公开(公告)号：US08395245B2

公开(公告)日：2013-03-12

申请号：US11953967

申请日：2007-12-11

Applicant: Jong Hoon Kim ,  Min Suk Suh ,  Seong Cheol Kim ,  Seung Taek Yang ,  Seung Hyun Lee

Inventor： Jong Hoon Kim ,  Min Suk Suh ,  Seong Cheol Kim ,  Seung Taek Yang ,  Seung Hyun Lee

IPC: H01L23/495

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2225/1094 ,  H05K1/021 ,  H05K1/182 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2203/1572

Abstract: A semiconductor package module includes a circuit board including a board body having a receiving portion and conductive patterns formed on the board body; a semiconductor package received in the receiving portion and having conductive terminals electrically connected to the conductive patterns and an s semiconductor chip electrically connected to the conductive terminals; and a connection member electrically connecting the conductive patterns and the conductive terminals. In the present invention, after a receiving portion having a receiving space is formed in the board body of a circuit board and a semiconductor package is received in the receiving portion, and a connection terminal of the semiconductor package and a conductive pattern of the board body are electrically connected using a connection member, a plurality of semiconductor packages can be stacked in a single circuit board without increasing the thickness thereby significantly improving data storage capacity and data processing speed of the semiconductor package module.

Abstract translation: 一种半导体封装模块，包括：电路板，包括具有接收部分的基板主体和形成在所述基板主体上的导电图案; 接收在所述接收部分中并且具有电连接到所述导电图案的导电端子和与所述导电端子电连接的半导体芯片的半导体封装; 以及电连接导电图案和导电端子的连接构件。 在本发明中，在电路基板的基板主体中形成具有接收空间的接收部分，并且在接收部分中接收半导体封装的接收部分，以及半导体封装的连接端子和板体的导电图案 使用连接构件电连接，多个半导体封装可以堆叠在单个电路板中而不增加厚度，从而显着提高半导体封装模块的数据存储容量和数据处理速度。

公开(公告)号：US20130037893A1

公开(公告)日：2013-02-14

申请号：US13336050

申请日：2011-12-23

Applicant: Seung Hyun LEE

Inventor： Seung Hyun LEE

IPC: H01L29/82

CPC classification number: H01L43/02 ,  G11C11/161 ,  G11C11/1659 ,  G11C11/1675 ,  G11C11/5607 ,  H01L27/228 ,  H01L43/08

Abstract: A semiconductor device includes a first free layer having a magnetic direction that changes according to a direction and an amount of a first current, a first tunnel insulating layer arranged on the first free layer, a pinned layer, arranged on the first tunnel insulating layer, having a magnetic direction set to a first direction, a second tunnel insulating layer arranged on the pinned layer, and a second free layer, arranged on the second tunnel insulating layer, having a magnetic direction that changes according to a direction and an amount of a second current.

Abstract translation: 半导体器件包括：第一自由层，其具有根据第一电流的方向和量而变化的磁方向，布置在第一自由层上的第一隧道绝缘层，布置在第一隧道绝缘层上的钉扎层， 具有设置在第一方向的磁方向，布置在被钉扎层上的第二隧道绝缘层和布置在第二隧道绝缘层上的第二自由层，具有根据方向和量的变化的磁方向 第二电流。

公开(公告)号：US08361838B2

公开(公告)日：2013-01-29

申请号：US13241812

申请日：2011-09-23

Applicant: Seung Taek Yang ,  Min Suk Suh ,  Seung Hyun Lee ,  Jong Hoon Kim

Inventor： Seung Taek Yang ,  Min Suk Suh ,  Seung Hyun Lee ,  Jong Hoon Kim

IPC: H01L21/00 ,  H01L23/48

CPC classification number: H01L23/481 ,  H01L23/3128 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/05099

Abstract: A stacked semiconductor package and a method for manufacturing the same are presented which exhibit a reduced electrical resistance and an increased junction force. The semiconductor package includes at least two semiconductor chips stacked upon each other. Each semiconductor chip has a plurality of bonding pads formed on upper surfaces and has via-holes. First wiring lines are located on the upper surfaces of the semiconductor chips, on the surfaces of the via-holes, and respectively connected onto their respective bonding pads. Second wiring lines are located on lower surfaces of the semiconductor chips and on the surfaces of the respective via-holes which connect to their respective first wiring lines. The semiconductor chips are stacked so that the first wiring lines on an upper surface of an upwardly positioned semiconductor chip are respectively joined with corresponding second wiring lines formed on a lower surface of a downwardly positioned semiconductor chip.

Abstract translation: 本发明提供一种叠层半导体封装及其制造方法，其具有降低的电阻和增加的接合力。 半导体封装包括彼此堆叠的至少两个半导体芯片。 每个半导体芯片具有形成在上表面上并具有通孔的多个接合焊盘。 第一布线位于半导体芯片的上表面上，位于通孔的表面上，分别连接到它们各自的接合焊盘上。 第二布线位于半导体芯片的下表面和连接到它们各自的第一布线的相应通孔的表面上。 半导体芯片被堆叠，使得位于向上定位的半导体芯片的上表面上的第一布线分别与形成在向下定位的半导体芯片的下表面上的相应的第二布线接合。

公开(公告)号：US20130018567A1

公开(公告)日：2013-01-17

申请号：US13313073

申请日：2011-12-07

Applicant: Sang Woo LIM ,  Seung Hyun LEE ,  In Oh HWANG

Inventor： Sang Woo LIM ,  Seung Hyun LEE ,  In Oh HWANG

IPC: F02D28/00

CPC classification number: B60W50/085 ,  B60W2050/0064 ,  B60W2540/28 ,  B60W2550/20 ,  B60W2550/40 ,  B60W2550/402 ,  F02D41/021 ,  F02D41/266 ,  F02D2200/60 ,  F02D2200/70 ,  F02D2200/701 ,  F02D2200/702

Abstract: A mobile terminal to control an Electronic Control Unit (ECU) of a vehicle includes a communication unit, a storage unit, and an ECU control unit. The communication unit communicates with the ECU, and the storage unit stores information collected from the ECU and status information collected inside or outside the mobile terminal. The ECU control unit determines a driving environment of the vehicle according to the status information collected, processes the information collected from the ECU, and controls the ECU. A method for controlling a vehicle ECU from a mobile terminal includes determining a driving environment, and remotely controlling the ECU from the mobile terminal based on the driving environment.

Abstract translation: 用于控制车辆的电子控制单元（ECU）的移动终端包括通信单元，存储单元和ECU控制单元。 通信单元与ECU通信，并且存储单元存储从ECU收集的信息和在移动终端内部或外部收集的状态信息。 ECU控制单元根据收集到的状态信息来确定车辆的行驶环境，处理从ECU收集的信息，并控制ECU。 一种用于从移动终端控制车辆ECU的方法包括：根据驾驶环境确定驾驶环境，并从移动终端远程控制ECU。

公开(公告)号：US20120311103A1

公开(公告)日：2012-12-06

申请号：US13579657

申请日：2011-02-21

Applicant: Hisayuki Kunigita ,  Seung Hyun Lee ,  Ju Yeong Ji

Inventor： Hisayuki Kunigita ,  Seung Hyun Lee ,  Ju Yeong Ji

IPC: G06F15/16

CPC classification number: H04N21/6582 ,  H04L27/12 ,  H04L27/14 ,  H04L47/806 ,  H04L67/14 ,  H04N5/76 ,  H04N5/765 ,  H04N9/8205 ,  H04N21/25808 ,  H04N21/4333 ,  H04N21/4667 ,  H04N21/8455

Abstract: Provided is a content reproduction device which enables a user watching or listening to a content on a given content reproduction device to discontinue the watching thereof or listening thereto and then easily resume the watching of the same content or listening thereto from a discontinued state on another content reproduction device. When reproduction of a content is discontinued, discontinued state information indicating a reproduction state of the content at a time point of the discontinuation is transmitted to a watching/listening history management server (20) and the discontinued state information stored in the watching/listening history management server (20) is received from the watching/listening history management server (20), and the reproduction of the content is started from a state determined based on the received discontinued state information.

Abstract translation: 提供了一种内容再现装置，其使得用户能够观看或收听给定内容再现装置上的内容以停止观看或收听，然后容易地恢复观看同一内容或从停止状态收听另一内容 再现设备。 当停止内容的再现时，将停止的时间点内容的再现状态的停止状态信息发送到观看/收听历史管理服务器（20），并将该停止状态信息存储在观看/收听历史中 管理服务器（20）从观看/收听历史管理服务器（20）接收，并且从基于接收到的不连续状态信息确定的状态开始内容的再现。

公开(公告)号：US20120241987A1

公开(公告)日：2012-09-27

申请号：US13508342

申请日：2010-11-01

Applicant: Seung Hyun Lee

Inventor： Seung Hyun Lee

IPC: F24F3/14 ,  A61L9/04

CPC classification number: F24F6/043 ,  F24F3/1603 ,  F24F2003/1657 ,  F24F2006/008 ,  F24F2221/12

Abstract: The present invention relates to a personal portable humidifier-type air cleaner, comprising: a portable case; a water tank formed in the case to store a certain amount of water; an intake channel for outside air, which is connected from outside to inside the case; an air discharge channel configured in continuation of the intake channel, for discharging the inside air to outside the case via a directional exit; a fan disposed on the intake channel, for forcing the air to flow from the intake channel to the discharge channel; and a vaporization kit composed of a plurality of moisture-containing filters that is maintained in a moisture-containing condition by being arranged on the air discharge channel and connected with the water tank by a wick.

Abstract translation: 个人便携式加湿器型空气净化器技术领域本发明涉及个人便携式加湿器型空气净化器，包括：便携式外壳; 在储存一定量水的情况下形成一个水箱; 用于外部空气的进气通道，其从壳体外部连接到内部; 排气通道，其构造为连续进气通道，用于经由定向出口将内部空气排放到外部; 设置在所述进气通道上的风扇，用于迫使空气从所述进气通道流到所述排放通道; 以及由多个含水过滤器组成的汽化试剂盒，其通过布置在排气通道上并通过油绳与水箱连接而保持在含水状态。

公开(公告)号：US08097704B2

公开(公告)日：2012-01-17

申请号：US12307293

申请日：2007-05-31

Applicant: Yong Sung Kim ,  Myung Hee Kwon ,  Seung Hyun Lee ,  Kyung Jin Park ,  Hae Won Lee

Inventor： Yong Sung Kim ,  Myung Hee Kwon ,  Seung Hyun Lee ,  Kyung Jin Park ,  Hae Won Lee

IPC: C07K16/00

CPC classification number: C07K16/2878 ,  A61K2039/505 ,  C07K2317/34 ,  C07K2317/56 ,  C07K2317/565 ,  C07K2317/622 ,  C07K2317/73 ,  C07K2317/92

Abstract: The present invention provides an antibody specifically binding to death receptor 5 (DR5), which is selected from the group consisting of: an antibody comprising a heavy chain variable region (VH) having the amino acid sequences of SEQ ID NOs: 1 to 3 at complementary determining regions (CDRs) and a light chain variable region (VL) having the amino acid sequences of SEQ ID NOs: 4 to 6 at CDRs; and an antibody comprising a (VH) having the amino acid sequences of SEQ ID NOs: 7 to 9 at CDRs and a (VL) having the amino acid sequences of SEQ ID NOs: 10 to 12 at CDRs, and a composition for preventing or treating a cancer comprising the same. The antibody of the present invention can be effectively used for the prevention or treatment of various cancers, through inducing autophagic cell death of TRAIL-sensitive cancer cells as well as TRAIL-resistant cancer cells by specific binding to DR5.

Abstract translation: 本发明提供了特异性结合死亡受体5（DR5）的抗体，其选自：包含具有SEQ ID NO：1至3的氨基酸序列的重链可变区（VH）的抗体， 互补决定区（CDR）和在CDR中具有SEQ ID NO：4至6的氨基酸序列的轻链可变区（VL）; 以及抗体，其包含CDR上具有SEQ ID NO：7至9的氨基酸序列的氨基酸序列的抗体和在CDR中具有SEQ ID NO：10至12的氨基酸序列的（VL），以及用于预防或 治疗包含该癌症的癌症。 通过特异性结合DR5，本发明的抗体可以通过诱导TRAIL敏感性癌细胞的自噬细胞死亡以及抗TRAIL抗性癌细胞，有效地用于预防或治疗各种癌症。

公开(公告)号：US08018043B2

公开(公告)日：2011-09-13

申请号：US12261112

申请日：2008-10-30

Applicant: Min Suk Suh ,  Seung Taek Yang ,  Seung Hyun Lee ,  Jong Hoon Kim

Inventor： Min Suk Suh ,  Seung Taek Yang ,  Seung Hyun Lee ,  Jong Hoon Kim

IPC: H01L23/48

CPC classification number: H01L23/4334 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/19 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15311

Abstract: A semiconductor package includes a semiconductor chip having an upper surface, side surfaces connected with the upper surface, and bonding pads formed on the upper surface. A first insulation layer pattern is formed to cover the upper surface and the side surfaces of the semiconductor chip and expose the bonding pads. Re-distribution lines are placed on the first insulation layer pattern and include first re-distribution line parts and second re-distribution line parts. The first re-distribution line parts have an end connected with the bonding pads and correspond to the upper surface of the semiconductor chip and the second re-distribution line parts extend from the first re-distribution line parts beyond the side surfaces of the semiconductor chip. A second insulation layer pattern is formed over the semiconductor chip and exposes portions of the first re-distribution line parts and the second re-distribution line parts.

Abstract translation: 半导体封装包括具有上表面的半导体芯片，与上表面连接的侧表面，以及形成在上表面上的焊盘。 形成第一绝缘层图案以覆盖半导体芯片的上表面和侧表面并且暴露接合焊盘。 再分配线路放置在第一绝缘层图案上，并且包括第一再分配线部分和第二再分配线部分。 第一再分配线部分具有与接合焊盘连接的端部并且对应于半导体芯片的上表面，并且第二再分配线部分从第一再分配线部分延伸超过半导体芯片的侧表面 。 在半导体芯片上形成第二绝缘层图案，并且暴露出第一再分配线部分和第二再分配线部分的部分。

公开(公告)号：US20110196918A1

公开(公告)日：2011-08-11

申请号：US13060369

申请日：2009-08-06

Applicant: Hisayuki Kkunigita ,  Seung-Hyun Lee ,  Taek-Joo Lee ,  Ju-Yeong Ji

Inventor： Hisayuki Kkunigita ,  Seung-Hyun Lee ,  Taek-Joo Lee ,  Ju-Yeong Ji

IPC: G06F15/16

CPC classification number: H04N7/173 ,  H04N5/76 ,  H04N21/242 ,  H04N21/4788

Abstract: The time in the host device and the time in the client device are synchronized. The host device and the client device download content data from a content distribution server using progressive downloading. The host device controls playback processes in the host device and the client device so as to be synchronized, in accordance with a download status in the host device and the client device.

Abstract translation: 主机设备中的时间和客户端设备中的时间同步。 主机设备和客户设备使用逐行下载从内容分发服务器下载内容数据。 主机设备根据主机设备和客户端设备中的下载状态来控制主机设备和客户端设备中的重放过程以便被同步。

公开(公告)号：US07982831B2

公开(公告)日：2011-07-19

申请号：US12623101

申请日：2009-11-20

Applicant: Jeong-Hyun Kim ,  Myoung Ho Lee ,  Min Joo Kim ,  Se Jong Shin ,  Bong Chul Kim ,  Seung Hyun Lee ,  Kyo Yong Koo ,  Hyeon Jin Seo

Inventor： Jeong-Hyun Kim ,  Myoung Ho Lee ,  Min Joo Kim ,  Se Jong Shin ,  Bong Chul Kim ,  Seung Hyun Lee ,  Kyo Yong Koo ,  Hyeon Jin Seo

IPC: G02F1/1339

CPC classification number: G02F1/13392 ,  G02F2202/28

Abstract: A liquid crystal display (LCD) device and its fabrication method are disclosed. Specifically, a fabrication method in which polyhedral spacers are implemented on a substrate through an ink jet method are used for an LCD device. The spacers have the polyhedral shape to increase their contact area with two substrates, and include a surface processed layer for strengthening a bonding force in its bonding with an alignment film formed on the two substrates. The spacers have a polyhedral shape for maintaining the cell gap between the substrates.

Abstract translation: 公开了液晶显示（LCD）装置及其制造方法。 具体地说，在液晶显示装置中使用了通过喷墨法在基板上实现多面体间隔物的制造方法。 间隔物具有多面体形状以增加其与两个基板的接触面积，并且包括用于加强与形成在两个基板上的取向膜的接合中的结合力的表面处理层。 间隔物具有多面体形状，用于保持基板之间的单元间隙。