Abstract:
A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive circuit layer to form a trellis with a plurality of wall units, so that regions of the conductive circuit layer surrounded by the wall units are exposed; mounting and electrically connecting at least one LED die on the conductive circuit layer within each of the wall units; molding a transparent layer to cover the LED dies; and cutting along the wall units to form a plurality of LED packages.
Abstract:
An interleaved buck converter performs buck conversion by controlling operation of each of two switches thereof between an ON state and an OFF state. The switches have the same switching period and the same ON time interval, and a time delay from switching of one of the switches into the ON state to switching of the other one of the switches into the ON state equals the ON time interval of the switches minus a predetermined time interval.
Abstract:
A DC backup system is for providing emergency electric power to an electronic device powered by an input power source, and includes a battery backup unit and a battery control unit. The battery backup unit is operable to output state information indicating a state thereof, and test information associated with a self test performed thereon. The battery control unit is electrically connected to the battery backup unit for receiving the state information and the test information therefrom, and is configured to control, according to the state information and the test information, the battery backup unit to output electric power to the electronic device when the input power source fails.
Abstract:
A direct current voltage conversion device includes a direct current to alternating current converter, a transformer, a first converter switch, a second converter switch and a clamping circuit. The clamping circuit clamps a voltage across the second converter switch to a preset value, and stores energy of a voltage peak across the second converter switch.
Abstract:
A focusing method includes the steps of calculating a diameter difference between a first circle of confusion diameter and a second circle of confusion diameter which correspond respectively to first image data and second image data associated respectively with light energy of a first spectrum and light energy of a second spectrum, generating a control signal associated with a target image distance according to an initial image distance, the diameter difference, and a lookup table, driving movement of a lens module so as to change a distance between the lens module and an image sensor from the initial image distance into the target image distance according to the control signal.
Abstract:
A light emitting device includes a substrate having a top surface, upper and lower metal layers, multiple LED chips, at least one Zener diode, multiple conductive wires and an encapsulant. The top surface includes a central region bounded by an imaginary boundary with a profile conforming to an outline of a circle stacked with a polygon. The central region has a die bonding area corresponding to the circle, and at least one polygonal extension area formed outside the die bonding area. The upper metal layer includes multiple conducting pads surrounding the central region. The LED chips are disposed on the die bonding area. The Zener diode is disposed on the polygonal extension area. The encapsulant is disposed on the substrate and covers the LED chips.
Abstract:
A white light emitting device includes an LED chip capable of emitting light with a peak wavelength of 390 to 430 nm, and a wavelength conversion layer including first, second and third fluorescent materials. The first fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The second fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The third fluorescent material is capable of being excited to emit light with a peak wavelength of 630 to 650 nm. Light emitted by the white light emitting device has a color temperature below 5000 K, and a general color rendering index value (Ra) and special color rendering index values (R9-R15) all greater than 90.
Abstract:
A separating device includes a base, a feed mechanism operable to convey first and second electronic component to a discharge end thereof, and a separating mechanism disposed on the base and including a first carrier connected slidably to the base and configured to carry the first electronic component, a second carrier connected slidably to the base and configured to carry the second electronic component, and a drive unit for driving reciprocation of the first and second carriers between a pick-up position, where the first carrier abuts against the second carrier, and a separating position, where the first and second carriers are separated from each other.
Abstract:
A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive circuit layer to form a trellis with a plurality of wall units, so that regions of the conductive circuit layer surrounded by the wall units are exposed; mounting and electrically connecting at least one LED die on the conductive circuit layer within each of the wall units; molding a transparent layer to cover the LED dies; and cutting along the wall units to form a plurality of LED packages.
Abstract:
In a method for generating a depth map for an image, an image processing apparatus is configured to: determine a depth level for each of at least two objects in the image according to an angle of incidence in which light incident upon the object is projected onto an image sensor of a light-field camera; calculate a depth value of the depth level associated with one of the objects; estimate a depth value for the depth level associated with another one of the objects; and generate a depth map according to the depth values. The depth value is estimated based on a distance between first and second locations on the image sensor, on which light incident upon the reference and relative objects are projected.