Abstract:
A free-standing multi-laminate hermetic sheet includes a first carrier film, a hermetic inorganic thin film formed over the first carrier film, and a second carrier film formed over the hermetic inorganic thin film. A workpiece can be hermetically sealed using the multi-laminate sheet, which can be applied to the workpiece in a step separate from a formation step of either the multi-laminate sheet or the workpiece.
Abstract:
A glass substrate having at least one surface with engineered properties that include hydrophobicity, oleophobicity, anti-stick or adherence of particulate or liquid matter, durability, and transparency (i.e., haze
Abstract:
A method is disclosed for inhibiting oxygen and moisture penetration of a device comprising the steps of depositing a tin phosphate low liquidus temperature (LLT) inorganic material on at least a portion of the device to create a deposited tin phosphate LLT material, and heat treating the deposited LLT material in a substantially oxygen and moisture free environment to form a hermetic seal; wherein the step of depositing the LLT material comprises the use of a resistive heating element comprising tungsten. An organic electronic device is also disclosed comprising a substrate plate, at least one electronic or optoelectronic layer, and a tin phosphate LLT barrier layer, wherein the electronic or optoelectronic layer is hermetically sealed between the tin phosphate LLT barrier layer and the substrate plate. An apparatus is also disclosed having at least a portion thereof sealed with a tin phosphate LLT barrier layer.
Abstract:
Durable antireflective coatings and glass articles having such coatings are described herein. The antireflective coatings generally include a layer of nominally hexagonally packed nanoparticles that are partially embedded either in a surface of the glass article or in a binder that is on the surface of the glass article. Methods of making the antireflective coatings or layers and glass articles having such antireflective layers are also described.
Abstract:
Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.
Abstract:
A sealing method for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device (e.g., a hermetically sealed OLED device) are described herein. The sealing method includes the steps of: (1) cooling an un-encapsulated device; (2) depositing a sealing material over at least a portion of the cooled device to form an encapsulated device; and (3) heat treating the encapsulated device to form a hermetically sealed device. In one embodiment, the sealing material is a low liquidus temperature inorganic (LLT) material such as, for example, tin-fluorophosphate glass, tungsten-doped tin fluorophosphate glass, chalcogenide glass, tellurite glass, borate glass and phosphate glass. In another embodiment, the sealing material is a Sn2+-containing inorganic oxide material such as, for example, SnO, SnO+P2O5 and SnO+BPO4.
Abstract:
A substrate having a durable hydrophobic and/or oleophobic surface. The durable hydrophobic and/or oleophobic surface includes a first layer that is disposed on the substrate and comprises inorganic nanoparticles, an outer layer comprising a fluorosilane, and an optional immobilizing layer that comprises at least one of an inorganic oxide and a silsesquioxane. The durable surface is capable of retaining optical properties, such as haze, and hydrophobic and/or oleophobic properties after repeated contact with foreign objects such as, for example, wiping with a cloth or human finger.
Abstract:
Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.
Abstract:
A hermetic thin film includes a first inorganic layer and a second inorganic layer contiguous with the first inorganic layer, wherein the second inorganic layer is formed as a reaction product of the first inorganic layer with oxygen and has a molar volume that is about −1% to 15% greater than a molar volume of the first inorganic layer. An equilibrium thickness of the second inorganic layer is at least 10% of but less than an as-deposited thickness of the first inorganic layer.
Abstract:
A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn2+-containing inorganic oxide material or a low liquidus temperature inorganic material.