公开(公告)号：US20170222073A1

公开(公告)日：2017-08-03

申请号：US15492382

申请日：2017-04-20

Applicant: Taeseok Kim ,  Robert Woehl ,  Gabriel Harley ,  Nils-Peter Harder ,  Jens-Dirk Moschner ,  Matthieu Moors ,  Michel Arsene Olivier Ngamo Toko

Inventor： Taeseok Kim ,  Robert Woehl ,  Gabriel Harley ,  Nils-Peter Harder ,  Jens-Dirk Moschner ,  Matthieu Moors ,  Michel Arsene Olivier Ngamo Toko

IPC: H01L31/0224 ,  H01L31/028 ,  H01L31/0368 ,  H01L31/077 ,  H01L31/056 ,  H01L31/0236

CPC classification number: H01L31/022458 ,  H01L31/022441 ,  H01L31/02366 ,  H01L31/028 ,  H01L31/035281 ,  H01L31/03682 ,  H01L31/05 ,  H01L31/0516 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/0745 ,  H01L31/077 ,  H01L31/1804 ,  H01L31/182 ,  Y02E10/50

Abstract: Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.

公开(公告)号：US09634178B1

公开(公告)日：2017-04-25

申请号：US14971335

申请日：2015-12-16

Applicant: Taeseok Kim ,  Robert Woehl ,  Gabriel Harley ,  Nils-Peter Harder ,  Jens-Dirk Moschner ,  Matthieu Moors ,  Michel Arsène Olivier Ngamo Toko

Inventor： Taeseok Kim ,  Robert Woehl ,  Gabriel Harley ,  Nils-Peter Harder ,  Jens-Dirk Moschner ,  Matthieu Moors ,  Michel Arsène Olivier Ngamo Toko

IPC: H01L31/18 ,  H01L31/05 ,  H01L31/054 ,  H01L31/0368 ,  H01L31/0224

CPC classification number: H01L31/022458 ,  H01L31/022441 ,  H01L31/02366 ,  H01L31/028 ,  H01L31/035281 ,  H01L31/03682 ,  H01L31/05 ,  H01L31/0516 ,  H01L31/0547 ,  H01L31/056 ,  H01L31/0745 ,  H01L31/077 ,  H01L31/1804 ,  H01L31/182 ,  Y02E10/50

Abstract: Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.

公开(公告)号：US20150318420A1

公开(公告)日：2015-11-05

申请号：US14266043

申请日：2014-04-30

Applicant: Richard Hamilton Sewell ,  Michel Arsène Olivier Ngamo Toko ,  Matthieu Moors ,  Jens Dirk Moschner

Inventor： Richard Hamilton Sewell ,  Michel Arsène Olivier Ngamo Toko ,  Matthieu Moors ,  Jens Dirk Moschner

IPC: H01L31/0224 ,  B32B37/06 ,  B32B38/00 ,  H01L31/18

CPC classification number: H01L31/18 ,  B32B37/06 ,  B32B38/004 ,  B32B2307/202 ,  B32B2307/40 ,  B32B2310/028 ,  B32B2310/0418 ,  B32B2311/12 ,  B32B2311/24 ,  B32B2457/12 ,  H01L31/022433 ,  H01L31/022441 ,  Y02E10/50

Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.

Abstract translation: 太阳能电池可以包括基板和设置在基板中或上方的半导体区域。 太阳能电池还可以包括布置在半导体区域上的导电触点，导电触点包括结合到半导体区域的导电箔。

公开(公告)号：US20150179865A1

公开(公告)日：2015-06-25

申请号：US14137918

申请日：2013-12-20

Applicant: Matthieu Moors ,  Taeseok Kim

Inventor： Matthieu Moors ,  Taeseok Kim

IPC: H01L31/18 ,  H01L31/0224

CPC classification number: H01L31/022433 ,  H01L31/022441 ,  H01L31/0682 ,  H01L31/18 ,  H01L31/186 ,  H01L31/1864 ,  Y02E10/547 ,  Y02P70/521

Abstract: A method for fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a first metal layer on the dielectric region. The method can also include forming a second metal layer on the first metal layer and locally heating a particular region of the second metal layer, where heating includes forming a metal bond between the first and second metal layer and forming a contact between the first metal layer and the solar cell structure. The method can include forming an adhesive layer on the first metal layer and forming a second metal layer on the adhesive layer, where the adhesive layer mechanically couples the second metal layer to the first metal layer and allows for an electrical connection between the second metal layer to the first metal layer.

Abstract translation: 公开了一种制造太阳能电池的方法。 该方法可以包括在太阳能电池结构的表面上形成电介质区域，并在电介质区域上形成第一金属层。 该方法还可以包括在第一金属层上形成第二金属层并局部加热第二金属层的特定区域，其中加热包括在第一和第二金属层之间形成金属键，并在第一金属层之间形成接触 和太阳能电池结构。 该方法可以包括在第一金属层上形成粘合剂层并在粘合剂层上形成第二金属层，其中粘合剂层将第二金属层机械地耦合到第一金属层，并允许第二金属层 到第一金属层。

公开(公告)号：US20170222068A1

公开(公告)日：2017-08-03

申请号：US15485840

申请日：2017-04-12

Applicant: Gabriel Harley ,  Taeseok Kim ,  Richard Hamilton Sewell ,  Michael Morse ,  David D. Smith ,  Matthieu Moors ,  Jens-Dirk Moschner

Inventor： Gabriel Harley ,  Taeseok Kim ,  Richard Hamilton Sewell ,  Michael Morse ,  David D. Smith ,  Matthieu Moors ,  Jens-Dirk Moschner

IPC: H01L31/0224 ,  H01L31/0475 ,  H01L31/028 ,  H01L31/05

CPC classification number: H01L31/02245 ,  H01L31/022441 ,  H01L31/02363 ,  H01L31/028 ,  H01L31/0475 ,  H01L31/0512 ,  H01L31/0516 ,  H01L31/0682 ,  H01L31/0745 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.

公开(公告)号：US20160380132A1

公开(公告)日：2016-12-29

申请号：US14750821

申请日：2015-06-25

Applicant: Richard Hamilton Sewell ,  David Fredric Joel Kavulak ,  Lewis Abra ,  Thomas P. Pass ,  Taeseok Kim ,  Matthieu Moors ,  Benjamin Ian Hsia ,  Gabriel Harley

Inventor： Richard Hamilton Sewell ,  David Fredric Joel Kavulak ,  Lewis Abra ,  Thomas P. Pass ,  Taeseok Kim ,  Matthieu Moors ,  Benjamin Ian Hsia ,  Gabriel Harley

IPC: H01L31/0224 ,  H01L31/0368 ,  H01L31/05 ,  H01L31/0687

Abstract: Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.

Abstract translation: 描述了制造用于太阳能电池的一维金属化的方法以及所得到的太阳能电池。 在一个示例中，太阳能电池包括具有背面和相对的光接收表面的基板。 多个交替的N型和P型半导体区域设置在基板的背面中或上方并且沿着第一方向平行，以形成用于太阳能电池的发射极区域的一维布局。 导电接触结构设置在多个交替的N型和P型半导体区域上。 导电接触结构包括对应于多个交替的N型和P型半导体区的多个金属线。 多个金属线沿着第一方向平行以形成用于太阳能电池的金属化层的一维布局。

公开(公告)号：US20160027953A1

公开(公告)日：2016-01-28

申请号：US14874254

申请日：2015-10-02

Applicant: Matthieu Moors ,  Taeseok Kim

Inventor： Matthieu Moors ,  Taeseok Kim

IPC: H01L31/18 ,  H01L31/0224

CPC classification number: H01L31/022433 ,  H01L31/022441 ,  H01L31/0682 ,  H01L31/18 ,  H01L31/186 ,  H01L31/1864 ,  Y02E10/547 ,  Y02P70/521

Abstract: A method for fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a first metal layer on the dielectric region. The method can also include forming a second metal layer on the first metal layer and locally heating a particular region of the second metal layer, where heating includes forming a metal bond between the first and second metal layer and forming a contact between the first metal layer and the solar cell structure. The method can include forming an adhesive layer on the first metal layer and forming a second metal layer on the adhesive layer, where the adhesive layer mechanically couples the second metal layer to the first metal layer and allows for an electrical connection between the second metal layer to the first metal layer.

公开(公告)号：US20170162723A1

公开(公告)日：2017-06-08

申请号：US14958739

申请日：2015-12-03

Applicant: David Fredric Joel Kavulak ,  Gabriel Harley ,  Lewis Abra ,  Matthieu Moors ,  George Nadim Mseis ,  Ludovic Pierre Edmond Hudanski

Inventor： David Fredric Joel Kavulak ,  Gabriel Harley ,  Lewis Abra ,  Matthieu Moors ,  George Nadim Mseis ,  Ludovic Pierre Edmond Hudanski

IPC: H01L31/02

CPC classification number: H01L31/02008 ,  H01L31/0508 ,  Y02E10/50

Abstract: Approaches for fabricating spot-welded and adhesive bonded interconnects for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. An interconnect structure is electrically connected to the conductive contact structure. The interconnect structure includes a plurality of protrusions in contact with the conductive contact structure. Each of the plurality of protrusions is spot-welded to the conductive contact structure and is surrounded by an adhesive material.

公开(公告)号：US20160087140A1

公开(公告)日：2016-03-24

申请号：US14495565

申请日：2014-09-24

Applicant: Seung Bum Rim ,  Matthieu Moors

Inventor： Seung Bum Rim ,  Matthieu Moors

IPC: H01L31/18 ,  C30B25/10 ,  H01L31/0236 ,  H01L31/0368 ,  H01L31/068 ,  H01L31/0224 ,  C30B25/02 ,  H01L31/0288

CPC classification number: H01L31/0682 ,  C30B25/02 ,  C30B29/06 ,  H01L31/022441 ,  H01L31/022458 ,  H01L31/02363 ,  H01L31/028 ,  H01L31/0288 ,  H01L31/03682 ,  H01L31/0745 ,  H01L31/1804 ,  H01L31/182 ,  H01L31/1892 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

Abstract: Methods of fabricating solar cells using simplified deposition processes, and the resulting solar cells, are described. In an example, a method of fabricating a solar cell involves loading a template substrate into a deposition chamber and, without removing the template substrate from the deposition chamber, performing a deposition method. The deposition method involves forming a first silicon layer on the template substrate, the first silicon layer of a first conductivity type. The deposition method also involves forming a second silicon layer on the first silicon layer, the second silicon layer of the first conductivity type. The deposition method also involves forming a third silicon layer above the second silicon layer, the third silicon layer of a second conductivity type. The deposition method also involves forming a solid state doping layer on the third silicon layer, the solid state doping layer of the first conductivity type.

Abstract translation: 描述了使用简化的沉积工艺制造太阳能电池的方法，以及所得到的太阳能电池。 在一个实例中，制造太阳能电池的方法包括将模板衬底加载到沉积室中，并且不从沉积室移除模板衬底，执行沉积方法。 沉积方法包括在模板衬底上形成第一硅层，第一导电类型的第一硅层。 沉积方法还包括在第一硅层上形成第二硅层，第二硅层为第一导电类型。 沉积方法还涉及在第二硅层上方形成第三硅层，第二导电类型的第三硅层。 沉积方法还涉及在第三硅层上形成固态掺杂层，即第一导电类型的固态掺杂层。

公开(公告)号：US09178104B2

公开(公告)日：2015-11-03

申请号：US14137918

申请日：2013-12-20

Applicant: Matthieu Moors ,  Taeseok Kim

Inventor： Matthieu Moors ,  Taeseok Kim

IPC: H01L21/00 ,  H01L31/18 ,  H01L31/0224

CPC classification number: H01L31/022433 ,  H01L31/022441 ,  H01L31/0682 ,  H01L31/18 ,  H01L31/186 ,  H01L31/1864 ,  Y02E10/547 ,  Y02P70/521

Abstract: A method for fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a first metal layer on the dielectric region. The method can also include forming a second metal layer on the first metal layer and locally heating a particular region of the second metal layer, where heating includes forming a metal bond between the first and second metal layer and forming a contact between the first metal layer and the solar cell structure. The method can include forming an adhesive layer on the first metal layer and forming a second metal layer on the adhesive layer, where the adhesive layer mechanically couples the second metal layer to the first metal layer and allows for an electrical connection between the second metal layer to the first metal layer.

Abstract translation: 公开了一种制造太阳能电池的方法。 该方法可以包括在太阳能电池结构的表面上形成电介质区域，并在电介质区域上形成第一金属层。 该方法还可以包括在第一金属层上形成第二金属层并局部加热第二金属层的特定区域，其中加热包括在第一和第二金属层之间形成金属键，并在第一金属层之间形成接触 和太阳能电池结构。 该方法可以包括在第一金属层上形成粘合剂层并在粘合剂层上形成第二金属层，其中粘合剂层将第二金属层机械地耦合到第一金属层，并允许第二金属层 到第一金属层。