Vallance ,  Gary Yeager

    发明人： Kenneth Zarnoch ,  John Campbell ,  Glen Merfeld ,  John Rude ,  Prameela Susarla ,  Michael Vallance ,  Gary Yeager

    IPC分类号： C08F283/08 ,  C08F293/00 ,  C08F297/02 ,  C08G65/48 ,  C08L53/00 ,  C08L71/12

    CPC分类号： C08G65/48 ,  C08F293/005 ,  C08F297/02 ,  C08F297/026 ,  C08G65/485 ,  C08L53/00

    摘要： A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.

    摘要翻译： 可固化组合物包括官能化的聚（亚芳基醚），烯属不饱和单体，每100重量份官能化聚（亚芳基醚）和烯属不饱和单体的总量为约0.2至约5重量份的固化引发剂，以及 官能化聚（亚芳基醚）和烯属不饱和单体总量相对于100重量份固化抑制剂为约0.005〜约1重量份。 固化引发剂与固化抑制剂的重量比为约1.2:1至约50:1。 该组合物在模制的早期阶段提供了改进的和可重复的流动，而不损害固化时间。 该组合物可用于制备塑料封装的电子器件。