公开(公告)号：US07667237B2

公开(公告)日：2010-02-23

申请号：US12478456

申请日：2009-06-04

Applicant: Shiro Sakai ,  Jin-Ping Ao ,  Yasuo Ono

Inventor： Shiro Sakai ,  Jin-Ping Ao ,  Yasuo Ono

IPC: H01L33/00

CPC classification number: H01L27/156 ,  H01L27/15 ,  H01L27/153 ,  H01L33/08 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/62 ,  H01L2224/24

Abstract: A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED arrays are connected to electrodes (32) in inverse parallel. Air-bridge wiring (28) is formed between the LEDs (1) and between the LEDs (1) and electrodes (32). The LED arrays are arranged zigzag to form a plurality of LEDs (1) to produce a high drive voltage and a small drive current. Two LED arrays are connected in inverse parallel, and therefore an AC power supply can be used as the power supply.

公开(公告)号：US07569861B2

公开(公告)日：2009-08-04

申请号：US12352271

申请日：2009-01-12

Applicant: Shiro Sakai ,  Jin-Ping Ao ,  Yasuo Ono

Inventor： Shiro Sakai ,  Jin-Ping Ao ,  Yasuo Ono

IPC: H01L33/00 ,  H01L31/12

CPC classification number: H01L27/156 ,  H01L27/15 ,  H01L27/153 ,  H01L33/08 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/62 ,  H01L2224/24

Abstract: A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED arrays are connected to electrodes (32) in inverse parallel. Air-bridge wiring (28) is formed between the LEDs (1) and between the LEDs (1) and electrodes (32). The LED arrays are arranged zigzag to form a plurality of LEDs (1) to produce a high drive voltage and a small drive current. Two LED arrays are connected in inverse parallel, and therefore an AC power supply can be used as the power supply.

Abstract translation: 在高驱动电压和小驱动电流下工作的发光装置。 LED（1）二次形成在例如蓝宝石的绝缘基板（10）上，并且串联连接以形成LED阵列。 两个这样的LED阵列反向并联连接到电极（32）。 在LED（1）之间以及LED（1）和电极（32）之间形成空气桥接线（28）。 LED阵列以Z字形排列以形成多个LED（1）以产生高驱动电压和小的驱动电流。 两个LED阵列相反并联连接，因此可以使用交流电源作为电源。

公开(公告)号：US20070138500A1

公开(公告)日：2007-06-21

申请号：US11705205

申请日：2007-02-12

Applicant: Shiro Sakai ,  Jin-Ping Ao ,  Yasuo Ono

Inventor： Shiro Sakai ,  Jin-Ping Ao ,  Yasuo Ono

IPC: H01L33/00

CPC classification number: H01L27/156 ,  H01L27/15 ,  H01L27/153 ,  H01L33/08 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/62 ,  H01L2224/24

Abstract: A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED arrays are connected to electrodes (32) in inverse parallel. Air-bridge wiring (28) is formed between the LEDs (1) and between the LEDs (1) and electrodes (32). The LED arrays are arranged zigzag to form a plurality of LEDs (1) to produce a high drive voltage and a small drive current. Two LED arrays are connected in inverse parallel, and therefore an AC power supply can be used as the power supply.

Abstract translation: 在高驱动电压和小驱动电流下工作的发光装置。 LED（1）二次形成在例如蓝宝石的绝缘基板（10）上，并且串联连接以形成LED阵列。 两个这样的LED阵列反向并联连接到电极（32）。 在LED（1）之间以及LED（1）和电极（32）之间形成空气桥接线（28）。 LED阵列以Z字形排列以形成多个LED（1）以产生高驱动电压和小的驱动电流。 两个LED阵列相反并联连接，因此可以使用交流电源作为电源。

公开(公告)号：US20070075046A1

公开(公告)日：2007-04-05

申请号：US11521504

申请日：2006-09-15

Applicant: Hisaya Nakamura ,  Masakazu Harada ,  Shiro Sakai ,  Takaya Kondo ,  Tomohiro Shimada

Inventor： Hisaya Nakamura ,  Masakazu Harada ,  Shiro Sakai ,  Takaya Kondo ,  Tomohiro Shimada

IPC: H01H33/66

CPC classification number: C10M169/00 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/062 ,  C10M2201/145 ,  C10M2203/1025 ,  C10M2203/1065 ,  C10M2205/0206 ,  C10M2207/0406 ,  C10M2207/1265 ,  C10M2207/2825 ,  C10M2207/2835 ,  C10M2209/1033 ,  C10M2215/1026 ,  C10N2210/01 ,  C10N2210/02 ,  C10N2210/03 ,  C10N2220/082 ,  C10N2240/202 ,  C10N2250/10

Abstract: This method for inhibiting damage due to arc between electrical contacts involves the spreading of a grease composed of from 70% by weight to 95% by weight of a base oil and from 5% by weight to 30% by weight of a thickening agent and additives over a pair of electrical contacts in a circuit which causes terminals to move relative to each other so that they are disconnected from each other, whereby damage on the contact area due to arc occurring when the electrical contacts are isolated from each other is inhibited. As the thickening agent there is preferably used an organic bentonite. As the base oil there is preferably sued an ester oil, glycol oil or poly-α-olefin. The base oil preferably has a low density to reduce arc energy.

Abstract translation: 用于抑制由电触点之间的电弧引起的损伤的方法涉及由70重量％至95重量％的基础油和5重量％至30重量％的增稠剂和添加剂 在电路中的一对电触点之间，导致端子相对于彼此移动，使得它们彼此断开，从而抑制当电触点彼此隔离时由于电弧而导致的接触区域的损坏。 作为增稠剂，优选使用有机膨润土。 作为基础油，优选起始酯油，乙二醇油或聚-α-烯烃。 基础油优选具有低密度以减少电弧能量。

公开(公告)号：US20150276475A1

公开(公告)日：2015-10-01

申请号：US14678557

申请日：2015-04-03

Applicant: Shiro SAKAI ,  Seoul Viosys Co., Ltd.

Inventor： Shiro SAKAI ,  Won Chul SEO ,  Dae Won KIM

IPC: G01J3/02 ,  G01J3/42

CPC classification number: G01J3/0235 ,  B82Y20/00 ,  G01J3/02 ,  G01J3/0205 ,  G01J3/0259 ,  G01J3/36 ,  G01J3/42 ,  G01J2003/1213

Abstract: A spectrum detector includes a substrate, a photodetector formed on the substrate and including a semiconductor having a plurality of convex portions, and a wavelength detection circuit for detecting a wavelength of light transmitted through the plurality of convex portions. Each photodetector comprises different convex portions different from one another with respect to at least one of size, pitch, and height. The photodetectors have a relationship expressed by formula L·m=λ·cos θ/(2n), wherein L is a diameter of each convex portion, n is a refractive index between the air and each convex portion of the GaN layer, m is an integer or a reciprocal of an integer, λ is a wavelength of light transmitted through the plurality of convex portions of each photodetector, and θ is an incident angle of the light with respect to a surface of the p-GaN layer.

Abstract translation: 光谱检测器包括基板，形成在基板上的包括具有多个凸部的半导体的光电检测器和用于检测透过多个凸部的光的波长的波长检测电路。 每个光电检测器包括相对于尺寸，间距和高度中的至少一个而彼此不同的不同凸部。 光电检测器具有由公式L·m =λ·cosθ/（2n）表示的关系，其中L是每个凸部的直径，n是空气与GaN层的每个凸部之间的折射率，m 是整数的整数或倒数，λ是透过各光电检测器的多个凸部的光的波长， 是相对于p-GaN层的表面的光的入射角。

公开(公告)号：US08957426B2

公开(公告)日：2015-02-17

申请号：US13985201

申请日：2011-05-17

Applicant: Shiro Sakai

Inventor： Shiro Sakai

IPC: H01L29/15 ,  H01L21/36 ,  H01L29/267 ,  H01L21/02 ,  H01L33/00 ,  H01L33/12 ,  H01L29/16 ,  H01L33/32

CPC classification number: H01L29/267 ,  H01L21/0237 ,  H01L21/02439 ,  H01L21/02458 ,  H01L21/02494 ,  H01L21/02502 ,  H01L21/02505 ,  H01L21/02521 ,  H01L21/0254 ,  H01L21/0262 ,  H01L29/1608 ,  H01L33/007 ,  H01L33/12 ,  H01L33/32

Abstract: Embodiments of the invention provide a crystalline aluminum carbide layer, a laminate substrate having the crystalline aluminum carbide layer formed thereon, and a method of fabricating the same. The laminate substrate has a GaN layer including a GaN crystal and an AlC layer including an AlC crystal. Further, the method of fabricating the laminate substrate, which has the AlN layer including the AlN crystal and the AlC layer including the AlC crystal, includes supplying a carbon containing gas and an aluminum containing gas to grow the AlC layer.

Abstract translation: 本发明的实施方案提供一种结晶碳化铝层，其上形成有结晶碳化铝层的层压基板及其制造方法。 层压基板具有包括GaN晶体的GaN层和包括AlC晶体的AlC层。 此外，具有包含AlN晶体的AlN层和包含AlC晶体的AlC层的层压基板的制造方法包括供给含碳气体和含铝气体以生长AlC层。

公开(公告)号：US08735911B2

公开(公告)日：2014-05-27

申请号：US13610819

申请日：2012-09-11

Applicant: Shiro Sakai ,  Jin-Ping Ao ,  Yasuo Ono

Inventor： Shiro Sakai ,  Jin-Ping Ao ,  Yasuo Ono

IPC: H01L27/15

CPC classification number: H01L27/156 ,  H01L27/15 ,  H01L27/153 ,  H01L33/08 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/62 ,  H01L2224/24

Abstract: A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED arrays are connected to electrodes (32) in inverse parallel. Air-bridge wiring (28) is formed between the LEDs (1) and between the LEDs (1) and electrodes (32). The LED arrays are arranged zigzag to form a plurality of LEDs (1) to produce a high drive voltage and a small drive current. Two LED arrays are connected in inverse parallel, and therefore an AC power supply can be used as the power supply.

Abstract translation: 在高驱动电压和小驱动电流下工作的发光装置。 LED（1）二次形成在例如蓝宝石的绝缘基板（10）上，并且串联连接以形成LED阵列。 两个这样的LED阵列反向并联连接到电极（32）。 在LED（1）之间以及LED（1）和电极（32）之间形成空气桥接线（28）。 LED阵列以Z字形排列以形成多个LED（1）以产生高驱动电压和小的驱动电流。 两个LED阵列相反并联连接，因此可以使用交流电源作为电源。

公开(公告)号：US08680533B2

公开(公告)日：2014-03-25

申请号：US12652518

申请日：2010-01-05

Applicant: Shiro Sakai ,  Jin-Ping Ao ,  Yasuo Ono

Inventor： Shiro Sakai ,  Jin-Ping Ao ,  Yasuo Ono

IPC: H01L23/00

CPC classification number: H01L27/156 ,  H01L27/15 ,  H01L27/153 ,  H01L33/08 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/62 ,  H01L2224/24

Abstract: A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED arrays are connected to electrodes (32) in inverse parallel. Air-bridge wiring (28) is formed between the LEDs (1) and between the LEDs (1) and electrodes (32). The LED arrays are arranged zigzag to form a plurality of LEDs (1) to produce a high drive voltage and a small drive current. Two LED arrays are connected in inverse parallel, and therefore an AC power supply can be used as the power supply.

Abstract translation: 在高驱动电压和小驱动电流下工作的发光装置。 LED（1）二次形成在例如蓝宝石的绝缘基板（10）上，并且串联连接以形成LED阵列。 两个这样的LED阵列反向并联连接到电极（32）。 在LED（1）之间以及LED（1）和电极（32）之间形成空气桥接线（28）。 LED阵列以Z字形排列以形成多个LED（1）以产生高驱动电压和小的驱动电流。 两个LED阵列相反并联连接，因此可以使用交流电源作为电源。

公开(公告)号：US20130003377A1

公开(公告)日：2013-01-03

申请号：US13610819

申请日：2012-09-11

Applicant: Shiro SAKAI ,  Jin-Ping AO ,  Yasuo ONO

Inventor： Shiro SAKAI ,  Jin-Ping AO ,  Yasuo ONO

IPC: F21V21/00

CPC classification number: H01L27/156 ,  H01L27/15 ,  H01L27/153 ,  H01L33/08 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/62 ,  H01L2224/24

Abstract: A light-emitting device operating on a high drive voltage and a small drive current. LEDs (1) are two-dimensionally formed on an insulating substrate (10) of e.g., sapphire monolithically and connected in series to form an LED array. Two such LED arrays are connected to electrodes (32) in inverse parallel. Air-bridge wiring (28) is formed between the LEDs (1) and between the LEDs (1) and electrodes (32). The LED arrays are arranged zigzag to form a plurality of LEDs (1) to produce a high drive voltage and a small drive current. Two LED arrays are connected in inverse parallel, and therefore an AC power supply can be used as the power supply.

公开(公告)号：US08294183B2

公开(公告)日：2012-10-23

申请号：US12650276

申请日：2009-12-30

Applicant: Shiro Sakai

Inventor： Shiro Sakai

IPC: H01L21/02 ,  H01L29/66 ,  H01L21/00

CPC classification number: H01L21/02502 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/02491 ,  H01L21/0254 ,  H01L21/0265 ,  H01L21/02664 ,  H01L33/007

Abstract: The present invention provides a fabrication method of a semiconductor substrate, by which a planar GaN substrate that is easily separated can be fabricated on a heterogeneous substrate, and a semiconductor device which is fabricated using the GaN substrate. The semiconductor substrate comprises a substrate, a first semiconductor layer arranged on the substrate, a metallic material layer arranged on the first semiconductor layer, a second semiconductor layer arranged on the first semiconductor layer and the metallic material layer, and voids formed in the first semiconductor layer under the metallic material layer.

Abstract translation: 本发明提供了一种半导体衬底的制造方法，通过该方法可以在非均匀衬底上制造容易分离的平面GaN衬底，以及使用该GaN衬底制造的半导体器件。 半导体衬底包括衬底，布置在衬底上的第一半导体层，布置在第一半导体层上的金属材料层，布置在第一半导体层和金属材料层上的第二半导体层，以及形成在第一半导体中的空隙 在金属材料层下面。