公开(公告)号：US20100108891A1

公开(公告)日：2010-05-06

申请号：US12261911

申请日：2008-10-30

申请人： James Allen Cox ,  Robert Higashi

发明人： James Allen Cox ,  Robert Higashi

IPC分类号： H01L31/0352 ,  H01L21/02 ,  G01J5/20

CPC分类号： G01N21/3581 ,  G01N21/3504 ,  G02B5/0816 ,  H01S3/08059

摘要： A method includes forming a plurality of mirror periods, stacking the mirror periods, and bonding the mirror periods together to form a high reflectance mirror. At least one of the mirror periods is formed by bonding a first semiconductor layer to a first side of a film layer (where the film layer is formed on a second semiconductor layer), forming an opening through the second semiconductor layer to expose the film layer, and cutting through the first semiconductor layer, the film layer, and the second semiconductor layer. The first semiconductor layer could include a high resistivity silicon wafer, the film layer could include an oxide film, and the second semiconductor layer could include a silicon wafer. The high resistivity silicon wafer could be approximately 110 μm thick, and the silicon wafer could be approximately 125 μm thick. The opening through the second semiconductor layer could be 1.25 cm to 1.75 cm in width.

摘要翻译： 一种方法包括形成多个反射镜周期，堆叠反射镜周期，以及将反射镜周期结合在一起以形成高反射镜。 通过将第一半导体层接合到膜层的第一侧（其中膜层形成在第二半导体层上）形成反射镜周期中的至少一个，通过第二半导体层形成开口以暴露膜层 并切割穿过第一半导体层，膜层和第二半导体层。 第一半导体层可以包括高电阻率硅晶片，膜层可以包括氧化物膜，并且第二半导体层可以包括硅晶片。 高电阻率硅晶片可以是大约110μm厚，并且硅晶片可以是大约125μm厚。 通过第二半导体层的开口的宽度可以为1.25cm至1.75cm。

公开(公告)号：US20090237320A1

公开(公告)日：2009-09-24

申请号：US12052419

申请日：2008-03-20

申请人： Robert Higashi ,  Fouad Nusseibeh

发明人： Robert Higashi ,  Fouad Nusseibeh

IPC分类号： H01Q1/50 ,  H01L21/02

CPC分类号： H01Q1/36 ,  H01L23/645 ,  H01L28/10 ,  H01L28/20 ,  H01L2924/0002 ,  H01Q1/521 ,  H01L2924/00

摘要： An apparatus includes an antenna having multiple conductive portions. The apparatus also includes a transducer electrically coupling the conductive portions of the antenna. The transducer includes a first conductive path electrically coupled to one of the conductive portions and a second conductive path electrically coupled to the first conductive path and to another of the conductive portions. The first and second conductive paths at least partially overlap along at least a substantial portion of their lengths, where the overlap occurs in a direction perpendicular to a plane of the antenna portions.

摘要翻译： 一种装置包括具有多个导电部分的天线。 该装置还包括电耦合天线的导电部分的换能器。 换能器包括电耦合到导电部分之一的第一导电路径和电耦合到第一导电路径和另一个导电部分的第二导电路径。 第一和第二导电路径沿其长度的至少大部分至少部分地重叠，其中重叠发生在垂直于天线部分的平面的方向上。

公开(公告)号：US20070045129A1

公开(公告)日：2007-03-01

申请号：US11162060

申请日：2005-08-26

申请人： Yuandong Gu ,  Barrett Cole ,  Robert Higashi

发明人： Yuandong Gu ,  Barrett Cole ,  Robert Higashi

IPC分类号： G01N27/26 ,  G01F1/64

CPC分类号： G01N25/4846 ,  G01N33/004 ,  Y02A50/244

摘要： A gas sensor is provided for detecting one or more gases in a gas sample. The gas sensor includes a substrate, a solid electrolyte layer including lanthanum oxide for sensing carbon dioxide, a heating element thermally coupled to the solid electrolyte layer, and a controller coupled to the heating element and the solid electrolyte layer. The controller heats the heating element so that the solid electrolyte layer reaches an operating. Methods of sensing carbon dioxide and humidity are also disclosed.

摘要翻译： 气体传感器用于检测气体样品中的一种或多种气体。 气体传感器包括基板，包括用于感测二氧化碳的氧化镧的固体电解质层，与固体电解质层热耦合的加热元件，以及耦合到加热元件和固体电解质层的控制器。 控制器加热加热元件使得固体电解质层达到操作。 还公开了检测二氧化碳和湿度​​的方法。

公开(公告)号：US20070034676A1

公开(公告)日：2007-02-15

申请号：US11161670

申请日：2005-08-11

申请人： Chunbo Zhang ,  Robert Higashi ,  Son Lu

发明人： Chunbo Zhang ,  Robert Higashi ,  Son Lu

IPC分类号： B23K35/12 ,  B23K31/02

CPC分类号： B23K1/0016 ,  B23K1/0004 ,  B23K2101/40

摘要： Substrates such as wafers often have surface or other imperfections that can create gaps when the wafers are solder bonded together. Such substrates can be more effectively bonded together by subjecting an intervening solder layer to an electrostatic force that causes the solder layer to be pulled to fill at least some of any gaps that may exist between the substrates. When the solder cools, an improved solder bond is formed.

摘要翻译： 诸如晶片的衬底通常具有当晶片被焊接在一起时可产生间隙的表面或其它缺陷。 这样的基板可以通过使中间的焊料层受到静电力而更有效地结合在一起，该静电力使得焊料层被拉动以填充可能存在于基板之间的任何间隙中的至少一些。 当焊料冷却时，形成改进的焊料接合。

公开(公告)号：US07000452B2

公开(公告)日：2006-02-21

申请号：US10672894

申请日：2003-09-26

申请人： Ulrich Bonne ,  Robert Higashi ,  Cleopatra Cabuz

发明人： Ulrich Bonne ,  Robert Higashi ,  Cleopatra Cabuz

IPC分类号： G01N19/10

CPC分类号： G01N30/08 ,  G01N1/24 ,  G01N27/18 ,  G01N30/12 ,  G01N30/30 ,  G01N30/461 ,  G01N30/468 ,  G01N30/6095 ,  G01N30/66 ,  G01N30/88 ,  G01N33/0004 ,  G01N33/0011 ,  G01N33/22 ,  G01N35/00871 ,  G01N2030/121 ,  G01N2030/123 ,  G01N2030/3076 ,  G01N2035/00881 ,  G01N2030/3015

摘要： A micro fluid analyzer having a concentrator and separator. A strip continuous through a channel in the concentrator may provide a hot zone that may move with the flow of fluid through the channel of the concentrator to provide a concentration of heat in the flow. A pump may provide a flow to the fluid through the analyzer. Detectors may be positioned at places where the fluid may flow. A processor or controller may be connected to the strip, separator, pump and detectors. The concentrator, separator, detectors and processor may be integrated on one chip.

摘要翻译： 具有浓缩器和分离器的微流体分析器。 通过集中器中的通道连续的条带可以提供热区域，其可以随流体流动通过浓缩器的通道移动，以提供流体中的热量集中。 泵可以通过分析器向流体提供流量。 检测器可以位于流体可能流动的地方。 处理器或控制器可以连接到条带，分离器，泵和检测器。 集中器，分离器，检测器和处理器可以集成在一个芯片上。

公开(公告)号：US20050127835A1

公开(公告)日：2005-06-16

申请号：US10735531

申请日：2003-12-12

申请人： Barrett Cole ,  Robert Higashi

发明人： Barrett Cole ,  Robert Higashi

IPC分类号： G01J1/42 ,  H01J40/00

CPC分类号： G01J1/429

摘要： A light detector having a cathode wafer, a cavity wafer and an anode wafer. The cathode wafer may be bonded to one side of the cavity wafer and the anode wafer may be bonded to another side of the cavity wafer. The cathode wafer may have numerous cathodes, the anode wafer numerous anodes and the cavity wafer numerous cavities which may be aligned on a one-to-one basis to form a wafer structure of a plurality of detectors which may be diced into separable detector chips. When there is a voltage potential across a cathode and an anode, and a gas such as Ne or the like in the cavity, a reception of light such as ultra violet may result in an electronic discharge between the cathode and anode of the light detector.

摘要翻译： 具有阴极晶片，空腔晶片和阳极晶片的光检测器。 阴极晶片可以结合到空腔晶片的一侧，并且阳极晶片可以结合到空腔晶片的另一侧。 阴极晶片可以具有许多阴极，阳极晶片许多阳极和空腔晶片可以在一对一的基础上对准多个空腔，以形成可以切成可分离的检测器芯片的多个检测器的晶片结构。 当在阴极和阳极之间存在电压电势，并且在空腔中存在诸如Ne等的气体时，诸如紫外线的光的接收可能导致光检测器的阴极和阳极之间的电子放电。

公开(公告)号：US09228903B2

公开(公告)日：2016-01-05

申请号：US13548779

申请日：2012-07-13

申请人： Barrett E. Cole ,  Robert Higashi ,  Yue Liu ,  Teresa M. Marta

发明人： Barrett E. Cole ,  Robert Higashi ,  Yue Liu ,  Teresa M. Marta

IPC分类号： G01J5/20 ,  G01J5/08 ,  H04N5/33 ,  G01J5/06 ,  G01J5/00

CPC分类号： G01J5/0803 ,  G01J5/061 ,  G01J5/08 ,  G01J5/0896 ,  G01J5/20 ,  G01J2005/0077 ,  G01J2005/063 ,  H04N5/33

摘要： Devices, methods, and systems relating to infrared imager devices, methods for providing infrared imagers, methods of operating infrared imagers, and infrared imager systems are disclosed. An infrared imager system includes a number of lenses, a beam splitter, an imager array, and a thermo-optical array, wherein the beam splitter directs light to the imaging array and to the thermo-optical array.

摘要翻译： 公开了与红外成像设备相关的设备，方法和系统，用于提供红外成像器的方法，操作红外成像器的方法和红外成像器系统。 红外成像系统包括多个透镜，分束器，成像器阵列和热光阵列，其中分束器将光引导到成像阵列和热光阵列。

公开(公告)号：US08314769B2

公开(公告)日：2012-11-20

申请号：US12769097

申请日：2010-04-28

申请人： Barrett E. Cole ,  Robert Higashi

发明人： Barrett E. Cole ,  Robert Higashi

IPC分类号： G09G3/34 ,  G01J5/00

CPC分类号： G01J5/20 ,  G01J5/046 ,  G01J5/0809 ,  G01J5/0853

摘要： A pixel having a reflector situated on a substrate. A temperature sensitive resistor may be situated over at least a portion of the reflector. An insulator may be situated on the resistor. The resistor and insulator may effectively be very thin films. A flat metal mesh or grid may be situated on the insulator. The grid, insulator and resistor may be supported by two or more posts at approximately one-fourth of a wavelength from the reflector. The wavelength may be that of the radiation to be sensed by the pixel. The thermal mass of the combination of the temperature sensitive resistor, insulator and grid may be less than several times the thermal mass of the grid. Since the grid may be so thin for low noise performance and high sensitivity, the grid can have a flatness assured to a desired extent with stiffeners attached to portions of it.

摘要翻译： 具有位于基板上的反射器的像素。 温度敏感电阻器可以位于反射器的至少一部分上方。 绝缘体可以位于电阻器上。 电阻和绝缘体可能有效地是非常薄的薄膜。 平面金属网或栅格可以位于绝缘体上。 栅格，绝缘体和电阻器可以由距离反射器大约四分之一波长的两个或更多个柱支撑。 波长可以是由像素感测的辐射的波长。 温度敏感电阻，绝缘体和电网组合的热质量可能小于电网热质量的几倍。 由于栅格可能如此薄以使低噪声性能和高灵敏度，因此栅格可以具有平坦度，并将其保持在希望的程度上，并具有附着于其部分的加强件。

公开(公告)号：US20120104521A1

公开(公告)日：2012-05-03

申请号：US12915356

申请日：2010-10-29

申请人： Robert Higashi

发明人： Robert Higashi

IPC分类号： H01L29/84 ,  H01L21/3065

CPC分类号： G01L9/0042 ,  G01L9/0054

摘要： A method for etching a diaphragm pressure sensor based on a hybrid anisotropic etching process. A substrate with an epitaxial etch stop layer can be etched utilizing an etching process in order to form a diaphragm at a selective portion of the substrate. The diaphragm can be oriented at an angle (e.g., 45 degree) with respect to the substrate in order to avoid an uncertain beveled portion in a stress/strain field of the diaphragm. The diaphragm can be further etched utilizing an etch finishing process to create an anisotropic edge portion on the major areas of the diaphragm and optimize the thickness and size of the diaphragm. Such an approach provides an enhanced diaphragm structure with respect to a wide range of pressure sensor applications.

摘要翻译： 一种基于混合各向异性蚀刻工艺蚀刻隔膜压力传感器的方法。 可以利用蚀刻工艺蚀刻具有外延蚀刻停止层的衬底，以在衬底的选择性部分形成隔膜。 隔膜可以相对于基板成一定角度（例如45度），以避免隔膜的应力/应变场中的不确定的斜面部分。 可以利用蚀刻精加工进一步蚀刻隔膜，以在隔膜的主要区域上产生各向异性边缘部分，并优化隔膜的厚度和尺寸。 这种方法相对于宽范围的压力传感器应用提供了增强的膜结构。

公开(公告)号：US20070044554A1

公开(公告)日：2007-03-01

申请号：US11213556

申请日：2005-08-26

申请人： Robert Higashi ,  Ernest Satren

发明人： Robert Higashi ,  Ernest Satren

IPC分类号： H01C3/04

CPC分类号： G01F1/6845 ,  G01F1/6847 ,  H01L2224/81801 ,  Y10T29/49004

摘要： A method of thermally coupling a flow tube or like component to a thermal sensor comprises bonding the component to the thermal sensor such that thermally conductive portions formed on the component are thermally coupled to corresponding sensing/heating elements disposed on the thermal sensor. The method can be employed to form a capillary mass flow sensor system. Thermally conductive portions, such as metal bands, can be formed on the outer surface of a capillary tube for bonding with corresponding resistive heat sensing and heating elements disposed on the substrate of a micro mass flow sensor. Bonding metal pads can be formed on the sensor surface preparatory to solder bonding the tube metal bands to the resistive sensing and heating elements.

摘要翻译： 将流管或类似部件热耦合到热传感器的方法包括将部件接合到热传感器，使得形成在部件上的导热部分热耦合到布置在热传感器上的对应的感测/加热元件。 该方法可用于形成毛细管质量流量传感器系统。 可以在毛细管的外表面上形成诸如金属带的导热部分，以与布置在微质量流量传感器的基底上的相应的电阻式热感测和加热元件接合。 粘结金属焊盘可以形成在传感器表面上，准备将管金属带焊接到电阻感测和加热元件。